AMD XC3S2000-5FGG900C

Overview

XC3S2000-5FGG900C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 2,000,000 system gates, 17,280 logic cells, and 432 I/O pins in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -5 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 622 Mbps, and targets high-volume embedded control and interface bridging applications.

For engineers reviewing the XC3S2000-5FGG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, logic cell density, speed grade timing closure, and compatibility with legacy Spartan-3 design flows and toolchains.

Technical Context

The XC3S2000-5FGG900C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (48 × 18 Kb), and dedicated multipliers (128 × 18-bit). It supports dual-edge clocking, global clock networks with eight low-skew buffers, and internal configuration via Master Serial or JTAG modes.

It integrates SelectIO™ technology supporting LVCMOS, LVTTL, PCI, HSTL, SSTL, and differential standards including LVDS and RSDS. Configuration is performed through on-chip active serial PROM or external master mode controllers, with full support for IEEE 1149.1 boundary-scan testing.

Key Specifications

Pinout & Package

The XC3S2000-5FGG900C is housed in a 900-ball Fine-Pitch Ball Grid Array (FGG) package with 31×31 ball array, 1.0 mm pitch, and thermal pad. Pin functions are defined per Xilinx DS099 v2.5 and include dedicated configuration, clock, JTAG, and I/O banks grouped by voltage and standard compliance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S2000-5FGG900C, the XC3S2500-5FGG900C offers headroom for future feature expansion without layout change, while the XC3S1600E-5FGG456C reduces board area and cost at the expense of I/O count and embedded memory-making it suitable only for scaled-down derivatives.

Availability

XC3S2000-5FGG900C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging acquisition, and legacy interface bridging requiring stable component supply across extended product lifecycles.

Supply support for XC3S2000-5FGG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan-3 product family for long-lifecycle industrial and aerospace applications.

The Spartan-3 family was designed for cost-optimized, high-volume digital logic implementation where ASIC-like performance is needed without non-recurring engineering costs.

FAQ

What is the maximum operating frequency supported by XC3S2000-5FGG900C?

The XC3S2000-5FGG900C has a -5 speed grade specifying a maximum input-to-output propagation delay (tPD) of 4.5 ns under typical conditions. This enables synchronous logic operation up to 220 MHz in well-constrained timing paths. Actual achievable frequency depends on design complexity, placement, and routing; timing closure must be verified using Xilinx ISE 14.7 or compatible tools. The XC3S2000-5FGG900C does not guarantee 220 MHz across all paths without static timing analysis.

Does XC3S2000-5FGG900C support JTAG configuration?

Yes, XC3S2000-5FGG900C fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and in-system programming. Pins TCK, TMS, TDI, and TDO are dedicated and electrically compliant. JTAG mode allows bitstream loading without external PROM and enables real-time visibility into internal signals during development. The XC3S2000-5FGG900C requires no additional hardware for JTAG operation beyond standard 14-pin header connectivity.

What I/O standards are supported by XC3S2000-5FGG900C?

XC3S2000-5FGG900C supports 19 SelectIO™ standards across 12 I/O banks, including LVCMOS (1.2 V to 3.3 V), LVTTL, PCI, HSTL Class I/II, SSTL2 Class I/II, and differential standards LVDS, RSDS, and BLVDS. Each bank is independently voltage-referenced. The XC3S2000-5FGG900C does not support newer standards such as MIPI or DDR4, and its LVDS implementation is limited to point-to-point topologies without built-in termination.

Is XC3S2000-5FGG900C still in production?

XC3S2000-5FGG900C is listed as Not Recommended for New Designs (NRND) by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics with guaranteed long-term supply for existing programs. No end-of-life notice has been issued, and last-time-buy windows are managed per customer demand. The XC3S2000-5FGG900C continues to be supported with legacy ISE toolchain updates and documentation archives.

What configuration modes does XC3S2000-5FGG900C support?

XC3S2000-5FGG900C supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial uses on-chip oscillator to drive CCLK and load bitstream from external SPI PROM. Slave modes require external controller to generate CCLK and provide data. JTAG enables direct programming and boundary-scan. The XC3S2000-5FGG900C does not support BPI or NAND flash configuration, and its internal oscillator frequency is fixed at 50 MHz for Master Serial use.