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AMD XC3S2000-4FGG676C
- Part No.:
- XC3S2000-4FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S2000-4FGG676C.pdf
- Description:
- IC FPGA 489 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,336
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Product details
Overview
XC3S2000-4FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 17,280 logic cells, and 512 KB of block RAM. It features 480 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -4 speed grade (tPD = 3.6 ns). It is used in industrial control logic, video interface bridging, and reconfigurable data acquisition systems.
For engineers reviewing the XC3S2000-4FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, embedded RAM capacity, speed grade timing, and FBGA676 thermal-mechanical compatibility with high-pin-count PCB layouts.
Technical Context
The XC3S2000-4FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable slew rate and drive strength per bank.
It integrates twelve Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 17,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 2,000,000 - indicates relative ASIC-equivalent gate count for architectural sizing |
| Block RAM | 512 KB - supports FIFOs, buffers, lookup tables, and local memory without external chips |
| User I/O Pins | 480 - enables high-bandwidth parallel interfaces such as video data buses or multi-channel ADC/DAC links |
| Speed Grade | -4 (tPD = 3.6 ns) - defines worst-case propagation delay for critical path timing closure |
| Package | 676-pin FGG (Fine-Pitch BGA) - 27×27 mm body, 1.0 mm ball pitch, requires controlled-impedance PCB routing |
Pinout & Package
XC3S2000-4FGG676C uses a 676-ball fine-pitch BGA (FGG) package with 16 I/O banks, each supporting independent voltage and standard selection. Power delivery includes dedicated VCCINT (1.2 V), VCCAUX (2.5 V), and VCCO pins per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | Core logic supply (1.2 V); must be filtered locally to meet noise tolerance spec |
| K1 | VCCAUX | Auxiliary circuitry supply (2.5 V); powers DCMs, configuration logic, and JTAG |
| T1 | VCCO_0 | I/O bank 0 output driver supply; sets voltage level for all pins in Bank 0 |
| Y19 | PROGRAM_B | Active-low asynchronous reset; initiates configuration reload on falling edge |
| W19 | INIT_B | Open-drain status signal; goes high-Z after successful configuration |
| V19 | DONE | Open-drain configuration completion indicator; pulled high externally when config ends |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | 12 independent DCMs provide jitter-reduced clock synthesis, 0–255° phase shift, and 2×/4× frequency multiplication |
| SelectIO Technology | Per-bank I/O standards support mixed-voltage operation (1.2 V to 3.3 V) and hot-swap-safe input thresholds |
| Embedded Multipliers | 48 18×18-bit two's complement multipliers enable real-time DSP filtering and motor control algorithms |
| Configuration Security | Bitstream encryption option prevents reverse engineering of logic design in production units |
Applications
| Industrial Motion Control | Video Interface Conversion |
|---|---|
Use Scenario: Real-time closed-loop servo positioning in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers, encoder interpolation, and PWM generator with sub-microsecond latency. Use Value: 17,280 logic cells and 12 DCMs allow synchronized multi-axis timing and deterministic I/O response. | Use Scenario: Converting HDMI 1.3a video streams to LVDS for embedded display panels. IC Role / Device Role / Timing Role: XC3S2000-4FGG676C acts as protocol bridge and pixel clock domain translator. Use Value: 480 user I/Os and SelectIO support simultaneous DDR video data capture and LVDS transmission at 74.25 MHz. |
| Reconfigurable Data Acquisition | Communications Protocol Gateway |
Use Scenario: Modular test equipment acquiring analog sensor data across 32 channels at 1 MS/s. IC Role / Device Role / Timing Role: FPGA manages time-interleaved ADC sampling, real-time FIR filtering, and PCIe endpoint packetization. Use Value: 512 KB block RAM buffers full acquisition frames while logic cells implement filter coefficients and trigger logic. | Use Scenario: Translating Modbus RTU over RS-485 to EtherCAT for factory automation networks. IC Role / Device Role / Timing Role: XC3S2000-4FGG676C serves as deterministic protocol state machine and packet scheduler. Use Value: Independent I/O banks isolate RS-485 transceiver voltages from EtherCAT PHY supplies, preventing ground loop interference. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S2500-4FGG676C | 2,500K gates, 20,160 logic cells, same package and speed grade | Higher logic density supports larger state machines or additional IP cores | Choose when design requires >17,280 logic cells but retains identical board layout and thermal profile |
| XC3S1600E-4FGG484C | 1,600K gates, 14,080 logic cells, 484-pin FBGA, lower I/O count (372) | Smaller footprint and cost; insufficient for 480-I/O video interface designs | Consider only if logic and I/O requirements scale down and PCB redesign is acceptable |
Compared with XC3S2000-4FGG676C, the XC3S2500-4FGG676C offers headroom for future feature expansion without layout change, while the XC3S1600E-4FGG484C reduces cost and size at the expense of I/O count and logic capacity-making it unsuitable for pin-constrained high-bandwidth applications.
Availability
XC3S2000-4FGG676C is available at Aetrix Electronics and suitable for industrial motion control, video interface conversion, and reconfigurable data acquisition requiring stable component supply across extended product lifecycles.
Supply support for XC3S2000-4FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines.
The Spartan-3 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation in industrial and embedded systems.
FAQ
What is the maximum operating frequency of the XC3S2000-4FGG676C?
The XC3S2000-4FGG676C has a -4 speed grade with a typical maximum clock frequency of 333 MHz for internal logic paths. This value depends on design placement and routing; actual achievable frequency is verified during static timing analysis using Xilinx ISE tools. The XC3S2000-4FGG676C DCMs support output frequencies up to 320 MHz with jitter specifications defined in the device data sheet.
Does the XC3S2000-4FGG676C support JTAG boundary-scan testing?
Yes, the XC3S2000-4FGG676C fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level interconnect testing and in-system programming. TDI, TDO, TMS, and TCK pins are dedicated and electrically compliant. The XC3S2000-4FGG676C also allows concurrent JTAG configuration and debug access during operation using ChipScope Pro or third-party tools.
What configuration modes does the XC3S2000-4FGG676C support?
The XC3S2000-4FGG676C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. External PROM (e.g., XCFxxP series) is commonly used for Master Serial mode. The XC3S2000-4FGG676C also permits processor-controlled configuration via Slave Parallel mode using an 8- or 16-bit host bus interface.
Is the XC3S2000-4FGG676C RoHS compliant?
Yes, the XC3S2000-4FGG676C is manufactured in a RoHS-compliant process and meets EU Directive 2011/65/EU requirements. Lead-free soldering profiles and moisture sensitivity level (MSL) 3 handling instructions are specified in the device packaging documentation. The XC3S2000-4FGG676C carries the "Pb-Free" marking on its top-side laser etch.
Can the XC3S2000-4FGG676C operate with multiple I/O voltage standards simultaneously?
Yes, the XC3S2000-4FGG676C supports mixed I/O standards across its 16 banks, with each bank independently configurable for VCCO levels from 1.2 V to 3.3 V. This allows concurrent LVCMOS33, LVTTL, and SSTL18 signaling on a single XC3S2000-4FGG676C device, provided proper bank partitioning and decoupling are implemented.
XC3S2000-4FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5120
- Number of Logic Elements/Cells:
- 46080
- Total RAM Bits:
- 737280
- Number of I/O:
- 489
- Number of Gates:
- 2000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S2000-4FGG676C FAQ
1.How can I place an order for XC3S2000-4FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S2000-4FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S2000-4FGG676C reliable?
The price and inventory of XC3S2000-4FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S2000-4FGG676C is usually 5 days.
3.What payment methods are accepted for XC3S2000-4FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S2000-4FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S2000-4FGG676C?
XC3S2000-4FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S2000-4FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S2000-4FGG676C?
For technical support, including XC3S2000-4FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S2000-4FGG676C requirements.
6.How does Aetrix verify that XC3S2000-4FGG676C is sourced from the original manufacturer or authorized distributors?
All XC3S2000-4FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S2000-4FGG676C meets industry standards.
7.What is the process for return or replacement of XC3S2000-4FGG676C?
All XC3S2000-4FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S2000-4FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S2000-4FGG676C part is unused and in its original packaging.
Return procedure for XC3S2000-4FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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