AMD XC3S2000-4FGG456C

Overview

XC3S2000-4FGG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 456-pin Fine-Pitch Ball Grid Array (FBGA) package, -4 speed grade, and commercial temperature range (0°C to 85°C). It integrates 112 I/O pins, 128 block RAMs (18 kbits each), and supports LVCMOS/LVTTL, PCI, and SSTL interfaces for embedded control and digital signal processing.

For engineers reviewing the XC3S2000-4FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count, supported voltage standards, block RAM depth, and timing closure at -4 speed grade.

Technical Context

The XC3S2000-4FGG456C implements configurable logic blocks (CLBs) with dual 4-input LUTs and flip-flops per slice, distributed RAM capability up to 16 bits per CLB, and dedicated carry logic for arithmetic functions. It includes twelve Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan interface. The device supports IEEE 1149.1 compliance and in-system programmability through SelectMAP or JTAG, enabling field updates without hardware replacement.

Key Specifications

Pinout & Package

XC3S2000-4FGG456C uses a 456-ball fine-pitch BGA (FGG) package with 1.0 mm ball pitch, 23×23 array, and thermal pad. Pin assignment follows Xilinx Spartan-3 FPGA pinout standard for FGG456.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S2000-4FGG456C, XC3S1600E-4FGG456C offers lower gate count and reduced memory for cost-sensitive control-only roles, while XC3S4000-4FGG676C delivers headroom for complex signal processing but demands mechanical and thermal redesign.

Availability

XC3S2000-4FGG456C is available at Aetrix Electronics and suitable for industrial motion control, video bridge design, communications baseband development, and test equipment signal generation requiring stable component supply across extended production lifecycles.

Supply support for XC3S2000-4FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product support, documentation, and long-term availability commitments for industrial and aerospace customers.

The Spartan-3 family was designed for cost-sensitive, high-volume embedded applications requiring predictable timing, multi-standard I/O, and field-upgradable logic - especially where ASIC NRE cost or lead time is prohibitive.

FAQ

What is the maximum operating frequency of the XC3S2000-4FGG456C?

The XC3S2000-4FGG456C has a -4 speed grade, meaning its internal logic paths are characterized to operate reliably up to 333 MHz for DCM-synthesized clocks and 280 MHz for general CLB-to-CLB paths under commercial conditions. Actual achievable frequency depends on design placement, routing, and I/O standard selection, as verified in Xilinx ISE timing reports.

Does the XC3S2000-4FGG456C support JTAG boundary-scan testing?

Yes, the XC3S2000-4FGG456C fully complies with IEEE 1149.1 and supports JTAG boundary-scan for configuration, debugging, and interconnect testing. Pins TCK, TMS, TDI, TDO, and TRTCK are dedicated for this function, and the device can be programmed or verified in-system without removing it from the PCB.

Can the XC3S2000-4FGG456C interface directly with DDR SDRAM?

Yes, the XC3S2000-4FGG456C supports SSTL-2 Class I and II standards on dedicated I/O banks, enabling direct connection to DDR SDRAM operating at 2.5 V. Proper termination, board layout, and DCM-controlled clocking are required to meet setup/hold timing margins for reliable read/write operations.

What configuration methods are supported by the XC3S2000-4FGG456C?

The XC3S2000-4FGG456C supports Master Serial (via external PROM), JTAG, and SelectMAP modes. Master Serial is typical for production boot; JTAG enables debug and field updates; SelectMAP allows high-speed parallel configuration using microprocessor or FPGA companion devices.

Is the XC3S2000-4FGG456C still in active production?

XC3S2000-4FGG456C is listed as obsolete by AMD/Xilinx, but Aetrix Electronics maintains inventory and offers extended lifecycle support including traceable sourcing, obsolescence monitoring, and cross-reference assistance for migration paths to newer families such as Artix-7 or Kintex-7 where feasible.