My Inquiry
My Account
AMD XC3S200-4PQ208C
- Part No.:
- XC3S200-4PQ208C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 208-BFQFP
- Datasheet:
-
XC3S200-4PQ208C.pdf
- Description:
- IC FPGA 141 I/O 208QFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,179
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S200-4PQ208C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,320 logic cells, and 208-pin PQFP package. It operates at -4 speed grade (5 ns CLB delay), supports 3.3 V I/O, and includes embedded block RAM and DLLs for clock management. It is used in industrial control logic and low-cost communication interface bridging.
For engineers reviewing the XC3S200-4PQ208C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage compatibility, DLL-based clock deskew capability, and PQFP thermal and routing constraints in cost-sensitive embedded designs.
Technical Context
The XC3S200-4PQ208C implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates eighteen 18-kbit block RAMs (total 324 kbits), four digital clock managers (DCMs), and supports SelectIO standards including LVCMOS, LVTTL, and PCI.
Configuration is performed via master serial mode using external PROM or JTAG boundary-scan. The device requires separate VCCINT (1.2 V) and VCCO (3.3 V) supplies, with I/O banks independently configurable for voltage and standard.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,320 - provides combinational and sequential logic capacity for medium-complexity control and datapath functions |
| System Gates | 200,000 - industry-standard metric estimating equivalent gate count for ASIC comparison |
| Block RAM | 324 kbits (18 × 18 kbit blocks) - supports FIFOs, dual-port buffers, and small lookup tables without external memory |
| DCMs | 4 - enable input clock multiplication, phase shifting, and duty-cycle correction for timing-critical interfaces |
| I/O Pins | 141 user I/O - supports multi-bank voltage configuration (3.3 V only in this variant) |
| Speed Grade | -4 - guarantees 5 ns CLB propagation delay, enabling 200 MHz system clock operation under typical conditions |
| VCCINT / VCCO | 1.2 V / 3.3 V - mandates dual-rail power delivery; VCCO must match connected peripheral voltage levels |
Pinout & Package
XC3S200-4PQ208C uses a 208-pin Plastic Quad Flat Pack (PQFP) with 0.5 mm pitch, 28 × 28 mm body size, and exposed thermal pad. Package meets JEDEC MS-026 standard and supports reflow soldering per IPC/JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be decoupled locally to suppress switching noise |
| P3 | VCCO_0 | 3.3 V I/O bank 0 supply - sets voltage level for pins in Bank 0 (P1–R12) |
| T14 | PROGRAM_B | Active-low asynchronous configuration reset - pulls low to reload bitstream from PROM or JTAG |
| R15 | DONE | Open-drain status output - goes high when configuration completes successfully |
| M16 | CCLK | Configuration clock input - driven externally during master serial mode or by internal DCM during JTAG |
| U17 | TCK | JTAG test clock - required for boundary-scan programming and debug access |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Four fully independent DCMs provide jitter-reduced clock synthesis, phase alignment, and frequency multiplication without external PLL components |
| SelectIO Technology | Supports 3.3 V LVTTL/LVCMOS with programmable drive strength (2–24 mA) and slew rate control for signal integrity tuning |
| Embedded Block RAM | Eighteen 18-kbit blocks enable true dual-port RAM access with independent read/write clocks - critical for buffering asynchronous data streams |
| Multi-Bank I/O | Four I/O banks allow mixed-voltage operation (though XC3S200-4PQ208C is configured for 3.3 V only) and reduce board-level level-shifter count |
| Configuration Security | Bitstream encryption option prevents reverse engineering of design logic in production units |
Applications
| Industrial PLC Logic | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Replacing aging microcontroller-based ladder logic in compact programmable logic controllers. IC Role / Device Role / Timing Role: Configurable state machine implementing real-time I/O scanning, timer/counter functions, and safety interlock sequencing. Use Value: Enables field-upgradable control logic without hardware redesign; DCMs synchronize scan cycles to 10 ms intervals with sub-microsecond jitter. | Use Scenario: Bridging RS-232/RS-485 serial protocols to modern USB or Ethernet endpoints in legacy instrumentation. IC Role / Device Role / Timing Role: Protocol translation engine with UART controllers, FIFO buffers, and handshaking logic. Use Value: Uses embedded block RAM for 2 kB bidirectional FIFOs and DCMs to align UART baud clocks with host system timing domains. |
| Video Signal Formatter | Motor Control Encoder Interface |
Use Scenario: Converting parallel CMOS image sensor output to BT.656-compatible YUV stream for video processors. IC Role / Device Role / Timing Role: Pixel clock domain crossing, line buffering, and sync pulse generation using DCM-derived clocks. Use Value: Achieves pixel-perfect timing alignment between sensor and display domains; 141 I/O pins support full 16-bit parallel bus + control signals. | Use Scenario: Interfacing quadrature encoder feedback from servo motors to motion controller MCUs. IC Role / Device Role / Timing Role: High-speed edge detection, direction decoding, and 32-bit counter accumulation with glitch filtering. Use Value: Processes >2 MHz quadrature inputs with deterministic 5 ns timing resolution; logic cells implement debounce and index pulse validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S200A-4PQ208C | Revised silicon with lower static power, improved DCM stability, and same pinout/package | Same footprint and configuration interface; supports identical bitstreams with minor timing adjustments | Preferred for new designs requiring extended temperature range or reduced power consumption |
| XC3S400-4PQ208C | Higher logic density (8,064 LCs), same package and I/O count, but increased core current and thermal load | Enables larger state machines or additional peripheral interfaces without PCB change | Choose when design scalability or future feature expansion is required beyond XC3S200-4PQ208C capacity |
Compared with XC3S200-4PQ208C, the XC3S200A-4PQ208C offers verified power and timing improvements within identical mechanical and electrical constraints, while XC3S400-4PQ208C delivers headroom for logic growth at the cost of higher thermal management requirements.
Availability
XC3S200-4PQ208C is available at Aetrix Electronics and suitable for industrial automation, legacy interface bridging, and embedded video processing requiring stable component supply across long-lifecycle programs.
Supply support for XC3S200-4PQ208C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-3 family was designed for cost-sensitive, high-volume embedded applications requiring predictable timing, low power, and seamless integration with standard microcontrollers and peripherals.
FAQ
What is the maximum operating frequency supported by XC3S200-4PQ208C?
The XC3S200-4PQ208C speed grade -4 guarantees a 5 ns CLB propagation delay, enabling reliable operation up to 200 MHz for synchronous logic paths under typical voltage and temperature conditions. Actual system frequency depends on design topology, routing, and clock domain crossings - verified via post-place-and-route timing analysis in Xilinx ISE.
Does XC3S200-4PQ208C support JTAG boundary-scan for in-circuit testing?
Yes, XC3S200-4PQ208C includes IEEE 1149.1-compliant JTAG TAP controller with TDI, TDO, TMS, and TCK pins. It supports boundary-scan testing, configuration via JTAG, and debug access to internal logic states using ChipScope Pro or third-party tools compatible with Xilinx BSCAN primitives.
Can XC3S200-4PQ208C be configured using an external SPI PROM?
Yes, XC3S200-4PQ208C supports master serial configuration mode where it drives the clock (CCLK) and reads the bitstream from a standard SPI PROM (e.g., XCF02S). Configuration begins automatically after power-up when INIT_B and PROGRAM_B signals meet valid startup conditions.
What are the power supply requirements for XC3S200-4PQ208C?
XC3S200-4PQ208C requires two dedicated supplies: 1.2 V ±3% for VCCINT (core logic) and 3.3 V ±5% for VCCO (I/O banks). Decoupling capacitors must be placed near each supply pin per Xilinx UG331 guidelines. No internal voltage regulation is provided - external regulators must meet transient response and ripple specifications.
Is XC3S200-4PQ208C RoHS compliant and lead-free?
Yes, XC3S200-4PQ208C is manufactured in a RoHS-compliant, lead-free process and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The PQFP package uses matte tin finish and conforms to IPC-7095D guidelines for lead-free assembly.
XC3S200-4PQ208C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 480
- Number of Logic Elements/Cells:
- 4320
- Total RAM Bits:
- 221184
- Number of I/O:
- 141
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 208-PQFP (28x28)
XC3S200-4PQ208C FAQ
1.How can I place an order for XC3S200-4PQ208C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200-4PQ208C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200-4PQ208C reliable?
The price and inventory of XC3S200-4PQ208C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200-4PQ208C is usually 5 days.
3.What payment methods are accepted for XC3S200-4PQ208C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200-4PQ208C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200-4PQ208C?
XC3S200-4PQ208C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200-4PQ208C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200-4PQ208C?
For technical support, including XC3S200-4PQ208C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200-4PQ208C requirements.
6.How does Aetrix verify that XC3S200-4PQ208C is sourced from the original manufacturer or authorized distributors?
All XC3S200-4PQ208C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200-4PQ208C meets industry standards.
7.What is the process for return or replacement of XC3S200-4PQ208C?
All XC3S200-4PQ208C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200-4PQ208C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200-4PQ208C part is unused and in its original packaging.
Return procedure for XC3S200-4PQ208C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S200-4PQ208C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
