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AMD XC3S200-4FTG256C
- Part No.:
- XC3S200-4FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200-4FTG256C.pdf
- Description:
- IC FPGA 173 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,748
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Product details
Overview
XC3S200-4FTG256C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,320 logic cells, 216 Kbits of block RAM, and operates at -4 speed grade (tPD = 4.6 ns). It features 173 user I/Os in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package and is used in industrial control logic, digital video processing, and embedded interface bridging.
For engineers reviewing the XC3S200-4FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, block RAM capacity, speed grade timing, and FTBGA256 thermal/mechanical compatibility for PCB layout and signal integrity planning.
Technical Context
The XC3S200-4FTG256C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It includes twelve 18×18 multipliers and supports SelectIO™ standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via Master Serial mode using an external PROM or through JTAG boundary-scan. The device supports partial reconfiguration and includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction across up to eight independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,320 - defines maximum combinational/sequential logic capacity per design |
| System Gates | 200,000 - legacy metric estimating equivalent ASIC gate count for logic density comparison |
| Block RAM | 216 Kbits - supports dual-port memory buffers, FIFOs, and lookup tables without external memory |
| User I/O Pins | 173 - enables high-channel-count interface bridging and peripheral expansion |
| Speed Grade | -4 - guarantees maximum clock-to-out delay ≤4.6 ns and setup time ≤1.9 ns under worst-case conditions |
| Package | FTBGA256 - 17 × 17 mm footprint with 0.8 mm pitch, optimized for thermal dissipation and routing density |
Pinout & Package
XC3S200-4FTG256C is housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) package with 173 user-configurable I/Os, 8 dedicated configuration pins (e.g., INIT_B, PROGRAM_B, DONE), 4 global clock inputs, and power/ground balls distributed across the array for low-noise operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asserting low reloads configuration bitstream from external PROM or host processor |
| INIT_B | Open-Drain Status Output | Indicates configuration memory clearing or CRC error during startup |
| DONE | Open-Drain Status Output | Signals successful completion of configuration loading and releases I/Os from high-Z state |
| CCLK | Configuration Clock Input | Drives serial bitstream transfer during Master Serial mode; max 50 MHz |
| IO_L0N_0 | User I/O Bank 0, Differential Pair Negative | Supports LVDS, LVPECL, or single-ended signaling depending on bank voltage and termination |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, ±1% duty cycle correction, and phase shift resolution down to 60 ps |
| SelectIO™ Technology | Enables mixed-voltage I/O banks (1.2V–3.3V) with programmable drive strength and slew rate control per pin |
| Embedded Multipliers | Twelve 18×18 signed/unsigned multipliers support real-time DSP functions without external components |
| Partial Reconfiguration | Allows dynamic logic module swapping during operation-critical for adaptive communication protocols and runtime feature updates |
Applications
| Industrial PLC Logic | Digital Video Interface Bridge |
|---|---|
Use Scenario: Real-time motion control sequencing and sensor feedback aggregation in factory automation cabinets. IC Role / Device Role / Timing Role: FPGA acts as deterministic logic engine executing ladder logic and PID loops with sub-microsecond I/O response latency. Use Value: 173 I/Os enable direct connection to 32+ field devices; DCM ensures synchronized sampling across analog input modules. | Use Scenario: Converting HDMI pixel data to parallel RGB for legacy display controllers in medical imaging systems. IC Role / Device Role / Timing Role: Protocol translator and timing adapter managing pixel clock domain crossing between 148.5 MHz HDMI and 65 MHz RGB interfaces. Use Value: Embedded 18×18 multipliers process chroma subsampling in real time; SelectIO™ supports both TMDS and LVCMOS voltage levels. |
| Communications Backplane Interface | Test Equipment Pattern Generator |
Use Scenario: Aggregating and retiming multiple T1/E1 line cards into a common backplane bus in telecom access nodes. IC Role / Device Role / Timing Role: SerDes-less parallel interface conditioner with elastic buffering and jitter cleanup via DCM-based clock recovery. Use Value: 216 Kbits block RAM stores frame alignment buffers; -4 speed grade meets 2.048 Mbps setup timing across temperature range. | Use Scenario: Generating high-fidelity digital stimulus waveforms for IC functional validation in ATE platforms. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing control over 128-bit wide parallel output vectors. Use Value: 4,320 logic cells implement deep instruction pipelines; FTBGA256 package supports controlled-impedance routing for <100 ps skew across all outputs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400-4FTG256C | Higher logic density (8,064 LCs), same package and speed grade | Supports larger state machines and additional protocol stacks without board redesign | Choose when future firmware scalability or multi-protocol coexistence is required |
| XC3S200A-4FTG256C | Same logic resources but improved static power consumption and enhanced DCM jitter specs | Better suited for battery-backed or thermally constrained deployments where standby current matters | Prefer for new designs targeting lower quiescent power and tighter clock stability |
Compared with XC3S200-4FTG256C, the XC3S400-4FTG256C offers headroom for design growth while maintaining pin and thermal compatibility, whereas the XC3S200A-4FTG256C delivers measurable reductions in static current and DCM output jitter-both validated for drop-in use in existing FTBGA256 layouts.
Availability
XC3S200-4FTG256C is available at Aetrix Electronics and suitable for industrial control, digital video processing, and communications infrastructure requiring stable component supply across extended product lifecycles.
Supply support for XC3S200-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan family as part of its adaptive computing portfolio.
The Spartan-3 series was designed for cost-sensitive, high-volume applications demanding predictable timing, robust I/O flexibility, and long-term industrial availability-especially in control, interface, and video processing roles.
FAQ
What is the maximum operating frequency supported by the XC3S200-4FTG256C?
The XC3S200-4FTG256C supports internal clock frequencies up to 280 MHz in typical conditions, with the -4 speed grade guaranteeing timing closure for critical paths at 220 MHz under worst-case voltage and temperature. This is enabled by its Digital Clock Managers and optimized routing architecture. The actual achievable frequency depends on design placement, routing congestion, and I/O standard selection. XC3S200-4FTG256C does not specify a hard upper limit but provides timing reports for verified paths in place-and-route tools.
Does the XC3S200-4FTG256C support JTAG programming?
Yes, the XC3S200-4FTG256C supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and verification. It uses TCK, TMS, TDI, and TDO pins to load bitstreams directly or perform device-level testing. JTAG mode operates independently of Master Serial mode and is commonly used during development and production test. XC3S200-4FTG256C requires no external configuration PROM when programmed exclusively via JTAG.
What I/O standards are compatible with the XC3S200-4FTG256C?
The XC3S200-4FTG256C supports LVCMOS, LVTTL, PCI, SSTL2, SSTL3, HSTL, and differential standards including LVDS and RSDS across its SelectIO™ banks. Each bank is independently configurable for voltage (1.2V–3.3V), drive strength (2–24 mA), and slew rate. XC3S200-4FTG256C does not support DDR3 or MIPI directly but can interface to those protocols via external level-shifting or PHY components.
Is the XC3S200-4FTG256C RoHS compliant?
Yes, the XC3S200-4FTG256C is RoHS-6 compliant (lead-free, mercury-free, cadmium-free, hexavalent chromium-free, PBB-free, PBDE-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. It is qualified for reflow soldering per IPC/JEDEC J-STD-020D. XC3S200-4FTG256C carries the "Pb-Free" marking on the top-side laser etch and conforms to EU Directive 2011/65/EU.
Can the XC3S200-4FTG256C be reconfigured in-system?
Yes, the XC3S200-4FTG256C supports in-system reconfiguration via JTAG or Master Serial mode using an external PROM or microcontroller. Its configuration memory is SRAM-based and volatile, requiring reload on power-up. Partial reconfiguration is also supported, allowing specific logic regions to be updated without disrupting active functions. XC3S200-4FTG256C retains full functionality during reconfiguration if proper handshaking and isolation are implemented in the design.
XC3S200-4FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 480
- Number of Logic Elements/Cells:
- 4320
- Total RAM Bits:
- 221184
- Number of I/O:
- 173
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200-4FTG256C FAQ
1.How can I place an order for XC3S200-4FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200-4FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200-4FTG256C reliable?
The price and inventory of XC3S200-4FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200-4FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S200-4FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200-4FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200-4FTG256C?
XC3S200-4FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200-4FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200-4FTG256C?
For technical support, including XC3S200-4FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200-4FTG256C requirements.
6.How does Aetrix verify that XC3S200-4FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S200-4FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200-4FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S200-4FTG256C?
All XC3S200-4FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200-4FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200-4FTG256C part is unused and in its original packaging.
Return procedure for XC3S200-4FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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