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AMD XC3S1600E-4FGG484C
- Part No.:
- XC3S1600E-4FGG484C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S1600E-4FGG484C.pdf
- Description:
- IC FPGA 376 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,434
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Product details
Overview
XC3S1600E-4FGG484C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 128 KB of total block RAM, and a maximum system clock frequency of 375 MHz. It features 376 user I/O pins in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package and supports LVCMOS, LVTTL, PCI, and SSTL I/O standards. It is used in industrial control logic, digital video interfaces, and embedded reconfigurable computing systems.
For engineers reviewing the XC3S1600E-4FGG484C datasheet, pinout, applications, or equivalent options, key selection considerations include logic capacity, I/O voltage compatibility, block RAM depth, global clock resource count, and supported configuration modes (Master Serial, Slave SelectMAP, JTAG).
Technical Context
The XC3S1600E-4FGG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It includes eight global clock networks and supports configuration via external PROM, processor, or JTAG boundary-scan interface.
It integrates 22 dedicated digital clock managers (DCMs) for phase alignment, duty-cycle correction, and frequency synthesis. The device supports SelectIO standards up to 3.3 V and provides programmable slew rate and drive strength per I/O bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584 - determines maximum combinational/sequential logic density for custom digital functions |
| Block RAM | 128 KB - enables on-chip buffering for video frame stores, FIFOs, or lookup tables |
| Max System Clock | 375 MHz - defines highest synchronous operation frequency for timing-critical state machines |
| User I/O Pins | 376 - supports high-pin-count parallel interfaces such as RGB video, memory buses, or sensor arrays |
| DCMs | 22 - provides independent clock domain management for multi-clock system partitioning |
| I/O Standards | LVCMOS, LVTTL, PCI, SSTL - allows direct interfacing with legacy microcontrollers, SDRAM, and peripheral ICs |
| Configuration Modes | Master Serial, Slave SelectMAP, JTAG - enables flexible programming during development and in-system updates |
Pinout & Package
Package: 484-pin Fine-Pitch Ball Grid Array (FBGA), 23×23 mm, 0.8 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain output signaling successful configuration completion to system controller |
| H2 | INIT_B | Active-low open-drain status signal indicating FPGA initialization state |
| J1 | PROGRAM_B | Active-low input initiating full reconfiguration and clearing configuration memory |
| K2 | TCK | JTAG test clock input for boundary-scan and debug access |
| L1 | TMS | JTAG test mode select controlling TAP controller state transitions |
| M2 | TDO | JTAG test data output carrying serial response from boundary-scan register |
| N1 | TDI | JTAG test data input shifting instructions and test data into device |
| P2 | CCLK | Configuration clock output driving external PROM or master serial mode |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | 32 × 18-bit hard multipliers enable real-time DSP filtering without consuming logic resources |
| SelectIO Technology | Per-bank I/O voltage support (1.2 V to 3.3 V) allows mixed-voltage board design with no level shifters |
| Digital Clock Managers (DCMs) | 22 DCMs provide jitter-free clock synthesis, phase shifting, and frequency multiplication for multi-domain timing |
| Configurable I/O Drive Strength | Programmable 2/4/6/8/12/16 mA drive per pin reduces EMI and improves signal integrity on long traces |
| Embedded Block RAM | 128 KB distributed across 64 blocks (2 KB each) supports dual-port access for simultaneous read/write operations |
Applications
| Industrial Motion Control | Digital Video Interface |
|---|---|
Use Scenario: Real-time closed-loop servo positioning using encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements PID controller, quadrature decoder, and 16-channel PWM generator with deterministic sub-microsecond latency. Use Value: XC3S1600E-4FGG484C delivers cycle-accurate timing control and parallel I/O handling for synchronized axis coordination. | Use Scenario: HDMI transmitter interface bridging FPGA-based image processing pipeline to display hardware. IC Role / Device Role / Timing Role: XC3S1600E-4FGG484C manages pixel clock recovery, TMDS encoding, and HDCP key management logic. Use Value: Integrated DCMs stabilize pixel clock at 74.25 MHz and 148.5 MHz; 376 I/O pins route parallel RGB + sync signals and serial control bus. |
| Reconfigurable Data Acquisition | Communications Protocol Gateway |
Use Scenario: Modular sensor node aggregating analog, digital, and serial sensor inputs for edge preprocessing. IC Role / Device Role / Timing Role: XC3S1600E-4FGG484C hosts ADC interface logic, FIR filter kernels, and SPI/I²C masters for sensor communication. Use Value: 128 KB block RAM buffers multi-channel sampled data; 22 DCMs synchronize sampling clocks across heterogeneous sensors. | Use Scenario: Fieldbus protocol translation between Modbus RTU (RS-485) and EtherNet/IP over industrial Ethernet. IC Role / Device Role / Timing Role: XC3S1600E-4FGG484C implements dual MAC controllers, protocol stack state machines, and packet buffer management. Use Value: 376 I/O pins support dual PHY interfaces; embedded RAM stores protocol descriptors and frame buffers for deterministic latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | 1,092 logic cells, 96 KB block RAM, 456-pin FBGA - lower density and I/O count | Suitable for smaller control logic or single-interface video applications with reduced resource demand | Select when design fits within 70% of XC3S1600E-4FGG484C logic and memory resources to reduce cost and power |
| XC3S2000-4FGG484C | 2,160 logic cells, 192 KB block RAM, same 484-pin FBGA footprint - higher density and memory | Required for complex multi-channel video processing or dual-protocol gateways with large descriptor tables | Choose when XC3S1600E-4FGG484C resource utilization exceeds 90% in synthesis reports |
Compared with XC3S1000-4FGG456C, XC3S1600E-4FGG484C offers 45% more logic and 33% more RAM in identical package size; versus XC3S2000-4FGG484C, it trades 27% logic density for lower static power and reduced tool licensing cost while retaining full pin compatibility.
Availability
XC3S1600E-4FGG484C is available at Aetrix Electronics and suitable for industrial motion control, digital video interface, and reconfigurable data acquisition requiring stable component supply and long-term production continuity.
Supply support for XC3S1600E-4FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-3E product line for legacy industrial and aerospace applications.
The Spartan-3E family was designed for cost-sensitive, high-volume embedded systems requiring moderate logic density, low-power operation, and broad I/O standard support.
FAQ
What is the maximum operating temperature range for XC3S1600E-4FGG484C?
The XC3S1600E-4FGG484C is rated for commercial temperature range (0°C to +85°C). This specification applies to the -4 speed grade and FG484 package variant. Thermal derating is not required within this ambient range under typical PCB layout and airflow conditions. The device does not support industrial (-40°C to +100°C) or extended temperature grades.
Does XC3S1600E-4FGG484C support JTAG boundary-scan testing?
Yes, XC3S1600E-4FGG484C fully supports IEEE 1149.1 JTAG boundary-scan testing. Pins TCK, TMS, TDI, and TDO are dedicated for this function and operate at 3.3 V LVTTL levels. JTAG is used for configuration, debugging, and in-system verification without requiring additional test fixtures or probe points.
How many global clock lines does XC3S1600E-4FGG484C provide?
XC3S1600E-4FGG484C provides eight global clock routing networks. These low-skew, high-fanout lines distribute clock signals across the entire FPGA fabric with guaranteed timing performance. Each network connects to all CLBs and I/O banks, enabling synchronous design across large logic partitions without manual clock tree insertion.
Can XC3S1600E-4FGG484C be configured via SPI flash memory?
No, XC3S1600E-4FGG484C does not support native SPI flash configuration. It requires Master Serial mode using XCFxx Platform Flash PROMs with serial configuration interface, or Slave SelectMAP mode with parallel PROM/Flash. External microcontrollers must implement the proper bitstream loading sequence defined in UG332.
What is the configuration memory size required for XC3S1600E-4FGG484C?
The uncompressed configuration bitstream for XC3S1600E-4FGG484C is approximately 2.8 Mbits. When using compressed bitstream mode (supported by iMPACT and Vivado tools), the required storage drops to ~1.4 Mbits. XCF04S (4 Mbit) or XCF08P (8 Mbit) Platform Flash PROMs are commonly selected to accommodate margin and future revisions.
XC3S1600E-4FGG484C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3688
- Number of Logic Elements/Cells:
- 33192
- Total RAM Bits:
- 663552
- Number of I/O:
- 376
- Number of Gates:
- 1600000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S1600E-4FGG484C FAQ
1.How can I place an order for XC3S1600E-4FGG484C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1600E-4FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1600E-4FGG484C reliable?
The price and inventory of XC3S1600E-4FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-4FGG484C is usually 5 days.
3.What payment methods are accepted for XC3S1600E-4FGG484C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-4FGG484C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1600E-4FGG484C?
XC3S1600E-4FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1600E-4FGG484C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1600E-4FGG484C?
For technical support, including XC3S1600E-4FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-4FGG484C requirements.
6.How does Aetrix verify that XC3S1600E-4FGG484C is sourced from the original manufacturer or authorized distributors?
All XC3S1600E-4FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-4FGG484C meets industry standards.
7.What is the process for return or replacement of XC3S1600E-4FGG484C?
All XC3S1600E-4FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-4FGG484C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1600E-4FGG484C part is unused and in its original packaging.
Return procedure for XC3S1600E-4FGG484C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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