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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XC3S2000-4FG676I

Name: XC3S2000-4FG676I
Brand: AMD
SKU: XC3S2000-4FG676I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XC3S2000-4FG676I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 676-BGA

Datasheet:: XC3S2000-4FG676I.pdf

Description:: IC FPGA 489 I/O 676FCBGA

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Product details

Overview

XC3S2000-4FG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 17,280 logic cells, and 576 Kbits of block RAM. It features 480 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -4 speed grade (t_PD = 4.5 ns). It is used in industrial control logic, video interface bridging, and reconfigurable digital signal processing.

For engineers reviewing the XC3S2000-4FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, block RAM capacity, speed grade timing, and FBGA676 thermal/mechanical compatibility.

Technical Context

The XC3S2000-4FG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, dedicated multipliers, and Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and jitter reduction. It supports LVCMOS, LVTTL, PCI, and SSTL I/O standards across multiple banks.

Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. The device requires separate V_CCINT (1.2 V), V_CCO (1.2–3.3 V), and V_CCAUX (2.5 V) supply rails, with bank-specific voltage assignment for I/O compatibility.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	17,280 - provides gate-equivalent capacity for medium-complexity digital logic implementation
System Gates	2,000,000 - indicates overall combinational logic density suitable for protocol bridging and control state machines
Block RAM	576 Kbits - enables on-chip buffering for video line storage, FIFOs, or coefficient tables
User I/O Pins	480 - supports high-pin-count parallel interfaces such as RGB video, PCI-X, or custom bus expansion
Speed Grade	-4 - guarantees maximum clock-to-output delay of 4.5 ns for critical path timing closure
Package	FG676 - 27×27 mm fine-pitch BGA with 1.0 mm ball pitch, requiring controlled-impedance PCB routing
DCM Units	8 - allows independent clock domain management, including duty-cycle correction and frequency doubling

Pinout & Package

XC3S2000-4FG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FG676) package with 27×27 array, 1.0 mm ball pitch, and standard JEDEC MO-237 mechanical outline. Thermal pad exposed on underside requires solder paste stencil design per Xilinx UG331.

Pin/Terminal	Circuit Role	Design Meaning
G1	V_CCINT	1.2 V core supply input - must be locally decoupled with ≤10 nF ceramic capacitors
A2	V_CCAUX	2.5 V auxiliary supply for configuration and DCM circuitry
P3	V_{CCO_0}	I/O bank 0 output supply - sets voltage level for all pins in Bank 0 (e.g., 3.3 V or 2.5 V)
T14	PROGRAM_B	Active-low asynchronous reset - initiates configuration reload from external PROM
R15	DONE	Open-drain status output - goes high when configuration completes and device enters user mode
Y16	CCLK	Configuration clock input - driven externally during Master Serial mode or by internal oscillator in Slave mode

Key Features

Feature	Design Value
Digital Clock Managers (DCMs)	8 independent DCMs support zero-delay buffering, frequency synthesis (×2 to ×32), and phase alignment for multi-clock systems
SelectIO Technology	Supports 19 I/O standards including LVCMOS, LVTTL, PCI, and SSTL-2/3 with programmable drive strength and slew rate
Embedded Multipliers	48 18×18-bit signed multipliers enable real-time FIR filtering and motor control loop computation
Configurable Logic Blocks	Each CLB contains four 3-input LUTs and eight flip-flops - optimized for pipelined arithmetic and state machine encoding
Boundary-Scan Support	IEEE 1149.1 compliant JTAG TAP enables in-system programming and board-level interconnect testing

Applications

Industrial Motion Control	Video Interface Bridging
Use Scenario: Real-time closed-loop servo positioning in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers, encoder interpolation, and PWM generator with deterministic sub-microsecond latency. Use Value: 17,280 logic cells and 480 I/Os allow integration of motion profiling, safety monitoring, and fieldbus interface in single device.	Use Scenario: Converting between HDMI 1.3 and LVDS display interfaces in medical imaging panels. IC Role / Device Role / Timing Role: Acts as pixel-rate video serializer/deserializer with embedded sync detection and color-space conversion logic. Use Value: 576 Kbits block RAM buffers full video lines; DCMs generate precise pixel clocks and align source/sink timing domains.
Communications Protocol Gateway	Reconfigurable Test Equipment
Use Scenario: Translating Modbus RTU over RS-485 to EtherNet/IP in factory automation gateways. IC Role / Device Role / Timing Role: Implements dual-protocol state machines, CRC engines, and packet buffer management with hardware-accelerated framing. Use Value: SelectIO supports both 5 V-tolerant RS-485 transceivers and 3.3 V Ethernet PHY interfaces within same I/O bank grouping.	Use Scenario: Signal generation and analysis in automated test systems requiring waveform pattern flexibility. IC Role / Device Role / Timing Role: Configurable digital pattern generator with synchronized trigger inputs and high-speed parallel output staging. Use Value: -4 speed grade ensures <4.5 ns propagation delay for precise edge placement; 480 I/Os support 32-bit wide stimulus buses.

Industrial Motion Control

Video Interface Bridging

Use Scenario: Real-time closed-loop servo positioning in CNC machines and robotic arms.

IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers, encoder interpolation, and PWM generator with deterministic sub-microsecond latency.

Use Value: 17,280 logic cells and 480 I/Os allow integration of motion profiling, safety monitoring, and fieldbus interface in single device.

Use Scenario: Converting between HDMI 1.3 and LVDS display interfaces in medical imaging panels.

IC Role / Device Role / Timing Role: Acts as pixel-rate video serializer/deserializer with embedded sync detection and color-space conversion logic.

Use Value: 576 Kbits block RAM buffers full video lines; DCMs generate precise pixel clocks and align source/sink timing domains.

Communications Protocol Gateway

Reconfigurable Test Equipment

Use Scenario: Translating Modbus RTU over RS-485 to EtherNet/IP in factory automation gateways.

IC Role / Device Role / Timing Role: Implements dual-protocol state machines, CRC engines, and packet buffer management with hardware-accelerated framing.

Use Value: SelectIO supports both 5 V-tolerant RS-485 transceivers and 3.3 V Ethernet PHY interfaces within same I/O bank grouping.

Use Scenario: Signal generation and analysis in automated test systems requiring waveform pattern flexibility.

IC Role / Device Role / Timing Role: Configurable digital pattern generator with synchronized trigger inputs and high-speed parallel output staging.

Use Value: -4 speed grade ensures <4.5 ns propagation delay for precise edge placement; 480 I/Os support 32-bit wide stimulus buses.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XC3S1600E-4FG484C	Lower density (160K gates, 11,648 logic cells), smaller 484-pin FBGA, no DCM phase-shift capability	Suitable for cost-sensitive, lower-I/O count designs where clock management is limited to basic frequency division	Select when logic resource demand is ≤70% of XC3S2000-4FG676I and board space is constrained.
XC4VLX25-10FF668C	Higher density (25K logic cells), Virtex-4 architecture, 1.2 V core, 16 DCMs, faster -10 speed grade	Targeted for high-performance DSP and embedded PowerPC applications requiring hard IP blocks not present in Spartan-3	Choose when migrating legacy Spartan-3 designs toward higher throughput, lower power per function, or integrated microprocessor subsystems.

Compared with XC3S2000-4FG676I, XC3S1600E-4FG484C offers reduced cost and footprint but sacrifices logic capacity and advanced clocking; XC4VLX25-10FF668C delivers greater performance and integration at higher cost and power, targeting next-generation upgrades rather than drop-in replacement.

Availability

XC3S2000-4FG676I is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and communications protocol gateway applications requiring stable component supply and long-term production support.

Supply support for XC3S2000-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.

The Spartan-3 family was designed by Xilinx for cost-sensitive, high-volume applications requiring predictable timing, low static power, and broad I/O flexibility in industrial and embedded systems.

FAQ

What is the maximum operating frequency supported by XC3S2000-4FG676I?

The XC3S2000-4FG676I has a -4 speed grade, meaning its guaranteed maximum clock-to-output delay is 4.5 ns. This supports internal logic operation up to approximately 222 MHz for typical register-to-register paths. Actual system frequency depends on design placement, routing, and clock domain constraints - verified using Xilinx ISE timing analysis tools on the XC3S2000-4FG676I netlist.

Does XC3S2000-4FG676I support JTAG boundary-scan testing?

Yes, XC3S2000-4FG676I fully complies with IEEE 1149.1 and includes a dedicated JTAG TAP controller. It supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions for board-level interconnect testing and in-system programming. The JTAG interface remains active post-configuration and is accessible through TCK, TMS, TDI, TDO, and TCK pins defined in the XC3S2000-4FG676I pinout documentation.

What power supply voltages does XC3S2000-4FG676I require?

XC3S2000-4FG676I requires three distinct supply rails: V_CCINT = 1.2 V ±3% for core logic, V_CCAUX = 2.5 V ±5% for configuration and DCM circuitry, and V_CCO = 1.2–3.3 V (per I/O bank) for output drivers. Each rail must be independently decoupled; failure to meet ripple and sequencing requirements may cause configuration failure or metastability in the XC3S2000-4FG676I.

Can XC3S2000-4FG676I be configured via SPI flash memory?

No - XC3S2000-4FG676I does not support native SPI configuration. It supports Master Serial (using XCFxxP PROMs), Slave Serial, and JTAG modes only. To use SPI flash, an external microcontroller must implement the configuration bitstream loading sequence via Slave Serial or JTAG interface - the XC3S2000-4FG676I itself lacks built-in SPI master logic or boot ROM for direct SPI flash access.

Is XC3S2000-4FG676I RoHS compliant and lead-free?

Yes, XC3S2000-4FG676I is manufactured as a lead-free, RoHS-compliant device. The FG676 package uses matte tin surface finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation, including substance declarations and test reports, is available under Xilinx document DS137 for the XC3S2000-4FG676I.

XC3S2000-4FG676I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Spartan®-3

Package/Case:: 676-BGA

Packaging:: Bulk

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 5120

Number of Logic Elements/Cells:: 46080

Total RAM Bits:: 737280

Number of I/O:: 489

Number of Gates:: 2000000

Voltage - Supply:: 1.14V ~ 1.26V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 676-FBGA (27x27)

XC3S2000-4FG676I FAQ

1.How can I place an order for XC3S2000-4FG676I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S2000-4FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S2000-4FG676I reliable?

The price and inventory of XC3S2000-4FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S2000-4FG676I is usually 5 days.

3.What payment methods are accepted for XC3S2000-4FG676I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S2000-4FG676I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S2000-4FG676I?

XC3S2000-4FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S2000-4FG676I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S2000-4FG676I?

For technical support, including XC3S2000-4FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S2000-4FG676I requirements.

6.How does Aetrix verify that XC3S2000-4FG676I is sourced from the original manufacturer or authorized distributors?

All XC3S2000-4FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S2000-4FG676I meets industry standards.

7.What is the process for return or replacement of XC3S2000-4FG676I?

All XC3S2000-4FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S2000-4FG676I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S2000-4FG676I part is unused and in its original packaging.

Return procedure for XC3S2000-4FG676I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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