AMD XC3S2000-4FGG676I

Overview

XC3S2000-4FGG676I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 173 I/O pins, and configured in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to LVDS and SSTL, and targets high-volume embedded control and interface bridging applications.

For engineers reviewing the XC3S2000-4FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O voltage flexibility, embedded block RAM size, and thermal performance in industrial temperature range (-40°C to +100°C).

Technical Context

The XC3S2000-4FGG676I implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with 24,064 logic cells and 576 Kbits of total block RAM. It integrates twelve 18×18 multipliers and supports digital clock managers (DCMs) for internal clock synthesis and phase alignment.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, with support for IEEE 1149.1 compliance. The device uses 1.2 V core voltage and supports dual-voltage I/O banks operating at 3.3 V, 2.5 V, 1.8 V, or 1.5 V levels.

Key Specifications

Pinout & Package

XC3S2000-4FGG676I is housed in a 676-ball Fine-Pitch BGA (FBGA) package with 1.0 mm ball pitch, 27 mm × 27 mm body size, and Pb-free (RoHS-compliant) finish. Thermal pad on underside requires solder paste stencil design per Xilinx packaging guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Compared with XC3S2000-4FGG676I, the XC3S1600E-4FGG484C reduces footprint and cost but sacrifices logic headroom and thermal margin, while the XC3S4000-4FGG900I increases board area and routing complexity to deliver 37% more logic cells and expanded I/O count for next-generation functionality.

Availability

XC3S2000-4FGG676I is available at Aetrix Electronics and suitable for industrial motion control, protocol bridge systems, and video interface adapters requiring stable component supply across long-lifecycle production programs.

Supply support for XC3S2000-4FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-optimized, high-volume embedded applications.

The Spartan-3 family was designed to deliver programmable logic density and I/O flexibility for industrial, automotive, and communications equipment where ASIC NRE costs are prohibitive.

FAQ

What is the maximum supported I/O standard for XC3S2000-4FGG676I?

The XC3S2000-4FGG676I supports LVDS, RSDS, SSTL-2, SSTL-3, HSTL-I, and single-ended standards including LVCMOS and LVTTL. Each I/O bank can be independently configured for voltage levels from 1.2 V to 3.3 V, enabling mixed-voltage interface designs without level shifters.

Does XC3S2000-4FGG676I include on-chip clock generation capability?

Yes, XC3S2000-4FGG676I integrates Digital Clock Managers (DCMs) that provide clock doubling, halving, phase shifting, duty cycle correction, and jitter reduction. Up to four DCMs are available, each supporting input frequencies from 5 MHz to 333 MHz.

What configuration modes are supported by XC3S2000-4FGG676I?

XC3S2000-4FGG676I supports Master Serial, Slave Serial, Slave Parallel, and JTAG modes. Configuration typically uses Master Serial with external SPI PROM, but JTAG allows in-system programming and boundary-scan testing during production and field service.

Is XC3S2000-4FGG676I RoHS compliant?

Yes, XC3S2000-4FGG676I is manufactured with lead-free (Pb-free) packaging and complies with EU RoHS Directive 2011/65/EU. The FGG676 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3.

What is the minimum recommended decoupling capacitance for VCCINT on XC3S2000-4FGG676I?

Xilinx recommends ≥22 µF bulk capacitance plus ≥10 × 0.1 µF ceramic capacitors placed within 10 mm of the VCCINT pins. This ensures stable 1.2 V core supply under transient current demands from simultaneous switching outputs and logic transitions.