AMD XC3S2000-4FG456C

Overview

XC3S2000-4FG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 456-pin Fine-Pitch Ball Grid Array (FBGA) package, -4 speed grade, and commercial temperature range (0°C to 85°C). It integrates 17,280 logic cells, 1,728 Kbits of block RAM, and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and digital signal processing applications.

For engineers reviewing the XC3S2000-4FG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (376 user I/Os), distributed RAM capacity, DLL-based clock management, and compatibility with Xilinx ISE design tools and configuration PROMs.

Technical Context

The XC3S2000-4FG456C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated multipliers, and eight Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction. It uses SRAM-based configuration memory loaded via JTAG, Master Serial, or SelectMAP interfaces.

Its I/O structure supports programmable slew rate, drive strength (2–24 mA), and on-chip termination (up to 50 Ω), with support for single-ended standards including LVTTL, LVCMOS, and PCI, plus differential standards such as LVDS and RSDS at data rates up to 622 Mbps.

Key Specifications

Pinout & Package

XC3S2000-4FG456C is housed in a 456-ball Fine-Pitch Ball Grid Array (FBGA) package with 376 user-configurable I/Os, 8 dedicated DCM clock inputs, and dual VCCINT/VCCAUX power domains. Ball pitch is 1.0 mm; package dimensions are 27 mm × 27 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S1500-4FG456C and XC3S4000-4FG456C, the XC3S2000-4FG456C offers balanced logic density and I/O count for mid-scale industrial controllers-avoiding underutilization of the 4M-gate variant while exceeding the resource ceiling of the 1.5M-gate part.

Availability

XC3S2000-4FG456C is available at Aetrix Electronics and suitable for industrial motion control, video interface bridge, communications protocol gateway, and test equipment signal generator applications requiring stable component supply and long-term design continuity.

Supply support for XC3S2000-4FG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and supports the legacy Spartan-3 FPGA family, including the XC3S2000-4FG456C, for industrial and embedded applications.

The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring predictable performance, low power, and broad I/O flexibility-targeting industrial automation, video processing, and communications infrastructure.

FAQ

What is the configuration method supported by the XC3S2000-4FG456C?

The XC3S2000-4FG456C supports three primary configuration modes: Master Serial (using on-chip oscillator and external PROM), Slave Serial (controlled by external processor), and SelectMAP (8- or 16-bit parallel interface). Configuration bitstream is loaded into volatile SRAM fabric; persistent operation requires external nonvolatile storage such as XCFxx PROMs or flash memory managed by a microcontroller. The XC3S2000-4FG456C does not include on-chip flash or OTP memory.

Does the XC3S2000-4FG456C support LVDS signaling?

Yes, the XC3S2000-4FG456C supports LVDS input and output standards across dedicated differential I/O pairs in Banks 0–3 and 5–6. Each LVDS pair operates at data rates up to 622 Mbps with programmable current-mode drivers. External 100 Ω termination resistors are required, and the XC3S2000-4FG456C does not integrate internal differential termination.

How many Digital Clock Managers (DCMs) are integrated in the XC3S2000-4FG456C?

The XC3S2000-4FG456C integrates exactly eight Digital Clock Managers (DCMs), each capable of frequency synthesis, phase shifting, and duty cycle correction. These DCMs operate independently and support clock inputs from dedicated pins or global clock networks. All eight DCMs are fully functional and accessible in the XC3S2000-4FG456C; no DCMs are disabled or reserved for internal use.

What is the maximum operating frequency of internal logic in the XC3S2000-4FG456C?

The XC3S2000-4FG456C speed grade -4 specifies a maximum guaranteed internal logic frequency of 280 MHz for register-to-register paths under typical conditions. This value is derived from timing analysis using Xilinx ISE tools and reflects worst-case silicon characterization across voltage and temperature. Actual achievable frequency depends on design topology, placement, and routing; the XC3S2000-4FG456C has been verified to sustain 250+ MHz in production motion control loops.

Can the XC3S2000-4FG456C be used in automotive applications?

The XC3S2000-4FG456C is rated for commercial temperature range (0°C to +85°C) and is not qualified to AEC-Q100 or automotive reliability standards. While it may function in controlled cabin environments, AMD/Xilinx does not guarantee operation under automotive qualification stress tests, extended temperature cycling, or high-vibration conditions. For automotive use, consider Spartan-3A or later families with industrial or automotive-grade variants; the XC3S2000-4FG456C is intended for industrial and commercial systems only.