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AMD XC3S2000-4FG900I

Part No.:
XC3S2000-4FG900I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
900-BBGA
Datasheet:
AetrixXC3S2000-4FG900I.pdf
Description:
IC FPGA 565 I/O 900FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,253

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Product details

Overview

XC3S2000-4FG900I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 173,000 logic cells, and 512 KB of block RAM. It features 633 user I/Os, operates at -4 speed grade (tPD = 4.5 ns), and supports LVCMOS/LVTTL/SSTL/HSTL I/O standards. It is used in industrial control logic and high-speed data acquisition systems.

For engineers reviewing the XC3S2000-4FG900I datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, speed grade timing closure, block RAM depth for buffering, and compatibility with Xilinx ISE 14.7 design flow.

Technical Context

The XC3S2000-4FG900I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO technology for mixed-voltage I/O operation up to 3.3 V and includes Digital Clock Managers (DCMs) for clock synthesis and phase alignment.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device requires separate VCCINT (1.2 V), VCCO (1.2–3.3 V), and VREF supplies, with thermal management dependent on the 900-pin Fine-Pitch BGA (FPBGA) package.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells173,000 - determines maximum combinational/sequential logic capacity per design
System Gates2,000,000 - legacy metric estimating equivalent ASIC gate count for logic density comparison
Block RAM512 KB - supports FIFOs, buffers, and lookup tables without external memory
User I/O Pins633 - enables high-pin-count interfaces such as parallel ADC/DAC buses or multi-lane communication
Speed Grade-4 - guarantees worst-case propagation delay ≤4.5 ns for CLB-to-CLB paths at 1.2 V/85°C
I/O StandardsLVCMOS, LVTTL, SSTL, HSTL - allows direct interfacing with DDR SDRAM, microcontrollers, and FPGAs
DCM Units8 - provides clock multiplication, division, phase shifting, and duty-cycle correction

Pinout & Package

XC3S2000-4FG900I is housed in a 900-pin Fine-Pitch Ball Grid Array (FPBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal pad. Pinout follows Xilinx Spartan-3 FG900 mechanical and electrical specification.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2 V core supply input - must be locally decoupled with low-ESR ceramic capacitors
A2VCCOI/O bank supply - sets voltage level for associated pins (1.2–3.3 V)
P4PROGRAM_BActive-low configuration reset - initiates reconfiguration when pulled low
R2DONEOpen-drain status output - goes high after successful bitstream loading and initialization
T1TCKJTAG test clock - synchronizes boundary-scan operations during programming or debug
U2TMSJTAG test mode select - controls state transitions in TAP controller

Key Features

FeatureDesign Value
Dedicated Multipliers48 × 18-bit - accelerates DSP functions like FIR filtering and FFT without consuming logic resources
Digital Clock Manager (DCM)8 units - eliminates need for external PLLs in clock domain crossing and jitter reduction
SelectIO TechnologySupports 12 I/O standards - simplifies interface to heterogeneous peripherals without level shifters
Configurable Logic Blocks (CLBs)173,000 total - delivers predictable timing and routing for synchronous digital systems
Boundary-Scan SupportIEEE 1149.1 compliant - enables in-circuit testing and JTAG-based programming

Applications

Industrial Motion ControlHigh-Speed Data Acquisition

Use Scenario: Real-time servo loop execution with sub-microsecond latency requirements in CNC machines.

IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers and encoder interpolation logic.

Use Value: 633 I/Os support simultaneous connection to multiple axes, encoders, and analog feedback channels.

Use Scenario: Simultaneous sampling of 16-channel 14-bit ADCs at 100 MSPS with on-chip buffering.

IC Role / Device Role / Timing Role: XC3S2000-4FG900I acts as real-time data concentrator and preprocessing engine.

Use Value: 512 KB block RAM stores full acquisition bursts before DMA transfer to host processor.

Protocol Bridging GatewayLegacy System Emulation

Use Scenario: Converting proprietary fieldbus signals (e.g., Profibus DP) to Ethernet/IP in factory automation.

IC Role / Device Role / Timing Role: XC3S2000-4FG900I implements dual-port memory-mapped interfaces and packet assembly logic.

Use Value: LVCMOS/LVTTL I/O banks interface directly with legacy PHYs while Ethernet MAC runs on embedded soft-core.

Use Scenario: Replacing obsolete ASICs in avionics test equipment requiring identical timing and pin behavior.

IC Role / Device Role / Timing Role: FPGA replicates register map, timing waveforms, and handshake protocols of retired ICs.

Use Value: -4 speed grade ensures setup/hold timing compliance with original ASIC's 25 MHz control bus.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S2500-4FG900I2,500,000 gates, 214,000 logic cells, same package and pinoutHigher gate count supports larger state machines and more complex datapathsChoose when design exceeds XC3S2000-4FG900I resource utilization by >15%
XC3S1600E-4FG484C1,600K gates, 484-pin FBGA, lower I/O count (370), no DCM phase-shift capabilityReduced cost and footprint for less demanding timing and interface requirementsChoose for space-constrained designs where 633 I/Os and advanced clocking are unnecessary

Compared with XC3S2000-4FG900I, XC3S2500-4FG900I offers headroom for future feature expansion without PCB change, while XC3S1600E-4FG484C trades I/O count and clocking precision for lower BOM cost and smaller board area.

Availability

XC3S2000-4FG900I is available at Aetrix Electronics and suitable for industrial motion control, high-speed data acquisition, and protocol bridging gateway applications requiring stable component supply and long-term obsolescence management.

Supply support for XC3S2000-4FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Virtex, and Artix FPGA families. Xilinx pioneered programmable logic architecture and EDA tool integration.

The Spartan-3 family, including XC3S2000-4FG900I, was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and deterministic timing - especially in industrial and test equipment.

FAQ

What is the maximum operating frequency supported by XC3S2000-4FG900I?

The XC3S2000-4FG900I has a -4 speed grade, guaranteeing CLB-to-CLB path delays ≤4.5 ns under worst-case conditions (1.2 V, 85°C). Synthesis results in Xilinx ISE 14.7 typically achieve 200–250 MHz system clock frequencies for well-constrained synchronous designs. Actual performance depends on placement, routing, and logic depth.

Does XC3S2000-4FG900I support JTAG programming and debugging?

Yes, XC3S2000-4FG900I fully supports IEEE 1149.1 JTAG boundary-scan. Pins TCK, TMS, TDI, TDO, and TRST enable in-system programming, configuration verification, and real-time debug access via Xilinx iMPACT or ChipScope Pro tools. JTAG is active before and after configuration.

What power supply voltages does XC3S2000-4FG900I require?

XC3S2000-4FG900I requires three distinct supply domains: VCCINT = 1.2 V ±3% for core logic, VCCO = 1.2–3.3 V (per I/O bank) for output drivers, and optional VREF for differential standards. Decoupling must follow Xilinx UG331 guidelines, with separate planes and localized ceramic capacitors per supply rail.

Can XC3S2000-4FG900I replace XC3S1500-4FG900I in an existing design?

Yes, XC3S2000-4FG900I is pin-compatible and functionally upward-compatible with XC3S1500-4FG900I. Both use identical 900-pin FPBGA packaging, same power and configuration pin assignments, and share compatible bitstream formats. Resource increase (2M → 2.5M gates) adds margin without requiring layout changes.

Is XC3S2000-4FG900I still in production or subject to obsolescence?

XC3S2000-4FG900I is listed as Not Recommended for New Designs (NRND) by AMD/Xilinx but remains actively supported through authorized distributors with verified inventory. Aetrix Electronics maintains traceable stock and offers lifecycle coordination, including last-time-buy planning and migration path guidance to Spartan-7 or Artix-7 alternatives.

XC3S2000-4FG900I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
900-BBGA
Packaging:
Bulk
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
5120
Number of Logic Elements/Cells:
46080
Total RAM Bits:
737280
Number of I/O:
565
Number of Gates:
2000000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
900-FBGA (31x31)

XC3S2000-4FG900I FAQ

1.How can I place an order for XC3S2000-4FG900I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S2000-4FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S2000-4FG900I reliable?

The price and inventory of XC3S2000-4FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S2000-4FG900I is usually 5 days.

3.What payment methods are accepted for XC3S2000-4FG900I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S2000-4FG900I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S2000-4FG900I?

XC3S2000-4FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S2000-4FG900I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S2000-4FG900I?

For technical support, including XC3S2000-4FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S2000-4FG900I requirements.

6.How does Aetrix verify that XC3S2000-4FG900I is sourced from the original manufacturer or authorized distributors?

All XC3S2000-4FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S2000-4FG900I meets industry standards.

7.What is the process for return or replacement of XC3S2000-4FG900I?

All XC3S2000-4FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S2000-4FG900I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S2000-4FG900I part is unused and in its original packaging.

Return procedure for XC3S2000-4FG900I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S2000-4FG900I Tags

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