My Inquiry
My Account
AMD XC3S200-4FT256I
- Part No.:
- XC3S200-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200-4FT256I.pdf
- Description:
- IC FPGA 173 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,389
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S200-4FT256I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,320 logic cells, and 216 Kbits of block RAM, configured in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package for embedded control and digital signal processing applications.
For engineers reviewing the XC3S200-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (173 user I/Os), speed grade (-4), industrial temperature range (-40°C to +100°C), and JTAG configuration support.
Technical Context
The XC3S200-4FT256I implements a fully SRAM-based configurable logic architecture with dedicated carry chains, distributed RAM, and four digital clock managers (DCMs) supporting phase shifting, frequency synthesis, and duty cycle correction. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and HSTL.
Configuration is performed via master serial mode using external PROM or microprocessor-controlled slave parallel mode. The device includes internal pull-up resistors on configuration pins and supports boundary-scan testing per IEEE 1149.1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,320 - provides combinational and sequential logic capacity for medium-complexity digital controllers. |
| System Gates | 200,000 - indicates overall logic density suitable for protocol bridging and peripheral interface logic. |
| User I/O Pins | 173 - supports high-pin-count interfaces such as parallel buses, video timing, or multi-channel ADC/DAC control. |
| Block RAM | 216 Kbits - enables local data buffering, FIFO implementation, or small lookup tables without external memory. |
| DCMs | 4 - allows independent clock domain management for video sync, data sampling, and system clock distribution. |
| Speed Grade | -4 - guarantees timing closure up to 333 MHz for internal logic and 220 MHz for I/Os at industrial temperature. |
| Operating Temp | -40°C to +100°C - qualified for industrial environments including motor drives and base station subsystems. |
Pinout & Package
XC3S200-4FT256I is housed in a 256-ball fine-pitch BGA (FT256) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation in sustained operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic; requires low-noise regulation and local decoupling. |
| VCCO | I/O bank power | Configurable 1.2–3.3 V per bank; enables mixed-voltage interface design. |
| PROGRAM_B | Active-low configuration initiator | Pulls low to reset configuration logic and reload bitstream from external source. |
| DONE | Configuration status indicator | Open-drain output that goes high when configuration completes successfully. |
| TCK/TMS/TDI/TDO | JTAG test interface | Supports IEEE 1149.1 boundary scan, in-circuit programming, and debug access. |
| CLK0–CLK3 | DCM input clocks | Dedicated global clock inputs routed to respective DCMs for jitter-tolerant clocking. |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Four independent DCMs provide deterministic clock phase alignment and frequency multiplication without external PLL components. |
| SelectIO Technology | Per-bank voltage selection and programmable drive strength enable direct interfacing to legacy and modern peripherals. |
| Embedded Multipliers | Four 18×18-bit signed multipliers support real-time filtering, motor control algorithms, and basic DSP functions. |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with flip-flops and LUTs, enabling efficient state machine and pipeline implementation. |
| Boundary-Scan Support | Full IEEE 1149.1 compliance simplifies board-level test development and manufacturing validation. |
Applications
| Industrial Motor Control | Video Timing Generator |
|---|---|
Use Scenario: Real-time PWM generation, encoder feedback decoding, and safety monitoring in servo drives. IC Role / Device Role / Timing Role: Configurable logic fabric and DCMs implement closed-loop timing with sub-microsecond jitter control. Use Value: Enables deterministic response to fault conditions and synchronized multi-axis motion without external timing ICs. | Use Scenario: Generating precise horizontal/vertical sync, pixel clock, and blanking intervals for LCD and camera interfaces. IC Role / Device Role / Timing Role: FPGA acts as programmable video controller with DCM-derived pixel clocks and synchronous I/O timing. Use Value: Supports multiple display resolutions and interface standards (e.g., RGB, BT.656) using same hardware platform. |
| Communications Protocol Bridge | Test Equipment Logic Analyzer Core |
Use Scenario: Translating between UART, SPI, and custom serial protocols in field-deployable instrumentation. IC Role / Device Role / Timing Role: Implements dual-port FIFOs, state machines, and baud-rate generators with independent clock domains. Use Value: Eliminates need for discrete level shifters and protocol-specific ASICs while maintaining timing integrity across domains. | Use Scenario: Capturing and triggering on high-speed digital signals in benchtop logic analyzers. IC Role / Device Role / Timing Role: Provides deep sample memory control, pattern matching logic, and clock-domain crossing for acquisition engines. Use Value: Delivers 200+ MHz sampling capability with on-chip trigger evaluation, reducing dependency on host CPU bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400-4FT256I | Higher logic density (8,064 CLBs, 400K gates), same package and speed grade. | Supports larger state machines and wider datapaths; requires identical PCB layout but higher power delivery margin. | Choose when additional logic resources or embedded multipliers are needed without changing footprint. |
| XC3S1000-4FT256I | 12,312 CLBs, 1M system gates, same FT256 package and -4 speed grade. | Enables full soft-CPU integration (e.g., MicroBlaze) and complex packet processing; demands stricter thermal management. | Prefer for designs requiring integrated processor subsystems or multi-gigabit transceiver support (via add-on chips). |
Compared with XC3S200-4FT256I, the XC3S400-4FT256I offers 87% more logic cells at identical pinout and timing, while XC3S1000-4FT256I adds soft-processor capability and deeper memory-both retain compatibility with existing JTAG and configuration infrastructure.
Availability
XC3S200-4FT256I is available at Aetrix Electronics and suitable for industrial motor control, video timing generation, and communications protocol bridging requiring stable component supply across extended product lifecycles.
Supply support for XC3S200-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for heterogeneous compute acceleration.
The Spartan-3 family, including XC3S200-4FT256I, was designed for cost-sensitive, high-volume embedded applications requiring reconfigurable logic with predictable timing and industrial-grade reliability.
FAQ
What is the maximum operating frequency of the XC3S200-4FT256I?
The XC3S200-4FT256I speed grade -4 guarantees internal logic performance up to 333 MHz and I/O toggle rates up to 220 MHz under industrial temperature conditions. Actual achievable frequency depends on design placement, routing, and clock network usage - verified through static timing analysis in Xilinx ISE.
Does the XC3S200-4FT256I support JTAG boundary-scan testing?
Yes, the XC3S200-4FT256I fully complies with IEEE 1149.1 and includes dedicated TCK, TMS, TDI, and TDO pins. This enables in-circuit programming, debugging, and board-level test access without requiring additional test fixtures or probe points.
Can the XC3S200-4FT256I be configured using a microcontroller?
Yes, the XC3S200-4FT256I supports slave parallel configuration mode, allowing a microcontroller to load the configuration bitstream directly into the device via its 8-bit or 16-bit data bus. This enables field-upgradable logic without external PROM.
What voltage levels does the XC3S200-4FT256I support for I/O banks?
The XC3S200-4FT256I supports per-bank I/O voltages from 1.2 V to 3.3 V, including LVCMOS, LVTTL, PCI, and HSTL standards. Each bank's VCCO must be set independently, enabling mixed-voltage interface designs such as 3.3 V microcontroller communication with 1.8 V memory devices.
Is the XC3S200-4FT256I still in active production?
The XC3S200-4FT256I is no longer in active production by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics' long-term inventory program with full traceability and extended lifecycle support for legacy industrial systems.
XC3S200-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 480
- Number of Logic Elements/Cells:
- 4320
- Total RAM Bits:
- 221184
- Number of I/O:
- 173
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200-4FT256I FAQ
1.How can I place an order for XC3S200-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200-4FT256I reliable?
The price and inventory of XC3S200-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S200-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200-4FT256I?
XC3S200-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200-4FT256I?
For technical support, including XC3S200-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200-4FT256I requirements.
6.How does Aetrix verify that XC3S200-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S200-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S200-4FT256I?
All XC3S200-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200-4FT256I part is unused and in its original packaging.
Return procedure for XC3S200-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S200-4FT256I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
