AMD XC3S2000-5FGG456C

Overview

XC3S2000-5FGG456C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 173 I/O pins, and a -5 speed grade operating at up to 333 MHz logic performance. It integrates 112 embedded 18×18 multipliers, 448 Kbits of block RAM, and supports SelectIO™ standards including LVCMOS, LVTTL, PCI, and HSTL.

For engineers reviewing the XC3S2000-5FGG456C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, embedded multiplier density, block RAM capacity, and support for 3.3V/2.5V/1.8V interface standards in cost-sensitive high-volume logic designs.

Technical Context

The XC3S2000-5FGG456C implements a configurable logic block (CLB) architecture with four 6-input LUTs and eight flip-flops per CLB, enabling efficient implementation of synchronous logic and state machines. It features dedicated carry logic for high-speed arithmetic and distributed RAM for fast local storage.

Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan. The device supports IEEE 1149.1 compliance and includes internal configuration monitoring with CRC error detection.

Key Specifications

Pinout & Package

XC3S2000-5FGG456C is housed in a 456-pin Fine-Pitch Ball Grid Array (FBGA) package with 29×29 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) finish. The package supports thermal dissipation up to 2.5 W under typical operating conditions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XC3S1600E-5FGG456C, the XC3S2000-5FGG456C delivers 25% more logic resources and 17% more embedded multipliers while maintaining identical 456-pin FBGA footprint; compared with XC3S4000-5FGG676C, it offers lower power and smaller PCB area at the cost of reduced scalability.

Availability

XC3S2000-5FGG456C is available at Aetrix Electronics and suitable for industrial motor control, video bridge systems, automotive ADAS preprocessing, and LTE baseband acceleration requiring stable component supply and long-term production support.

Supply support for XC3S2000-5FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.

The Spartan-3 family was originally designed by Xilinx for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial automation and communications infrastructure.

FAQ

What is the maximum operating frequency of the XC3S2000-5FGG456C?

The XC3S2000-5FGG456C has a -5 speed grade, meaning its worst-case internal logic delay supports guaranteed timing closure up to 333 MHz for critical paths under standard junction temperature and voltage conditions. Actual achievable clock frequencies depend on design topology, placement, and routing, but the device's Digital Clock Managers (DCMs) can synthesize outputs up to 320 MHz with jitter specifications compliant to industrial standards.

Does the XC3S2000-5FGG456C support partial reconfiguration?

Yes, the XC3S2000-5FGG456C supports dynamic partial reconfiguration through its PROGRAM_B pin and configuration logic. This allows selected regions of the FPGA fabric to be reloaded with new bitstreams while the rest of the design remains operational. Implementation requires Xilinx ISE 14.7 or later tools and adherence to modular design constraints, but no hardware modification is needed beyond standard configuration circuitry already present for XC3S2000-5FGG456C.

What I/O standards are supported by the XC3S2000-5FGG456C?

The XC3S2000-5FGG456C supports 19 SelectIO™ standards including LVCMOS (1.2V to 3.3V), LVTTL, PCI, HSTL Class I/II, and SSTL2 Class I/II. Each bank is independently configurable for voltage and standard, enabling mixed-voltage board designs. I/O banks must be powered at compatible voltages (e.g., 3.3V for LVCMOS33, 1.8V for HSTL), and termination resistors are required per standard specification for signal integrity.

Is the XC3S2000-5FGG456C RoHS compliant?

Yes, the XC3S2000-5FGG456C is manufactured with lead-free (Pb-free) packaging and complies with EU RoHS Directive 2011/65/EU and related amendments. The FGG456 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. Full compliance documentation is available in AMD's official product change notifications for the Spartan-3 family.

How is the XC3S2000-5FGG456C configured after power-up?

The XC3S2000-5FGG456C supports Master Serial configuration mode by default, loading bitstream data from an external SPI PROM via the CCLK and DIN pins. Alternatively, it can be configured through JTAG boundary-scan using standard IEEE 1149.1 tools. Configuration occurs automatically on power-up if INIT_B and PROGRAM_B are asserted correctly; successful configuration is indicated by DONE pin going high and INIT_B releasing.