AMD XC3S200-5FTG256C

Overview

XC3S200-5FTG256C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,320 logic cells, and 216 I/O pins in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package. It operates at 500 MHz internal clock speed and supports LVCMOS25/LVCMOS33 I/O standards for industrial control and embedded vision interface applications.

For engineers reviewing the XC3S200-5FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and thermal performance in compact PCB layouts.

Technical Context

The XC3S200-5FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates eight global clock networks and supports SelectMAP, JTAG, and serial PROM configuration modes.

It features 72 Kbits of block RAM, up to 24 DSP slices (18×18-bit multipliers), and supports differential signaling via LVDS and RSDS I/O standards. Configuration is performed through internal startup sequence with programmable DONE pin behavior and power-on reset timing.

Key Specifications

Pinout & Package

XC3S200-5FTG256C is housed in a 256-pin Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch, 17 × 17 array, and standard JEDEC MO-251AC footprint. Thermal pad exposed on underside requires solder paste stencil design per Xilinx PCB guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S200-5FTG256C, the XC3S400-5FTG256C offers direct pin-compatible upgrade with increased logic capacity, while XC3S1000-4FG320C provides significantly more resources but mandates mechanical and thermal redesign due to larger footprint and higher power dissipation.

Availability

XC3S200-5FTG256C is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and test equipment requiring stable component supply across long production cycles.

Supply support for XC3S200-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan, Artix, and Virtex FPGA families for adaptive computing solutions.

The Spartan-3 family was designed for cost-sensitive, high-volume embedded applications requiring programmable logic with balanced performance, I/O flexibility, and low power consumption.

FAQ

What configuration modes does the XC3S200-5FTG256C support?

The XC3S200-5FTG256C supports Master Serial, Slave Parallel, JTAG, and SelectMAP configuration modes. Mode selection is controlled by M2:M0 pins at power-up. JTAG is used for debugging and programming during development, while Master Serial is common for production with SPI flash storage.

Does the XC3S200-5FTG256C include on-chip memory?

Yes, the XC3S200-5FTG256C contains 72 Kbits of block RAM distributed across 20 RAM blocks, each configurable as 16×1024, 32×512, or 64×256. It also provides distributed RAM within CLBs for smaller lookup tables or registers, enabling efficient FIFOs and buffers without external memory.

What is the operating temperature range for the XC3S200-5FTG256C?

The XC3S200-5FTG256C is rated for commercial temperature range (0°C to +70°C). The 'C' suffix explicitly denotes this grade. Industrial-grade variants ('I') exist in the Spartan-3 family but are not applicable to this specific part number.

Can the XC3S200-5FTG256C interface directly with DDR SDRAM?

No, the XC3S200-5FTG256C does not include dedicated DDR or DDR2 memory controller hard IP. While it can implement soft DDR controllers using logic resources and I/O timing constraints, reliable operation requires careful PCB layout, termination, and timing closure - and is not recommended for high-speed or production-critical DDR interfaces.

Is the XC3S200-5FTG256C RoHS compliant?

Yes, the XC3S200-5FTG256C is RoHS compliant and lead-free. Its FTBGA package uses matte tin finish on solder balls, meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements for standard surface-mount assembly processes.