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AMD XC3S1600E-4FGG484I
- Part No.:
- XC3S1600E-4FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC3S1600E-4FGG484I.pdf
- Description:
- IC FPGA 376 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,239
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Product details
Overview
XC3S1600E-4FGG484I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 128 KB of total block RAM, and operates at -4 speed grade (tPD = 4.5 ns). It features 376 user I/Os in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S1600E-4FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, block RAM depth, global clock routing capability, differential signaling support (LVDS/LVPECL), and JTAG configuration compliance.
Technical Context
The XC3S1600E-4FGG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ technology for single-ended (LVTTL, LVCMOS) and differential (LVDS, LVPECL) I/O standards across all banks.
Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan. The device includes internal digital clock managers (DCMs) providing phase shifting, frequency synthesis, and duty cycle correction for up to four independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584 - provides combinational and sequential logic capacity for medium-complexity control and glue logic functions |
| Block RAM | 128 KB - supports FIFOs, data buffering, and small lookup tables without external memory |
| User I/O Pins | 376 - enables high-density peripheral interfacing including parallel buses and multiple serial links |
| Speed Grade | -4 - guarantees maximum clock frequency of 333 MHz for CLB logic and 280 MHz for I/O registers |
| DCM Units | 4 - allows independent clock domain management with jitter reduction and phase alignment |
| I/O Standards | LVTTL, LVCMOS, LVDS, LVPECL - supports mixed-voltage system integration and high-speed differential signaling |
Pinout & Package
XC3S1600E-4FGG484I is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23 × 23 mm body size, 1.0 mm ball pitch, and standard JEDEC MO-251AC footprint. Thermal pad is not present; mounting requires standard reflow profile for Pb-free assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion |
| H2 | INIT_B | Active-low bidirectional initialization and reconfiguration control |
| J1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| K2 | TCK | JTAG test clock input for boundary-scan and debug access |
| L1 | TMS | JTAG test mode select controlling state machine transitions |
| M2 | TDO | JTAG test data output for serial readback and verification |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | 4 × 18-bit multipliers enable real-time arithmetic for motor control and sensor fusion without LUT overhead |
| SelectIO™ Technology | Per-bank voltage support (1.2 V to 3.3 V) allows direct interfacing with legacy and modern peripherals |
| Digital Clock Manager (DCM) | Input jitter tolerance < 50 ps and ±1% duty cycle correction stabilize timing-critical interfaces like DDR SDRAM |
| Configurable I/O Standards | Single-ended and differential signaling on same bank simplifies PCB routing for mixed-signal systems |
Applications
| Industrial PLC I/O Expansion | Video Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O and analog input channels to legacy programmable logic controllers. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and real-time I/O scheduler with deterministic response under 10 µs. Use Value: Replaces discrete glue logic and microcontroller-based bridges while supporting hot-swap detection and watchdog supervision. | Use Scenario: Converting parallel RGB video from image sensors to serialized MIPI D-PHY output for mobile displays. IC Role / Device Role / Timing Role: Timing-critical pixel clock domain crossing and serialization using built-in LVDS transmitters. Use Value: Eliminates external serializer ICs and reduces board area by 40% compared to ASIC-based solutions. |
| Medical Diagnostic Data Acquisition | Automotive Body Control Module |
Use Scenario: Aggregating synchronized ADC streams from ultrasound front-end channels into a unified AXI-Stream interface. IC Role / Device Role / Timing Role: High-throughput data concentrator with on-chip FIFO buffering and DMA handshaking. Use Value: Enables 12-bit @ 40 MSPS acquisition across 8 channels without external memory bottleneck. | Use Scenario: Managing LIN bus gateways, LED driver sequencing, and door lock actuator PWM control in entry-level vehicles. IC Role / Device Role / Timing Role: Real-time state machine executor with fault-safe I/O monitoring and fail-deadline enforcement. Use Value: Reduces BOM count by consolidating three microcontrollers and associated level shifters into one configurable device. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1000-4FGG456C | Lower logic density (1,000 cells), 96 KB block RAM, 360 user I/Os, commercial temperature grade | Suitable for less complex control tasks; lacks sufficient RAM for dual-port FIFOs > 64 KB | Choose when thermal budget limits industrial-grade operation and design fits within reduced resource ceiling |
| XC3S2000-4FGG484I | Higher logic density (2,000 cells), 192 KB block RAM, same pinout and speed grade | Supports larger state machines and deeper pipeline stages; compatible with same PCB layout | Select when future firmware expansion or added protocol stacks require headroom beyond XC3S1600E-4FGG484I capacity |
Compared with XC3S1600E-4FGG484I, the XC3S1000-4FGG456C offers lower cost but constrains memory-intensive buffering, while the XC3S2000-4FGG484I delivers scalable logic headroom with identical thermal and mechanical integration-enabling incremental upgrades without redesign.
Availability
XC3S1600E-4FGG484I is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and automotive body electronics requiring stable component supply over extended production lifecycles.
Supply support for XC3S1600E-4FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains full support for the Spartan-3E product family. Xilinx pioneered FPGA architecture for cost-optimized embedded systems before the acquisition.
The Spartan-3E family was designed specifically for high-volume, price-sensitive applications requiring reliable I/O flexibility and moderate logic density-especially where long-term availability and mature toolchain support are critical.
FAQ
What is the maximum operating junction temperature for XC3S1600E-4FGG484I?
The XC3S1600E-4FGG484I has a specified maximum junction temperature of 100°C under industrial temperature grade (-40°C to +100°C ambient). This rating is validated per JEDEC JESD22-A104 and applies when using recommended PCB copper pour and airflow per Xilinx UG331.
Does XC3S1600E-4FGG484I support partial reconfiguration?
No, XC3S1600E-4FGG484I does not support partial reconfiguration. The Spartan-3E architecture only permits full configuration reload via JTAG or master serial mode. Partial reconfiguration requires Virtex or later-generation FPGA families with dedicated configuration logic.
Which configuration modes are supported by XC3S1600E-4FGG484I?
XC3S1600E-4FGG484I supports Master Serial, Slave Serial, JTAG, and Boundary Scan configuration modes. Master Serial uses an external PROM; Slave Serial accepts configuration data from a microcontroller; JTAG enables programming and debugging without external memory.
Can XC3S1600E-4FGG484I drive 3.3 V LVTTL loads directly?
Yes, XC3S1600E-4FGG484I can drive 3.3 V LVTTL loads directly when configured for LVTTL I/O standard and powered with VCCO = 3.3 V in the corresponding I/O bank. Output drive strength is programmable up to 24 mA per pin, compliant with LVTTL voltage thresholds.
Is there a migration path from XC3S1600E-4FGG484I to newer AMD FPGA families?
Yes, AMD provides migration guidance from Spartan-3E to Artix-7 via the Xilinx Migration Advisory. While not pin-compatible, Artix-7 offers higher logic density, integrated transceivers, and UltraScale+ toolchain compatibility-requiring HDL and constraints file updates but preserving core IP functionality in XC3S1600E-4FGG484I designs.
XC3S1600E-4FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3688
- Number of Logic Elements/Cells:
- 33192
- Total RAM Bits:
- 663552
- Number of I/O:
- 376
- Number of Gates:
- 1600000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC3S1600E-4FGG484I FAQ
1.How can I place an order for XC3S1600E-4FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1600E-4FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1600E-4FGG484I reliable?
The price and inventory of XC3S1600E-4FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-4FGG484I is usually 5 days.
3.What payment methods are accepted for XC3S1600E-4FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-4FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1600E-4FGG484I?
XC3S1600E-4FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1600E-4FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1600E-4FGG484I?
For technical support, including XC3S1600E-4FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-4FGG484I requirements.
6.How does Aetrix verify that XC3S1600E-4FGG484I is sourced from the original manufacturer or authorized distributors?
All XC3S1600E-4FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-4FGG484I meets industry standards.
7.What is the process for return or replacement of XC3S1600E-4FGG484I?
All XC3S1600E-4FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-4FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1600E-4FGG484I part is unused and in its original packaging.
Return procedure for XC3S1600E-4FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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