AMD XC3S2000-4FG456I

Overview

XC3S2000-4FG456I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 456-pin Fine-Pitch Ball Grid Array (FBGA) package, -4 speed grade, and industrial temperature range (–40°C to +100°C). It integrates 112 DSP48 slices, 176 I/O pins, and supports SelectIO standards including LVCMOS, LVTTL, and SSTL.

For engineers reviewing the XC3S2000-4FG456I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count, timing performance at industrial temperature, and compatibility with Xilinx ISE 14.7 design flow.

Technical Context

The XC3S2000-4FG456I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (480 Kb total), and dedicated digital clock managers (DCMs) for phase-matched clock synthesis and jitter reduction. It supports up to eight global clock networks and internal clock routing with skew control.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan interface. The device uses 1.2 V core voltage and supports multi-voltage I/O banks operating at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V simultaneously.

Key Specifications

Pinout & Package

XC3S2000-4FG456I is housed in a 456-ball fine-pitch FBGA (19×19 array, 1.0 mm pitch) with 176 user I/Os, 10 dedicated configuration pins (e.g., INIT_B, PROGRAM_B, DONE), 4 DCM clock inputs, and power/ground balls distributed across the array for low-noise supply integrity.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC3S2000-4FG456I, XC3S1600E-4FG456C offers cost savings at reduced resource headroom, while XC3S4000-4FG456I extends scalability for future-proofed designs-both share the FG456 mechanical interface but differ in gate count, memory, and clock management capability.

Availability

XC3S2000-4FG456I is available at Aetrix Electronics and suitable for industrial motion control, avionics data acquisition, and test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC3S2000-4FG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Virtex, and Artix FPGA families for high-reliability embedded applications.

The Spartan-3 family was designed for cost-sensitive, high-volume applications demanding predictable timing, industrial temperature operation, and seamless integration with legacy PCB toolchains and ISE software.

FAQ

What is the maximum operating frequency of the XC3S2000-4FG456I?

The XC3S2000-4FG456I has a -4 speed grade specifying guaranteed timing performance up to 333 MHz for internal logic paths under industrial temperature conditions. Actual achievable frequency depends on design placement, routing, and clock domain constraints verified in Xilinx ISE 14.7 timing analysis reports for the XC3S2000-4FG456I.

Does the XC3S2000-4FG456I support JTAG boundary-scan testing?

Yes, the XC3S2000-4FG456I fully supports IEEE 1149.1 JTAG boundary-scan for device-level testing and in-system programming. TDI, TDO, TMS, and TCK pins are dedicated and electrically compatible with standard JTAG controllers used in production test fixtures for the XC3S2000-4FG456I.

Can the XC3S2000-4FG456I be configured using an SPI flash memory?

No, the XC3S2000-4FG456I does not support native SPI flash configuration. It requires Master Serial PROM (XCFxxP series) or JTAG for configuration. SPI flash must be interfaced via user logic after configuration completes, as the XC3S2000-4FG456I lacks built-in SPI boot controller hardware.

What is the core voltage requirement for the XC3S2000-4FG456I?

The XC3S2000-4FG456I requires a regulated 1.2 V ±3% core supply (VCCINT) delivered to its dedicated power balls. Deviation beyond this tolerance risks timing violation or configuration loss. This specification applies strictly to the XC3S2000-4FG456I and is validated per Xilinx DS099 datasheet revision 3.2.

Is the XC3S2000-4FG456I RoHS compliant?

Yes, the XC3S2000-4FG456I is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for surface-mount assembly. Compliance documentation is available in AMD's official product change notices for the XC3S2000-4FG456I.