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AMD XC3S200-4FTG256I
- Part No.:
- XC3S200-4FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200-4FTG256I.pdf
- Description:
- IC FPGA 173 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,024
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Product details
Overview
XC3S200-4FTG256I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,320 logic cells, and 216 Kbits of block RAM, configured in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade and supports industrial temperature range (-40°C to +100°C), commonly used in industrial control logic and embedded vision preprocessing.
For engineers reviewing the XC3S200-4FTG256I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (173 user I/Os), differential signaling support (LVDS, LVDSEXT), internal clock management (DLL), and industrial-grade thermal performance.
Technical Context
The XC3S200-4FTG256I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates twelve 18×18 multipliers and supports SelectIO standards including LVCMOS, LVTTL, PCI, and LVDS.
Internal clock routing includes a Digital Clock Manager (DCM) with phase shifting, frequency synthesis, and duty cycle correction. Configuration is performed via master serial mode using external PROM or processor-controlled slave parallel mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,320 - defines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 200,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| User I/O Pins | 173 - supports high-pin-count interface bridging and multi-peripheral connectivity |
| Block RAM | 216 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| Speed Grade | -4 - guarantees timing closure up to 333 MHz for critical paths under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial and transportation environments |
| Package | 256-pin FTBGA (Fine-Pitch TBGA) - 17×17 mm body, 1.0 mm ball pitch, RoHS-compliant |
Pinout & Package
XC3S200-4FTG256I is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 17×17 array, 1.0 mm ball pitch, and standard 0.75 mm standoff. Pin assignment follows Xilinx Spartan-3 family conventions with dedicated configuration, clock, JTAG, and dual-purpose I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives serial configuration data into FPGA during power-up or reconfiguration |
| DIN | Serial Data Input | Receives bitstream from external PROM or processor in master serial mode |
| PROG_B | Program Initiate | Active-low signal that resets configuration logic and clears internal SRAM |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | Enables IEEE 1149.1-compliant testing, debugging, and in-system programming |
| IO_LxxN/IO_LxxP | Differential I/O Pair | Supports LVDS, RSDS, and BLVDS signaling with internal termination and skew control |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, phase alignment, and 2x–16x frequency multiplication without external PLL components |
| SelectIO Technology | Enables mixed-voltage I/O banks (1.2V–3.3V) with programmable drive strength and slew rate per pin group |
| Embedded Multipliers | Twelve 18×18 signed/unsigned multipliers accelerate DSP functions like FIR filtering and motor control algorithms |
| Configurable Logic Blocks (CLBs) | Each CLB contains two 4-LUTs + flip-flops, supporting efficient implementation of state machines and pipelined datapaths |
| Block RAM Columns | Eight 18-Kbit RAM blocks allow dual-port access and synchronous read/write for real-time buffering applications |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution with encoder feedback decoding and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop control logic, DCM synchronizes position capture and actuator update clocks. Use Value: 173 user I/Os enable direct connection to multiple encoders, analog inputs, and isolated gate drivers without glue logic. | Use Scenario: High-speed digital pattern generation and response analysis across multiple DUT interfaces. IC Role / Device Role / Timing Role: Configurable I/O banks interface to various voltage standards (LVTTL, LVCMOS, GTL); DCM ensures precise timing alignment between stimulus and capture clocks. Use Value: On-chip 216 Kbits RAM stores test vectors and expected responses, reducing dependency on external memory bandwidth. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of parallel CMOS image sensor outputs before compression. IC Role / Device Role / Timing Role: FPGA captures raw pixel streams using LVDS I/O pairs; block RAM buffers frame lines for line-rate processing. Use Value: Differential I/O support (LVDS/LVDSEXT) maintains signal integrity across 10+ cm PCB traces from sensors to processing unit. | Use Scenario: Consolidating ARINC 429, discrete I/O, and MIL-STD-1553 bus traffic onto a common backplane interface. IC Role / Device Role / Timing Role: Implements protocol-specific state machines and timing-critical arbitration logic; DCM generates synchronized clocks for each bus domain. Use Value: Industrial temperature rating (-40°C to +100°C) ensures reliable operation in uncontrolled avionics bay environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400-4FTG256I | Higher logic density (8,064 CLBs, 400K gates), same package and pinout | Supports larger state machines and more complex IP cores; requires higher static power | Choose when design scalability or future feature expansion is required without board redesign |
| XC3S1000-4FTG256C | 1M-gate capacity, commercial temp range (0°C to +70°C), identical footprint | Limited to controlled-environment applications; lacks industrial temperature qualification | Select only if operating environment stays within commercial range and higher gate count justifies cost premium |
Compared with XC3S200-4FTG256I, the XC3S400-4FTG256I offers headroom for logic growth while maintaining compatibility, whereas the XC3S1000-4FTG256C trades industrial reliability for gate count-making XC3S200-4FTG256I optimal for cost-sensitive, thermally demanding deployments.
Availability
XC3S200-4FTG256I is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, and medical imaging interface designs requiring stable component supply and long-term manufacturability.
Supply support for XC3S200-4FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, edge, and embedded markets.
The Spartan-3 family, including XC3S200-4FTG256I, was designed for cost-sensitive, high-volume embedded applications requiring deterministic logic performance and industrial temperature operation.
FAQ
What is the configuration method supported by XC3S200-4FTG256I?
XC3S200-4FTG256I supports master serial, slave serial, and slave parallel configuration modes. Master serial uses an external PROM and CCLK/DIN pins; slave modes allow processor-controlled loading via parallel or serial interface. JTAG is also available for boundary scan and in-system programming.
Does XC3S200-4FTG256I include on-chip clock management?
Yes, XC3S200-4FTG256I integrates a Digital Clock Manager (DCM) with input jitter filtering, frequency synthesis (2x–16x), phase shifting (±180°), and duty cycle correction. This eliminates need for external clock ICs in most timing-critical applications.
What I/O standards does XC3S200-4FTG256I support?
XC3S200-4FTG256I supports LVCMOS, LVTTL, PCI, HSTL, SSTL, and differential standards including LVDS, RSDS, and BLVDS. Each I/O bank is independently configurable for voltage level (1.2V–3.3V) and drive strength.
Is XC3S200-4FTG256I qualified for industrial temperature operation?
Yes, XC3S200-4FTG256I is rated for -40°C to +100°C operation and is marked with the 'I' suffix indicating industrial temperature grade. This qualification is verified per Xilinx specification DS099 and applicable JEDEC standards.
Can XC3S200-4FTG256I be used in new designs despite end-of-life status?
Although Xilinx declared Spartan-3 end-of-life in 2013, XC3S200-4FTG256I remains available through authorized distributors and Aetrix Electronics' legacy component program with full traceability, extended lifecycle support, and obsolescence mitigation planning.
XC3S200-4FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 480
- Number of Logic Elements/Cells:
- 4320
- Total RAM Bits:
- 221184
- Number of I/O:
- 173
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200-4FTG256I FAQ
1.How can I place an order for XC3S200-4FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200-4FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200-4FTG256I reliable?
The price and inventory of XC3S200-4FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200-4FTG256I is usually 5 days.
3.What payment methods are accepted for XC3S200-4FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200-4FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200-4FTG256I?
XC3S200-4FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200-4FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200-4FTG256I?
For technical support, including XC3S200-4FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200-4FTG256I requirements.
6.How does Aetrix verify that XC3S200-4FTG256I is sourced from the original manufacturer or authorized distributors?
All XC3S200-4FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200-4FTG256I meets industry standards.
7.What is the process for return or replacement of XC3S200-4FTG256I?
All XC3S200-4FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200-4FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200-4FTG256I part is unused and in its original packaging.
Return procedure for XC3S200-4FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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