AMD XC3S1600E-5FGG484C

Overview

XC3S1600E-5FGG484C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 1,600,000 system gates, 22,656 logic cells, and 576 Kbits of block RAM. It features a 5 ns input/output delay, operates at 1.2 V core voltage, and is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA). It targets cost-sensitive embedded control and industrial interface applications.

For engineers reviewing the XC3S1600E-5FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (376 user I/Os), differential signaling support (LVDS, LVPECL), clock management (four DCMs), and configuration interface options (SPI, JTAG, Master SelectMAP).

Technical Context

The XC3S1600E-5FGG484C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates four Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction.

Configuration is supported via Master SelectMAP mode (parallel), Slave SelectMAP mode, Serial (SPI), or JTAG boundary-scan. I/O banks are independently configurable for 1.2 V to 3.3 V signaling standards including LVTTL, LVCMOS, PCI, HSTL, and SSTL.

Key Specifications

Pinout & Package

XC3S1600E-5FGG484C is housed in a 484-ball Fine-Pitch Ball Grid Array (FBGA) package with 23 × 23 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. Thermal characteristics include 1.9°C/W junction-to-case thermal resistance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S1600E-5FGG484C, the XC3S1000-5FGG456C reduces gate count and I/O to lower cost and footprint but sacrifices LVPECL compatibility, while the XC3S2000-5FGG484C retains full pinout and feature parity while adding 14% more logic for scalable designs.

Availability

XC3S1600E-5FGG484C is available at Aetrix Electronics and suitable for industrial control, automated test equipment, and video interface bridge applications requiring stable component supply and long-term obsolescence management.

Supply support for XC3S1600E-5FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.

The Spartan-3E family was designed for cost-optimized, high-volume embedded applications requiring programmable logic with integrated clock management and multi-voltage I/O support.

FAQ

What is the configuration voltage requirement for XC3S1600E-5FGG484C?

The XC3S1600E-5FGG484C requires three distinct supply voltages: 1.2 V for core logic (VCCINT), 2.5 V for auxiliary circuits including DCMs (VCCAUX), and programmable I/O bank voltages ranging from 1.2 V to 3.3 V (VCCO). All supplies must be ramped monotonically during power-up per Xilinx DS312 specification.

Does XC3S1600E-5FGG484C support JTAG boundary-scan for in-system programming?

Yes, XC3S1600E-5FGG484C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and verification. The TCK, TMS, TDI, and TDO pins enable standard programming workflows using Xilinx iMPACT or Vivado Hardware Manager, and allow runtime visibility into I/O states and internal signals.

How many Digital Clock Managers (DCMs) does XC3S1600E-5FGG484C integrate?

XC3S1600E-5FGG484C integrates exactly four Digital Clock Managers (DCMs). Each DCM supports input clock frequency multiplication, division, phase shifting, and duty cycle correction, enabling independent clock domain management for up to four synchronous subsystems within the design.

Can XC3S1600E-5FGG484C interface directly with DDR SDRAM?

Yes, XC3S1600E-5FGG484C supports SSTL_2 and SSTL_18 I/O standards in dedicated I/O banks, allowing direct connection to DDR and DDR2 SDRAM without external level shifters. Timing closure requires careful PCB layout and use of DCM-generated clocks aligned to data strobes.

What is the maximum operating temperature rating for XC3S1600E-5FGG484C?

XC3S1600E-5FGG484C is rated for commercial temperature operation (0 °C to +70 °C ambient). Its thermal design supports junction temperatures up to +85 °C under typical load conditions, with thermal resistance θ_JA = 23.5 °C/W and θ_JC = 1.9 °C/W as specified in Xilinx DS312.