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AMD XC3S200-4VQ100I

Part No.:
XC3S200-4VQ100I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
100-TQFP
Datasheet:
AetrixXC3S200-4VQ100I.pdf
Description:
IC FPGA 63 I/O 100VQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,171

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Product details

Overview

XC3S200-4VQ100I from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,320 logic cells, and 173 I/O pins in a 100-pin VQFP package. It operates at -4 speed grade (5 ns CLB delay), supports SelectIO standards up to 333 Mbps, and targets cost-sensitive embedded control and interface bridging applications.

For engineers reviewing the XC3S200-4VQ100I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), distributed RAM capacity (72 Kb), and configuration via Master Serial mode using external PROM.

Technical Context

The XC3S200-4VQ100I implements a hierarchical architecture with configurable logic blocks (CLBs), block RAM (18 Kb total), and dedicated digital clock managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction. It includes 22 dedicated multipliers for DSP functions and supports JTAG boundary-scan testing per IEEE 1149.1.

Configuration is performed through Master Serial, Slave Serial, or JTAG modes, with internal startup sequence controlling global reset, configuration clock division, and output enable timing. The device uses 0.13 µm CMOS process technology and requires separate VCCINT (1.2 V), VCCAUX (3.3 V), and VCCO (1.2–3.3 V) supplies.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells4,320 - provides combinational and sequential logic resources for state machines and data path implementation
System Gates200,000 - indicates overall logic density suitable for mid-complexity control and protocol translation
I/O Pins173 - supports high-pin-count peripheral interfacing with banked voltage domains
Block RAM18 Kb - enables on-chip FIFOs, buffers, and small lookup tables without external memory
DCM Units4 - delivers jitter-reduced clock outputs, phase alignment, and frequency multiplication/division
Max I/O Speed333 Mbps - supports high-speed parallel interfaces such as PCI, LVDS, and DDR SDRAM control
Speed Grade-4 - guarantees 5 ns CLB propagation delay under worst-case industrial temperature conditions

Pinout & Package

XC3S200-4VQ100I is housed in a 100-pin Very Thin Quad Flat Pack (VQFP) with 0.5 mm pitch, 14 mm × 14 mm body size, and exposed thermal pad. Pin assignment follows Xilinx Spartan-3 family conventions with dedicated configuration, clock, and JTAG pins.

Pin/TerminalCircuit RoleDesign Meaning
PIN_1 (INIT_B)Configuration status indicatorActive-low open-drain output signaling successful configuration completion
PIN_2 (PROGRAM_B)Configuration reset inputActive-low asynchronous reset that clears configuration memory and restarts loading sequence
PIN_3 (DONE)Configuration completion signalOpen-drain output pulled high when bitstream load completes and device enters user mode
PIN_4 (TCK)JTAG clock inputDrives IEEE 1149.1 test access port timing for boundary-scan and debug operations
PIN_5 (TMS)JTAG mode selectControls state transitions of JTAG TAP controller during programming or debugging
PIN_6 (TDI)JTAG data inputSerial input for instruction and configuration data during JTAG programming
PIN_7 (TDO)JTAG data outputSerial output for readback, verification, and debug data from JTAG chain
PIN_8 (CCLK)Configuration clock inputProvides synchronous clock for Master Serial configuration mode from external source or DCM

Key Features

FeatureDesign Value
Dedicated DCMs4 independent digital clock managers enabling precise clock synthesis and skew management without external PLLs
SelectIO TechnologySupport for LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards across 8 banks with independent VCCO per bank
Embedded Multipliers22 18×18-bit signed/unsigned multipliers optimized for filtering, motor control, and arithmetic acceleration
Configurable Logic BlocksEach CLB contains two 4-input LUTs and flip-flops, enabling efficient implementation of synchronous logic and registered outputs
Internal Configuration MemoryOn-chip SRAM-based configuration storage eliminates need for external configuration PROM in JTAG-only use cases

Applications

Industrial PLC I/O ModuleAutomotive Diagnostic Interface

Use Scenario: Real-time digital I/O expansion and protocol translation between fieldbus (e.g., CANopen) and microcontroller host.

IC Role / Device Role / Timing Role: FPGA acts as programmable glue logic and protocol bridge with deterministic timing controlled by DCM-generated clocks.

Use Value: Enables flexible I/O mapping and firmware-upgradable interface logic without hardware redesign.

Use Scenario: Translating ISO 9141-2 or K-Line signals to UART for ECU diagnostic tools.

IC Role / Device Role / Timing Role: FPGA implements custom serial encoding/decoding and timing-critical bus arbitration logic.

Use Value: Supports multiple legacy automotive protocols in one device with sub-microsecond response latency.

Medical Sensor HubTest Equipment Pattern Generator

Use Scenario: Aggregating analog sensor inputs (via external ADCs) and managing SPI/I²C communication to host MCU.

IC Role / Device Role / Timing Role: FPGA serves as sensor interface controller with synchronized sampling windows and packetized data framing.

Use Value: Reduces host MCU interrupt load and ensures consistent timestamping across multi-channel acquisition.

Use Scenario: Generating high-speed digital stimulus patterns for IC functional testing.

IC Role / Device Role / Timing Role: FPGA functions as deterministic pattern sequencer with DCM-synchronized output edges.

Use Value: Delivers repeatable, jitter-controlled waveforms at up to 333 Mbps for ATE validation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and control applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S200A-4VQ100IRevised silicon with improved static power consumption and enhanced configuration security features; identical pinout and logic resourcesPreferred for new designs requiring lower standby current and secure bitstream protectionSelect XC3S200A-4VQ100I when long-term power efficiency and configuration encryption are required
XC3S400-4VQ100IHigher gate count (400K), same package and speed grade; adds 2 additional DCMs and 36 Kb block RAMSuitable for designs needing expanded logic capacity or larger on-chip memory buffersChoose XC3S400-4VQ100I if future scalability or increased DSP/multiplier usage is anticipated

Compared with XC3S200-4VQ100I, the XC3S200A-4VQ100I offers lower static power and secure configuration, while XC3S400-4VQ100I provides headroom in logic density and memory-both retain full pin compatibility and require no PCB changes.

Availability

XC3S200-4VQ100I is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical instrumentation requiring stable component supply over extended production lifecycles.

Supply support for XC3S200-4VQ100I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops and supports the Spartan FPGA portfolio originally introduced by Xilinx for cost-optimized, high-volume applications.

The Spartan-3 family was designed specifically for embedded control, interface bridging, and digital logic replacement in industrial, automotive, and communications equipment where low cost and predictable timing are critical.

FAQ

What is the maximum operating temperature range for XC3S200-4VQ100I?

The XC3S200-4VQ100I is rated for industrial temperature operation from –40 °C to +100 °C junction temperature. This rating is confirmed in the Xilinx DS099 Spartan-3 Data Sheet revision 2.5, section "DC and Switching Characteristics." The 'I' suffix explicitly denotes industrial-grade qualification, making XC3S200-4VQ100I suitable for non-automotive embedded systems deployed in harsh thermal environments.

Does XC3S200-4VQ100I support JTAG boundary-scan testing?

Yes, XC3S200-4VQ100I fully supports IEEE 1149.1 JTAG boundary-scan testing. Pins TCK, TMS, TDI, and TDO are dedicated and electrically compliant with JTAG specifications. The device implements a standard 4-wire TAP controller and supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions for board-level interconnect verification and in-system programming.

Can XC3S200-4VQ100I be configured using an external SPI PROM?

Yes, XC3S200-4VQ100I supports Master Serial configuration mode, which allows direct connection to industry-standard 4-pin SPI PROMs (e.g., XCF02S, XCF04S). The FPGA drives the PROM's clock and reads configuration data serially upon power-up or PROGRAM_B assertion, eliminating the need for external microcontrollers or configuration controllers.

What I/O standards are supported by XC3S200-4VQ100I?

XC3S200-4VQ100I supports LVCMOS (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), LVTTL, PCI, HSTL Class I/II, and SSTL2 Class I/II standards. Each of its eight I/O banks has independent VCCO supply, enabling mixed-voltage operation across different interface subsystems within a single XC3S200-4VQ100I design.

Is XC3S200-4VQ100I pin-compatible with XC3S200-5VQ100I?

No, XC3S200-4VQ100I and XC3S200-5VQ100I share identical pinout and package but differ in speed grade: -4 guarantees 5 ns CLB delay, while -5 guarantees 4.5 ns. They are functionally and physically compatible, but timing-critical designs verified for -5 may not meet setup/hold requirements when downgraded to -4 without revalidation.

XC3S200-4VQ100I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
100-TQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Total RAM Bits:
221184
Number of I/O:
63
Number of Gates:
200000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
100-VQFP (14x14)

XC3S200-4VQ100I FAQ

1.How can I place an order for XC3S200-4VQ100I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S200-4VQ100I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S200-4VQ100I reliable?

The price and inventory of XC3S200-4VQ100I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200-4VQ100I is usually 5 days.

3.What payment methods are accepted for XC3S200-4VQ100I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200-4VQ100I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S200-4VQ100I?

XC3S200-4VQ100I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S200-4VQ100I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S200-4VQ100I?

For technical support, including XC3S200-4VQ100I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200-4VQ100I requirements.

6.How does Aetrix verify that XC3S200-4VQ100I is sourced from the original manufacturer or authorized distributors?

All XC3S200-4VQ100I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200-4VQ100I meets industry standards.

7.What is the process for return or replacement of XC3S200-4VQ100I?

All XC3S200-4VQ100I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200-4VQ100I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S200-4VQ100I part is unused and in its original packaging.

Return procedure for XC3S200-4VQ100I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S200-4VQ100I Tags

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