AMD XC3S2000-4FG676C

Overview

XC3S2000-4FG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 17,280 logic cells, and 576 I/O pins in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets high-volume embedded control and interface bridging applications.

For engineers reviewing the XC3S2000-4FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic density, speed grade timing closure, and compatibility with legacy Spartan-3 design flows and toolchains.

Technical Context

The XC3S2000-4FG676C implements a hierarchical architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (48 × 18 Kbit), and dedicated multipliers (18 × 18). It supports dual-edge clocking, global clock networks with eight low-skew buffers, and internal configuration via Master Serial or JTAG modes.

It integrates Digital Clock Managers (DCMs) for phase shifting, frequency synthesis, and duty cycle correction, with input frequency range of 10–333 MHz and output jitter < ±150 ps. Configuration memory is SRAM-based and requires external PROM or processor loading.

Key Specifications

Pinout & Package

XC3S2000-4FG676C uses a 676-ball fine-pitch BGA (1.0 mm pitch) with 35 mm × 35 mm body size and 1.55 mm height. Pin assignment follows Xilinx Spartan-3 FG676 mechanical and electrical standard layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC3S1600E-4FG484C and XC3S4000-4FG676C, the XC3S2000-4FG676C delivers optimal balance of I/O count, logic density, and block RAM for mid-tier embedded control-avoiding overdesign cost while supporting complex protocol stacks and real-time processing.

Availability

XC3S2000-4FG676C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging data acquisition, and legacy bus protocol translation requiring stable component supply and long-term design continuity.

Supply support for XC3S2000-4FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product support, documentation, and toolchain compatibility for industrial and aerospace customers.

The Spartan-3 family was designed for high-volume, cost-sensitive embedded applications requiring predictable timing, robust I/O flexibility, and long-lifecycle availability-especially where ASIC development cost or lead time is prohibitive.

FAQ

What is the maximum operating frequency supported by the XC3S2000-4FG676C?

The XC3S2000-4FG676C supports input clock frequencies up to 333 MHz via its Digital Clock Managers (DCMs). Its -4 speed grade guarantees CLB-to-CLB path delays ≤ 4.5 ns, enabling reliable operation at system clock frequencies up to 222 MHz in typical place-and-route implementations. The actual achievable frequency depends on design complexity, routing congestion, and I/O standard selection.

Does the XC3S2000-4FG676C support JTAG programming and debugging?

Yes, the XC3S2000-4FG676C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, testing, and in-circuit debugging. Pins TCK, TMS, TDI, and TDO are dedicated to JTAG functionality, and the device complies with Xilinx's iMPACT and Vivado ISE toolchains for programming and verification workflows.

What power supply voltages does the XC3S2000-4FG676C require?

The XC3S2000-4FG676C requires two primary supply rails: 1.2 V ±3% for the core logic and 3.3 V ±5% for the I/O banks. Individual I/O banks may be configured for 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V operation, but each bank must use a single VCCO voltage. Decoupling capacitors must be placed per Xilinx Spartan-3 PCB layout guidelines.

Can the XC3S2000-4FG676C replace the XC3S2000-5FG676C in an existing design?

The XC3S2000-4FG676C is not a drop-in replacement for the XC3S2000-5FG676C due to its slower -4 speed grade (4.5 ns CLB delay vs. 3.75 ns for -5). Timing-critical paths that meet setup/hold requirements with the -5 grade may fail with the -4 grade. Functional equivalence exists, but timing closure must be re-verified in the target design for XC3S2000-4FG676C.

Is the XC3S2000-4FG676C still in active production and supported by AMD?

The XC3S2000-4FG676C is in continued production and supported by AMD through its Legacy Product Program. Full datasheets, application notes, and ISE Design Suite v14.7 remain available. AMD provides lifecycle notifications and last-time-buy guidance for long-term industrial customers relying on this device.