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AMD XC3S2000-4FGG456I
- Part No.:
- XC3S2000-4FGG456I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 456-BBGA
- Datasheet:
-
XC3S2000-4FGG456I.pdf
- Description:
- IC FPGA 333 I/O 456FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,146
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Product details
Overview
XC3S2000-4FGG456I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 456-pin Fine-Pitch Ball Grid Array (FBGA) package, -4 speed grade, and industrial temperature range (–40°C to +100°C). It integrates up to 41,472 logic cells, 2,088 Kbits of block RAM, and supports LVCMOS/LVTTL I/O standards for embedded control and digital signal processing applications.
For engineers reviewing the XC3S2000-4FGG456I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (376 user I/Os), distributed RAM capacity, DLL-based clock management, and compatibility with Xilinx ISE design tools and Spartan-3 configuration PROMs.
Technical Context
The XC3S2000-4FGG456I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated multipliers, and eight Digital Clock Managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction. It uses 90 nm CMOS process technology and supports JTAG boundary-scan testing per IEEE 1149.1.
Configuration is performed via master serial mode using external PROM or microprocessor-controlled slave parallel mode. The device includes SelectIO™ technology enabling programmable drive strength, slew rate control, and on-chip termination for 19 I/O standards including LVDS and PCI.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 41,472 - total available LUT-based logic resources for combinational and sequential logic implementation |
| User I/O Pins | 376 - configurable single-ended and differential I/Os supporting voltage levels from 1.2 V to 3.3 V |
| Block RAM | 2,088 Kbits - distributed across 72 x 18-Kbit dual-port RAM blocks for data buffering and FIFOs |
| DCMs | 8 - fully digital clock managers providing jitter reduction, frequency multiplication/division, and phase alignment |
| Speed Grade | -4 - guarantees timing performance at maximum operating frequencies up to 333 MHz for internal logic paths |
| Operating Temp | –40°C to +100°C - qualified for industrial environments without derating |
| Package | 456-pin FGG - 23×23 mm fine-pitch FBGA with 1.0 mm ball pitch and Pb-free finish |
Pinout & Package
The XC3S2000-4FGG456I is housed in a 456-ball Fine-Pitch Ball Grid Array (FGG) package with 376 user-configurable I/Os, 8 dedicated DCM clock inputs, 4 global clock pins, and power/ground balls arranged in a symmetrical array for thermal and signal integrity optimization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | IO_L1P_0 | Programmable I/O bank 0, positive differential pair or single-ended input/output |
| H1 | IO_L1N_0 | Programmable I/O bank 0, negative differential pair complement |
| K1 | IO_L2P_0 | Programmable I/O bank 0, second differential pair |
| L1 | IO_L2N_0 | Programmable I/O bank 0, second differential pair complement |
| M1 | GCLK0 | Dedicated global clock input for low-skew distribution to all CLBs |
| P1 | PROGRAM_B | Active-low asynchronous configuration initiation signal |
| R1 | INIT_B | Open-drain status output indicating configuration memory readiness |
| T1 | DONE | Open-drain output signaling successful configuration completion |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | 8 independent DCMs enable precise clock deskew, frequency synthesis, and jitter filtering without external PLL components |
| SelectIO Technology | Supports 19 I/O standards with programmable drive strength (2–24 mA), slew rate control, and on-die termination for impedance matching |
| Embedded Multipliers | 128 18×18-bit two's-complement multipliers accelerate DSP functions like FIR filtering and FFT computation |
| Configurable Logic Blocks (CLBs) | Each CLB contains four 3-input LUTs and flip-flops, enabling high-density logic mapping with predictable timing closure |
| Block RAM Architecture | 72 dual-port 18-Kbit RAM blocks support simultaneous read/write operations for real-time buffering and memory-intensive algorithms |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback processing in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, PWM generators, and quadrature decoder logic with sub-microsecond latency. Use Value: 376 I/Os interface directly with motor drivers, encoders, and safety I/O modules; DCMs synchronize motion axes to <±50 ps jitter. | Use Scenario: Conversion between HDMI 1.3a source and LVDS display interface in medical imaging displays. IC Role / Device Role / Timing Role: Implements pixel clock domain crossing, color space conversion, and embedded sync stripping/reinsertion logic. Use Value: 128 embedded multipliers accelerate RGB-YUV matrix math; SelectIO supports both 3.3 V HDMI TMDS and 2.5 V LVDS I/O simultaneously. |
| Avionics Data Concentrator | Test Equipment Pattern Generator |
Use Scenario: Aggregation and protocol translation of ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control systems. IC Role / Device Role / Timing Role: Configurable logic implements deterministic time-triggered communication stacks and hardware-level error detection/correction. Use Value: Industrial temperature rating ensures operation across aircraft cabin and avionics bay environments; JTAG support enables in-system verification per DO-254. | Use Scenario: High-speed digital stimulus generation for IC functional validation at up to 200 MHz vector rates. IC Role / Device Role / Timing Role: Generates synchronized multi-channel test patterns with precise setup/hold timing and programmable skew. Use Value: 41,472 logic cells store >1M vectors on-chip; DCMs generate phase-aligned clocks for parallel bus and serial interface stimulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S1600E-4FGG456C | Lower logic density (1,600K gates), same package and speed grade, but only 4 DCMs and 1,872 Kbits block RAM | Suitable for cost-sensitive designs with reduced algorithmic complexity and smaller state machines | Select when full XC3S2000-4FGG456I resources are unused and BOM cost is prioritized over future scalability |
| XC3S4000-4FGG676I | Higher gate count (4M), 676-ball package, 12 DCMs, and 2,952 Kbits block RAM; requires PCB redesign | Required for applications needing >41K logic cells or >376 I/Os, such as multi-gigabit transceiver bridging | Choose XC3S4000-4FGG676I only when XC3S2000-4FGG456I resource utilization exceeds 90% in final place-and-route |
Compared with XC3S1600E-4FGG456C, the XC3S2000-4FGG456I delivers 25% more logic cells and 11% more block RAM in identical packaging; versus XC3S4000-4FGG676I, it offers footprint compatibility with lower power and cost while retaining sufficient resources for mid-scale embedded control and video processing.
Availability
XC3S2000-4FGG456I is available at Aetrix Electronics and suitable for industrial motion control, avionics data concentrators, and medical video interface applications requiring stable component supply across extended product lifecycles.
Supply support for XC3S2000-4FGG456I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops and supports the legacy Spartan family under the AMD Adaptive SoC portfolio.
The Spartan-3 family, including XC3S2000-4FGG456I, was designed for cost-optimized, high-volume embedded applications requiring predictable timing, industrial temperature operation, and seamless integration with Xilinx ISE toolchain.
FAQ
What is the maximum operating frequency supported by XC3S2000-4FGG456I?
The XC3S2000-4FGG456I has a -4 speed grade, guaranteeing internal logic path timing performance up to 333 MHz. This applies to critical paths within CLBs and interconnect; actual system clock frequency depends on design topology, routing, and I/O standard selection. The device's eight DCMs support output frequencies up to 320 MHz with jitter below 200 ps peak-to-peak.
Does XC3S2000-4FGG456I support JTAG boundary-scan testing?
Yes, XC3S2000-4FGG456I fully complies with IEEE 1149.1 JTAG boundary-scan standards. It supports TAP controller access to configuration registers, I/O pin state monitoring, and interconnect testing. JTAG is used for in-circuit programming, debugging, and production test-no additional debug hardware beyond standard JTAG adapters is required for XC3S2000-4FGG456I.
What configuration modes are supported by XC3S2000-4FGG456I?
XC3S2000-4FGG456I supports master serial, slave serial, slave parallel, and JTAG configuration modes. Master serial uses an external PROM (e.g., XCFxxP); slave parallel allows microprocessor-controlled loading via 8- or 16-bit bus. All modes initialize the XC3S2000-4FGG456I configuration memory from external nonvolatile storage or host controller.
Can XC3S2000-4FGG456I operate in automotive environments?
No, XC3S2000-4FGG456I is rated for industrial temperature range (–40°C to +100°C), not automotive AEC-Q100 qualification. While it may function in some under-hood or infotainment locations, AMD does not certify XC3S2000-4FGG456I for automotive use cases requiring PPAP documentation, failure-in-time (FIT) reporting, or guaranteed operation beyond +105°C junction temperature.
Is XC3S2000-4FGG456I compatible with Xilinx ISE 14.7 design tools?
Yes, XC3S2000-4FGG456I is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. Device-specific libraries, simulation models, and constraint templates for XC3S2000-4FGG456I are included in ISE 14.7 Service Pack 5 and later versions.
XC3S2000-4FGG456I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 456-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5120
- Number of Logic Elements/Cells:
- 46080
- Total RAM Bits:
- 737280
- Number of I/O:
- 333
- Number of Gates:
- 2000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 456-FBGA (23x23)
XC3S2000-4FGG456I FAQ
1.How can I place an order for XC3S2000-4FGG456I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S2000-4FGG456I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S2000-4FGG456I reliable?
The price and inventory of XC3S2000-4FGG456I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S2000-4FGG456I is usually 5 days.
3.What payment methods are accepted for XC3S2000-4FGG456I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S2000-4FGG456I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S2000-4FGG456I?
XC3S2000-4FGG456I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S2000-4FGG456I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S2000-4FGG456I?
For technical support, including XC3S2000-4FGG456I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S2000-4FGG456I requirements.
6.How does Aetrix verify that XC3S2000-4FGG456I is sourced from the original manufacturer or authorized distributors?
All XC3S2000-4FGG456I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S2000-4FGG456I meets industry standards.
7.What is the process for return or replacement of XC3S2000-4FGG456I?
All XC3S2000-4FGG456I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S2000-4FGG456I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S2000-4FGG456I part is unused and in its original packaging.
Return procedure for XC3S2000-4FGG456I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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