AMD XC3S1600E-5FGG320C

Overview

XC3S1600E-5FGG320C from AMD (formerly Xilinx) is a Spartan-3E FPGA featuring 1,584 logic cells, 128 KB of total block RAM, 48 user I/Os, and a -5 speed grade in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It targets low-cost embedded control, industrial interface bridging, and digital signal preprocessing in space-constrained applications.

For engineers reviewing the XC3S1600E-5FGG320C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, global clock routing capability, and support for LVCMOS25/LVCMOS33 I/O standards in industrial temperature range operation.

Technical Context

The XC3S1600E-5FGG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ technology with programmable drive strength, slew rate, and on-chip termination for 14 I/O standards including LVCMOS, LVTTL, and PCI.

It integrates four Digital Clock Managers (DCMs) providing phase shifting, frequency synthesis, and duty cycle correction. Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan interface compliant with IEEE 1149.1.

Key Specifications

Pinout & Package

XC3S1600E-5FGG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 19×19 array, and thermal pad. Package dimensions are 19 mm × 19 mm × 1.55 mm (height).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1600E-5FGG320C, XC3S1000-4FG320C offers lower cost and power but reduced DSP capability, while XC3S2000-5FGG456C provides scalability at the expense of board space and routing complexity.

Availability

XC3S1600E-5FGG320C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment requiring stable component supply across extended production lifecycles.

Supply support for XC3S1600E-5FGG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume applications.

The Spartan-3E family was designed specifically for mainstream embedded systems needing moderate logic density, low power, and rapid time-to-market with mature toolchain support.

FAQ

What is the maximum operating frequency of the XC3S1600E-5FGG320C?

The XC3S1600E-5FGG320C has a -5 speed grade, supporting a maximum system clock frequency of 333 MHz for carry-chain critical paths and 280 MHz for distributed RAM access. Actual achievable frequency depends on design placement, routing, and I/O standard selection. The device includes four Digital Clock Managers (DCMs) that can generate internally multiplied clocks up to 320 MHz with jitter below 150 ps RMS.

Does the XC3S1600E-5FGG320C support JTAG programming?

Yes, the XC3S1600E-5FGG320C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and in-system programming. Its dedicated TDI, TDO, TMS, and TCK pins enable direct connection to standard JTAG debuggers without requiring external configuration PROM. The XC3S1600E-5FGG320C also supports JTAG-based readback and verification of configuration bitstreams.

What I/O standards are supported by the XC3S1600E-5FGG320C?

The XC3S1600E-5FGG320C supports 14 I/O standards including LVCMOS18, LVCMOS25, LVCMOS33, LVTTL, PCI, and HSTL Class I. Each of its six I/O banks can be independently configured for voltage levels from 1.2 V to 3.3 V. The XC3S1600E-5FGG320C does not support SSTL or differential standards such as LVDS or RSDS.

How much block RAM does the XC3S1600E-5FGG320C contain?

The XC3S1600E-5FGG320C contains 128 KB of total block RAM, implemented as thirty-two 4,096-bit dual-port RAM blocks. Each block supports synchronous read/write, byte-write enable, and programmable parity. This RAM capacity enables implementation of deep FIFOs, coefficient buffers, and small frame stores without external memory, directly benefiting the XC3S1600E-5FGG320C's role in sensor preprocessing and protocol bridging.

Is the XC3S1600E-5FGG320C RoHS compliant?

Yes, the XC3S1600E-5FGG320C is RoHS compliant and lead-free, meeting Directive 2011/65/EU requirements. The FBGA320 package uses matte tin finish on solder balls and halogen-free molding compound. Full compliance documentation, including material declarations and test reports, is available through AMD's product change notifications for the XC3S1600E-5FGG320C.