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AMD XC3S200-4TQ144C
- Part No.:
- XC3S200-4TQ144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S200-4TQ144C.pdf
- Description:
- IC FPGA 97 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,216
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Product details
Overview
XC3S200-4TQ144C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,320 logic cells, and 216 I/O pins in a 144-pin TQFP package. It operates at -4 speed grade (5 ns CLB delay), supports 3.3 V or 2.5 V I/O, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S200-4TQ144C datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, TQFP packaging compatibility, speed-grade timing margins, and legacy Spartan-3 toolchain support in Vivado ISE.
Technical Context
The XC3S200-4TQ144C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It includes eight global clock buffers and supports SelectIO standards including LVTTL, LVCMOS, PCI, and SSTL.
Configuration is performed via master serial mode using an external PROM or JTAG boundary-scan. The device lacks on-chip configuration memory and requires external configuration bitstream storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,320 - defines maximum combinational/sequential logic capacity per design |
| System Gates | 200,000 - legacy metric estimating equivalent NAND gate count for logic synthesis |
| I/O Pins | 216 - usable user-defined bidirectional signal terminals in TQFP-144 package |
| Speed Grade | -4 - guarantees 5 ns CLB propagation delay; impacts maximum achievable clock frequency |
| VCCINT | 1.2 V ± 3% - core voltage supply requirement; must be tightly regulated |
| I/O Voltage | Supports 3.3 V or 2.5 V - enables interfacing with legacy and low-voltage peripherals |
| Configuration Mode | Master Serial or JTAG - determines boot method and programming interface dependency |
Pinout & Package
XC3S200-4TQ144C is housed in a 144-pin Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 × 20 mm body size, and exposed thermal pad (non-electrical). Package meets JEDEC MO-153 standard and supports reflow soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1 | PROGRAM_B | Active-low asynchronous reset input; initiates configuration reload when asserted |
| P2 | INIT_B | Open-drain status output indicating configuration progress and success/failure |
| P3 | CCLK | Configuration clock input; drives internal shift register during master serial mode |
| P4 | DIN | Serial data input for configuration bitstream in master serial mode |
| P5–P12 | IO_L0N/TCK | Multi-function pin: dedicated JTAG TCK or general-purpose I/O with differential pair capability |
| P13–P144 | IO_* | User-configurable I/O banks supporting selectable voltage standards and slew rates |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Multipliers | Four 18 × 18-bit two's complement multipliers enable efficient arithmetic in DSP pipelines |
| Distributed RAM | 72 Kb total distributed RAM across CLBs supports fast state-machine storage and small lookup tables |
| SelectIO Technology | Per-bank I/O voltage selection allows mixed-voltage interfacing without level shifters |
| Global Clock Resources | Eight global clock buffers reduce skew and support synchronous domain partitioning |
| JTAG Boundary-Scan | IEEE 1149.1-compliant test access port enables in-circuit programming and debug verification |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Replacing ASICs in programmable logic controllers to support field-upgradable I/O mapping and protocol adaptation. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom state machines, parallel I/O expansion, and real-time cycle timing. Use Value: Enables hardware-level response times under 1 µs while reducing NRE costs versus custom silicon. | Use Scenario: Bridging ISA or PCI bus signals to modern microcontroller peripherals in retro-computing or test equipment upgrades. IC Role / Device Role / Timing Role: Synchronous protocol translator with precise setup/hold timing control for address/data strobes. Use Value: Maintains strict 33 MHz PCI timing compliance while adding glue logic for address decoding and interrupt arbitration. |
| Video Signal Formatter | Motor Control Logic Unit |
Use Scenario: Converting parallel RGB data streams into serialized LVDS or TTL-compatible video timing for display panels. IC Role / Device Role / Timing Role: Pixel-clock-synchronized pipeline with programmable blanking intervals and sync polarity inversion. Use Value: Supports 640×480@60 Hz and 800×600@60 Hz modes using only internal logic and no external memory. | Use Scenario: Generating PWM waveforms, monitoring encoder feedback, and managing fault interlocks in three-phase inverter drives. IC Role / Device Role / Timing Role: Deterministic real-time controller with sub-microsecond dead-time insertion and overcurrent trip response. Use Value: Achieves < 200 ns propagation delay from fault detection to gate-shutdown signal assertion. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S250E-4TQ144C | Higher logic density (5,760 CLBs), enhanced DCMs, and added Block RAM (128 Kb) | Better suited for designs requiring embedded memory or higher clock multiplication stability | Choose when migrating from XC3S200-4TQ144C to add local RAM or improve jitter performance |
| XC3S400-4TQ144C | Increased system gates (400,000), more I/O (232), same speed grade and package | Supports larger state machines and additional peripheral interfaces without board redesign | Prefer when expanding functionality within identical PCB footprint and thermal envelope |
Compared with XC3S200-4TQ144C, XC3S250E-4TQ144C adds embedded memory and improved clock management but requires updated constraints; XC3S400-4TQ144C offers direct pin-compatible scalability with higher gate count and I/O count, enabling feature growth without layout change.
Availability
XC3S200-4TQ144C is available at Aetrix Electronics and suitable for industrial automation, legacy system refurbishment, and academic FPGA prototyping requiring stable component supply and long-term sourcing assurance.
Supply support for XC3S200-4TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-3 product lines for industrial and aerospace customers requiring long-lifecycle support.
The Spartan-3 family was designed for cost-optimized, high-volume embedded logic replacement-targeting applications where ASIC non-recurring engineering costs are prohibitive and programmability enables field updates.
FAQ
Is XC3S200-4TQ144C still in production?
No-XC3S200-4TQ144C is discontinued by AMD (Xilinx), but Aetrix Electronics maintains active inventory and provides extended lifecycle sourcing. New production designs should consider migration paths, though existing systems continue to rely on this part for long-term maintenance and repair.
What software tools support XC3S200-4TQ144C?
XC3S200-4TQ144C is supported exclusively by Xilinx ISE Design Suite (v14.7 and earlier). It is not compatible with Vivado. Users must retain legacy ISE installations, license files, and associated device models to synthesize, implement, and program the XC3S200-4TQ144C successfully.
Does XC3S200-4TQ144C include internal configuration memory?
No-XC3S200-4TQ144C requires external configuration memory (e.g., XCFxxP PROM or SPI flash) to store the bitstream. It boots only in master serial or JTAG mode and has no on-chip non-volatile memory for configuration retention.
Can XC3S200-4TQ144C operate with 1.8 V I/O?
No-XC3S200-4TQ144C supports only 3.3 V and 2.5 V I/O standards per bank. 1.8 V operation is not electrically rated or guaranteed; attempting it may cause signal integrity issues or damage due to VIH/VIL threshold violations.
What is the maximum operating junction temperature for XC3S200-4TQ144C?
The maximum junction temperature for XC3S200-4TQ144C is 85 °C under continuous operation. Thermal design must ensure that power dissipation (up to 1.2 W typical) does not exceed this limit, especially in enclosed industrial enclosures without forced airflow.
XC3S200-4TQ144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 480
- Number of Logic Elements/Cells:
- 4320
- Total RAM Bits:
- 221184
- Number of I/O:
- 97
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S200-4TQ144C FAQ
1.How can I place an order for XC3S200-4TQ144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200-4TQ144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200-4TQ144C reliable?
The price and inventory of XC3S200-4TQ144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200-4TQ144C is usually 5 days.
3.What payment methods are accepted for XC3S200-4TQ144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200-4TQ144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200-4TQ144C?
XC3S200-4TQ144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200-4TQ144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200-4TQ144C?
For technical support, including XC3S200-4TQ144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200-4TQ144C requirements.
6.How does Aetrix verify that XC3S200-4TQ144C is sourced from the original manufacturer or authorized distributors?
All XC3S200-4TQ144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200-4TQ144C meets industry standards.
7.What is the process for return or replacement of XC3S200-4TQ144C?
All XC3S200-4TQ144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200-4TQ144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200-4TQ144C part is unused and in its original packaging.
Return procedure for XC3S200-4TQ144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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