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AMD XC3S2000-5FGG676C
- Part No.:
- XC3S2000-5FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC3S2000-5FGG676C.pdf
- Description:
- IC FPGA 489 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,837
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Product details
Overview
XC3S2000-5FGG676C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 173,952 logic cells, and 4,032 Kbits of block RAM. It features 576 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package and operates at -5 speed grade (5 ns CLB delay). It is used in industrial control logic, video processing pipelines, and reconfigurable communication interfaces.
For engineers reviewing the XC3S2000-5FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, block RAM capacity, speed grade timing closure, and FBGA676 thermal-mechanical compatibility with high-pin-count PCB layouts.
Technical Context
The XC3S2000-5FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL across its 576 user I/O pins.
It integrates global clock networks with eight fully programmable DLLs for clock deskew and phase alignment, and supports JTAG boundary-scan (IEEE 1149.1) and configuration via Master Serial, Slave Serial, or SelectMAP modes using external PROM or processor.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Capacity | 2,000,000 system gates - defines maximum combinational logic complexity and state machine scale. |
| Logic Cells | 173,952 - determines parallel processing capability and resource availability for pipelined designs. |
| Block RAM | 4,032 Kbits - enables on-chip buffering for video frame stores, FIFOs, or lookup tables without external memory. |
| User I/O Pins | 576 - supports high-bandwidth parallel interfaces such as DDR SDRAM controllers or camera sensor buses. |
| Speed Grade | -5 (5 ns CLB delay) - guarantees timing closure for designs targeting 200 MHz system clocks with moderate routing delay. |
| Package | 676-pin FCBGA (FGG676) - provides 1.0 mm ball pitch, thermal performance suitable for sustained 2–3 W operation. |
Pinout & Package
XC3S2000-5FGG676C is housed in a 27×27 mm, 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.0 mm ball pitch, designed for thermal dissipation and high I/O density in space-constrained industrial and video systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling. |
| VCCO_0–VCCO_15 | I/O bank power | 1.2–3.3 V selectable per bank; enables mixed-voltage interface support (e.g., 3.3 V GPIO + 1.8 V DDR). |
| CLK0–CLK7 | Dedicated global clock inputs | Connect to on-chip DLLs for low-skew clock distribution across all logic regions. |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables IEEE 1149.1-compliant programming, debugging, and interconnect testing. |
| INIT_B/PROGRAM_B/DONE | Configuration control | Manage PROM-based startup sequence: PROGRAM_B initiates reload; DONE confirms bitstream loading completion. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 18×18 multipliers | Supports real-time DSP functions (e.g., FIR filtering) without consuming general-purpose logic resources. |
| SelectIO™ technology | Per-bank voltage and standard flexibility allows direct interfacing to legacy and modern peripherals without level shifters. |
| Eight digital clock managers (DCMs) | Provide jitter reduction, frequency synthesis, and phase shifting - critical for video pixel clock generation and data capture alignment. |
| Configurable logic blocks (CLBs) | Each CLB contains four 3-input LUTs and eight flip-flops, enabling efficient implementation of synchronous state machines and arithmetic units. |
Applications
| Industrial Motion Control | Video Frame Processing |
|---|---|
Use Scenario: Real-time servo loop execution and encoder feedback decoding in CNC machines. IC Role / Device Role / Timing Role: FPGA fabric implements deterministic finite-state machines and PWM generators synchronized to 10–20 MHz encoder clocks. Use Value: 576 I/Os enable parallel connection to multiple axes; -5 speed grade ensures sub-50 ns loop latency. | Use Scenario: HD video scaling, color-space conversion, and HDMI output formatting in broadcast encoders. IC Role / Device Role / Timing Role: Configurable logic processes pixel streams; block RAM buffers full frames for line-rate processing. Use Value: 4,032 Kbits block RAM holds two 720p frames at 8-bit depth; DCMs generate precise 74.25 MHz HDMI TMDS clocks. |
| Reconfigurable Baseband Processing | PCI Express Endpoint Interface |
Use Scenario: Protocol-adaptable wireless modem baseband in test equipment and field-deployable radios. IC Role / Device Role / Timing Role: FPGA implements soft-core processors and custom MAC layers; logic cells adapt modulation schemes on-the-fly. Use Value: 173,952 logic cells accommodate QPSK/16-QAM modems plus FEC engines; SelectIO supports 100 MHz parallel bus interfaces. | Use Scenario: High-throughput data acquisition card connecting FPGA-accelerated signal processing to host CPU via PCIe x1. IC Role / Device Role / Timing Role: Implements PCIe endpoint logic with DMA engine and BAR mapping; uses dedicated I/O banks for 3.3 V signaling. Use Value: 576 I/Os allocate 36 pins for PCIe x1 (including REFCLK, PERST#, and differential pairs); VCCO banks configured for 3.3 V compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S4000-5FGG900C | Higher logic density (4M gates, 299,520 CLBs), larger 900-ball FGG900 package, same -5 speed grade. | Required when design exceeds XC3S2000-5FGG676C resource limits - e.g., dual-channel HD video + Ethernet MAC + PCIe endpoint. | Select only if additional CLBs, block RAM, or I/Os are verified necessary; board redesign required due to larger footprint and different ball map. |
| XC3S1000-4FGG456C | Lower logic density (1M gates, 86,976 CLBs), 456-ball FGG456 package, slower -4 speed grade (6.5 ns CLB delay). | Suitable for cost-sensitive, lower-bandwidth applications like single-sensor data aggregation or simple protocol bridging. | Choose for reduced BOM cost and simpler PCB layout where timing margin and resource headroom are less critical. |
Compared with XC3S2000-5FGG676C, XC3S4000-5FGG900C offers scalable logic and I/O for complex multi-function systems but demands mechanical redesign, while XC3S1000-4FGG456C trades performance and capacity for lower cost and layout simplicity in constrained applications.
Availability
XC3S2000-5FGG676C is available at Aetrix Electronics and suitable for industrial motion control, HD video processing, and reconfigurable communications requiring stable component supply and long-term production continuity.
Supply support for XC3S2000-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, ACAPs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3 family was engineered for cost-sensitive, high-volume applications demanding predictable performance, low power, and broad I/O flexibility - especially in industrial automation and video infrastructure.
FAQ
What is the maximum operating frequency supported by XC3S2000-5FGG676C?
The XC3S2000-5FGG676C has a -5 speed grade, specifying a 5 ns CLB propagation delay. This enables reliable operation up to 200 MHz for well-optimized synchronous designs with moderate routing congestion. Actual achievable frequency depends on logic depth, register placement, and I/O timing constraints - verified during place-and-route in Xilinx ISE.
Does XC3S2000-5FGG676C support configuration via SPI flash memory?
No - XC3S2000-5FGG676C does not natively support SPI flash configuration. It requires Parallel NOR flash (via SelectMAP mode) or serial PROM (Xilinx Platform Flash XL) for master-mode configuration. External microcontrollers may implement slave-serial configuration using the FPGA's dedicated configuration pins.
What I/O standards are supported by XC3S2000-5FGG676C?
XC3S2000-5FGG676C supports LVCMOS, LVTTL, PCI, HSTL Class I/II, and SSTL2 Class I/II across its 16 I/O banks. Each bank is independently powered (VCCO), allowing mixed-voltage operation - for example, 3.3 V for legacy GPIO and 1.8 V for DDR memory interface on adjacent banks.
How much block RAM is available in XC3S2000-5FGG676C, and how is it organized?
XC3S2000-5FGG676C provides 4,032 Kbits of total block RAM, implemented as 96 × 18-Kbit dual-port RAM blocks. Each block can be configured as 18K × 1, 9K × 2, 4K × 4, or other combinations, supporting true dual-port read/write operations essential for video line buffers and FIFOs.
Is XC3S2000-5FGG676C still in active production and supported by AMD/Xilinx tools?
XC3S2000-5FGG676C is a mature Spartan-3 device no longer in active production, but remains supported in Xilinx ISE 14.7 for design, simulation, and bitstream generation. AMD maintains legacy documentation and configuration guidelines, and Aetrix Electronics provides traceable, tested inventory for ongoing industrial deployments.
XC3S2000-5FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 5120
- Number of Logic Elements/Cells:
- 46080
- Total RAM Bits:
- 737280
- Number of I/O:
- 489
- Number of Gates:
- 2000000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC3S2000-5FGG676C FAQ
1.How can I place an order for XC3S2000-5FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S2000-5FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S2000-5FGG676C reliable?
The price and inventory of XC3S2000-5FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S2000-5FGG676C is usually 5 days.
3.What payment methods are accepted for XC3S2000-5FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S2000-5FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S2000-5FGG676C?
XC3S2000-5FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S2000-5FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S2000-5FGG676C?
For technical support, including XC3S2000-5FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S2000-5FGG676C requirements.
6.How does Aetrix verify that XC3S2000-5FGG676C is sourced from the original manufacturer or authorized distributors?
All XC3S2000-5FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S2000-5FGG676C meets industry standards.
7.What is the process for return or replacement of XC3S2000-5FGG676C?
All XC3S2000-5FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S2000-5FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S2000-5FGG676C part is unused and in its original packaging.
Return procedure for XC3S2000-5FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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