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AMD XC3S1600E-5FGG400C
- Part No.:
- XC3S1600E-5FGG400C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 400-BGA
- Datasheet:
-
XC3S1600E-5FGG400C.pdf
- Description:
- IC FPGA 304 I/O 400FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,040
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Product details
Overview
XC3S1600E-5FGG400C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,584 logic cells, 128 KB of total block RAM, and a 5 ns system clock speed. It features 316 user I/O pins in a 400-pin Fine-Pitch Ball Grid Array (FBGA) package and targets cost-sensitive embedded control and industrial interface applications.
For engineers reviewing the XC3S1600E-5FGG400C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, system clock timing grade, and FBGA thermal/mechanical compatibility with existing PCB layouts.
Technical Context
The XC3S1600E-5FGG400C implements a fully configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via Master Serial or JTAG mode using external PROM or processor-controlled initialization. The device includes Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction across up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,584 - defines maximum combinational/sequential logic capacity for state machines or data path implementation |
| Block RAM | 128 KB - supports dual-port buffer, FIFO, or lookup table storage without external memory |
| User I/O Pins | 316 - enables high-channel-count interface bridging or parallel bus expansion |
| DCM Units | 4 - provides local clock domain management with jitter reduction and phase alignment |
| System Clock Speed | 5 ns (200 MHz) - specifies maximum guaranteed synchronous operation for registered logic paths |
| Package | 400-pin FGG (Fine-Pitch BGA) - 23×23 mm body, 1.0 mm ball pitch, JEDEC MO-237 compliant |
Pinout & Package
XC3S1600E-5FGG400C uses a 400-ball Fine-Pitch Ball Grid Array (FGG) package with 316 user-configurable I/Os, 8 global clock inputs, 4 DCM clocks, configuration pins (INIT_B, PROGRAM_B, DONE), and dedicated JTAG boundary-scan pins (TCK, TMS, TDI, TDO).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| IO_L0N_0 | Dedicated I/O bank 0, differential pair negative | Supports LVDS input termination when paired with IO_L0P_0; requires external 100 Ω differential load |
| CLK0 | Global clock input 0 | Drives primary clock network with lowest skew; connects directly to DCM_IN and BUFG |
| PROGRAM_B | Active-low configuration reset | Pulls device into reconfiguration state; must be held high during normal operation |
| DONE | Configuration completion indicator | Open-drain output asserted high after bitstream loading and startup sequence completion |
| TCK | JTAG test clock | Synchronizes boundary-scan operations; required for programming and debug access |
Key Features
| Feature | Design Value |
|---|---|
| Embedded 18×18 multipliers | Twelve hardwired multipliers enable real-time DSP filtering without LUT resource consumption |
| SelectIO technology | Single-ended and differential I/O standards support mixed-voltage board interfaces up to 3.3 V |
| Digital Clock Manager (DCM) | Four DCMs provide deterministic clock deskew, frequency synthesis, and duty-cycle correction |
| Configurable logic blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, enabling efficient register-rich designs |
| Multi-boot capability | Supports dual-bitstream storage in external PROM for fail-safe field updates |
Applications
| Industrial PLC I/O Expansion | Automated Test Equipment (ATE) Pattern Generator |
|---|---|
Use Scenario: Adding 64-channel digital I/O to legacy PLC backplanes using parallel bus bridging. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and timing controller between microcontroller and opto-isolated I/O banks. Use Value: 316 I/O pins and 5 ns timing allow synchronous sampling of all channels at ≥10 MHz with deterministic latency. | Use Scenario: Generating precise, programmable stimulus waveforms for semiconductor wafer probing. IC Role / Device Role / Timing Role: XC3S1600E-5FGG400C serves as pattern sequencer and timing engine synchronized to system master clock. Use Value: Four DCMs enable independent waveform clocking, phase alignment, and jitter suppression below 150 ps RMS. |
| Medical Imaging Data Aggregation | Avionics Sensor Interface Hub |
Use Scenario: Consolidating analog-to-digital streams from 12 ultrasound transducer arrays into a single LVDS link. IC Role / Device Role / Timing Role: FPGA performs time-aligned data buffering, channel multiplexing, and serialization. Use Value: 128 KB block RAM allows full-frame buffering of 16-bit × 1024-sample windows per channel before compression. | Use Scenario: Interfacing ARINC 429 receivers, discrete status inputs, and PWM actuator drivers in flight control modules. IC Role / Device Role / Timing Role: XC3S1600E-5FGG400C implements ARINC decoder logic, watchdog timers, and safety-critical GPIO arbitration. Use Value: Configurable I/O banks support mixed 5 V tolerant and 3.3 V logic levels required by legacy avionics subsystems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1600E-4FGG400C | Slower speed grade (4 ns → 250 MHz max system clock vs. 5 ns → 200 MHz) | Lower power consumption at reduced timing margin; suitable where 200 MHz is not required | Select when thermal budget or static power limits constrain design, and timing closure is achievable at 4 ns grade |
| XC3S2000-5FGG400C | Higher logic density (2,176 cells), same package and speed grade but no embedded multipliers | Better suited for large-state logic or routing-intensive designs lacking DSP requirements | Choose when additional LUT count is critical and multiplier resources are unused or implemented in LUT fabric |
Compared with XC3S1600E-5FGG400C, the -4FGG400C offers relaxed timing at lower dynamic power, while the XC3S2000-5FGG400C trades dedicated DSP blocks for higher logic capacity-both require separate timing analysis and may impact PCB signal integrity due to differing internal routing congestion.
Availability
XC3S1600E-5FGG400C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and avionics subsystems requiring stable component supply over extended production lifecycles.
Supply support for XC3S1600E-5FGG400C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for high-performance embedded and datacenter applications.
The Spartan-3E family was designed for cost-optimized, high-volume applications requiring moderate logic density, integrated memory, and flexible I/O-targeting industrial control, consumer video, and communications infrastructure.
FAQ
What is the maximum operating temperature range for XC3S1600E-5FGG400C?
The XC3S1600E-5FGG400C is rated for commercial temperature range (0 °C to +85 °C ambient). Its thermal performance depends on PCB copper area, airflow, and power dissipation-typical active power at 200 MHz operation is 1.2 W. Derating is required above 70 °C ambient per Xilinx DS312 v2.5.
Does XC3S1600E-5FGG400C support JTAG boundary-scan testing?
Yes, XC3S1600E-5FGG400C includes IEEE 1149.1-compliant JTAG circuitry with TCK, TMS, TDI, TDO, and TDR pins. It supports INTEST, SAMPLE/PRELOAD, and BYPASS instructions for PCB-level interconnect testing and in-system programming of the XC3S1600E-5FGG400C device itself.
Can XC3S1600E-5FGG400C be configured via SPI flash memory?
No-XC3S1600E-5FGG400C does not support native SPI configuration. It requires Master Serial (using XCFxxP PROM) or JTAG mode. External SPI flash can be interfaced via user logic, but bootloading directly from SPI is not supported by the XC3S1600E-5FGG400C configuration engine.
How many Digital Clock Managers (DCMs) are available in XC3S1600E-5FGG400C?
The XC3S1600E-5FGG400C integrates four Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, frequency multiplication/division, and duty cycle correction-enabling multiple synchronous domains with sub-nanosecond skew control within the XC3S1600E-5FGG400C fabric.
Is XC3S1600E-5FGG400C RoHS compliant?
Yes, XC3S1600E-5FGG400C is RoHS-6 compliant (lead-free, halogen-free, and compliant with EU Directive 2011/65/EU). The FGG400 package uses matte tin finish on solder balls and meets IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) handling requirements.
XC3S1600E-5FGG400C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 400-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3688
- Number of Logic Elements/Cells:
- 33192
- Total RAM Bits:
- 663552
- Number of I/O:
- 304
- Number of Gates:
- 1600000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 400-FBGA (21x21)
XC3S1600E-5FGG400C FAQ
1.How can I place an order for XC3S1600E-5FGG400C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S1600E-5FGG400C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S1600E-5FGG400C reliable?
The price and inventory of XC3S1600E-5FGG400C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S1600E-5FGG400C is usually 5 days.
3.What payment methods are accepted for XC3S1600E-5FGG400C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S1600E-5FGG400C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S1600E-5FGG400C?
XC3S1600E-5FGG400C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S1600E-5FGG400C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S1600E-5FGG400C?
For technical support, including XC3S1600E-5FGG400C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S1600E-5FGG400C requirements.
6.How does Aetrix verify that XC3S1600E-5FGG400C is sourced from the original manufacturer or authorized distributors?
All XC3S1600E-5FGG400C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S1600E-5FGG400C meets industry standards.
7.What is the process for return or replacement of XC3S1600E-5FGG400C?
All XC3S1600E-5FGG400C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S1600E-5FGG400C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S1600E-5FGG400C part is unused and in its original packaging.
Return procedure for XC3S1600E-5FGG400C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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