AMD XC3S200-5VQ100C
- Part No.:
- XC3S200-5VQ100C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S200-5VQ100C.pdf
- Description:
- IC FPGA 63 I/O 100VQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,500
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Product details
Overview
XC3S200-5VQ100C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,992 logic cells, 176 I/O pins, and configured in a 100-pin VQFP package. It operates at 500 MHz internal clock speed and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging applications.
For engineers reviewing the XC3S200-5VQ100C datasheet, pinout, applications, or equivalent options, key selection factors include logic cell count, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and thermal performance in industrial temperature grade (0°C to 85°C).
Technical Context
The XC3S200-5VQ100C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (176 Kbits), and dedicated multipliers. It uses SRAM-based configuration with external PROM or processor loading via JTAG or SelectMAP interface.
This device supports Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction - enabling precise timing control across multiple synchronous domains without external PLLs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,992 - determines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 200,000 - industry-standard metric estimating equivalent ASIC gate count for logic density comparison |
| I/O Pins | 176 - supports high-pin-count peripheral interfacing with programmable drive strength and slew rate |
| Block RAM | 176 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| DCM Units | 4 - provides clock multiplication, division, phase alignment, and jitter reduction for multi-clock systems |
| Operating Temp | 0°C to +85°C - qualified for commercial and industrial ambient environments without derating |
| Supply Voltage | VCCINT = 1.2 V, VCCO = 2.5 V or 3.3 V - separates core and I/O power domains for noise isolation |
Pinout & Package
XC3S200-5VQ100C is housed in a 100-pin Very Thin Quad Flat Pack (VQFP) with 0.5 mm pitch, 14 mm × 14 mm body size, and exposed pad for thermal dissipation. Pin assignment follows Xilinx Spartan-3 family standard layout for VQ100 package.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered and decoupled near the pin |
| P1 | VCCO_0 | 2.5 V or 3.3 V I/O bank 0 supply - sets voltage level for associated I/O pins |
| T1 | PROGRAM_B | Active-low configuration initiation signal - pulls low to reset and reload bitstream |
| R2 | DONE | Open-drain status output - goes high when configuration completes successfully |
| M3 | TCK | JTAG test clock input - synchronizes boundary-scan and programming operations |
| L3 | TMS | JTAG test mode select - controls state transitions of TAP controller |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DCMs | Enables jitter-tolerant clock management without external PLL components or layout complexity |
| SelectMAP Interface | Allows fast parallel configuration by microcontroller or host processor, reducing boot time vs. serial modes |
| Multi-Voltage I/O Banks | Permits mixed-voltage interfacing (e.g., 3.3 V MCU to 2.5 V sensor) within single device |
| Configurable I/O Standards | Supports LVCMOS, LVTTL, PCI, and SSTL-2 on selected banks - simplifies board-level signal integrity planning |
| Embedded Block RAM | Eliminates need for external SRAM in compact buffer or state-machine storage applications |
Applications
| Industrial PLC I/O Module | Medical Imaging Data Preprocessor |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between fieldbus sensors and main controller. IC Role / Device Role / Timing Role: FPGA acts as reconfigurable logic fabric handling SPI-to-parallel conversion, debounce, and watchdog timer generation. Use Value: Reduces BOM count by integrating glue logic, timing control, and interface adaptation into one XC3S200-5VQ100C device. | Use Scenario: On-board preprocessing of CCD/CMOS sensor data before transmission to DSP subsystem. IC Role / Device Role / Timing Role: XC3S200-5VQ100C performs pixel alignment, histogram equalization, and frame buffering using embedded block RAM. Use Value: Enables deterministic latency and low-power local processing without offloading to host CPU or external memory. |
| Automotive Diagnostic Interface | Test Equipment Pattern Generator |
Use Scenario: CAN and LIN bus protocol bridging in vehicle diagnostic adapters supporting OBD-II standards. IC Role / Device Role / Timing Role: XC3S200-5VQ100C implements dual-bus controllers with synchronized timestamping and error logging logic. Use Value: Provides flexible, field-upgradable protocol stack implementation while meeting automotive temperature range requirements. | Use Scenario: Generating high-speed digital stimulus patterns for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: FPGA serves as pattern sequencer with precise edge placement controlled by DCM-generated clocks. Use Value: Achieves sub-nanosecond timing resolution using internal DCMs, avoiding external clock synthesizers and skew compensation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic density and I/O count applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S250E-4VQ100C | Higher logic capacity (5,728 CLBs), enhanced DCM features, and improved power efficiency due to 90 nm process | Better suited for designs requiring additional arithmetic logic or deeper FIFOs | Choose when migrating legacy XC3S200-5VQ100C designs needing headroom or lower static power |
| XC6SLX16-2CSG225C | 65 nm process, 14,579 logic cells, integrated PCIe block, and lower dynamic power per MHz | Targets higher-performance interfaces and more complex control algorithms | Select for new designs where long-term availability, expanded peripherals, or reduced thermal load are priorities |
Compared with XC3S200-5VQ100C, the XC3S250E-4VQ100C offers incremental logic growth and power savings within the same Spartan-3E family, while XC6SLX16-2CSG225C represents a generational shift toward higher integration and modern toolchain support - both require PCB layout changes and HDL re-synthesis.
Availability
XC3S200-5VQ100C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment applications requiring stable component supply and long-lifecycle support.
Supply support for XC3S200-5VQ100C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance and embedded applications.
The Spartan-3 family, including XC3S200-5VQ100C, was designed for cost-sensitive, high-volume applications requiring moderate logic density, flexible I/O, and reliable configuration in commercial and industrial environments.
FAQ
What is the configuration method supported by XC3S200-5VQ100C?
XC3S200-5VQ100C supports Master Serial (via PROM), Slave Parallel (SelectMAP), JTAG, and Boundary Scan configuration modes. The default mode is Master Serial using an external serial PROM. Configuration bitstream is loaded into on-chip SRAM each power-up, requiring nonvolatile storage external to the device.
Does XC3S200-5VQ100C include built-in analog functions such as ADC or DAC?
No, XC3S200-5VQ100C is a digital-only FPGA with no integrated analog-to-digital or digital-to-analog converters. All analog signal acquisition or generation must be handled by external components interfaced through its programmable I/O pins.
What is the maximum operating frequency of the DCMs in XC3S200-5VQ100C?
The Digital Clock Managers (DCMs) in XC3S200-5VQ100C support input frequencies from 1.5 MHz to 200 MHz and generate output frequencies up to 320 MHz. Phase shift resolution is ±125 ps, and jitter is specified at ±150 ps over full temperature and voltage range.
Is XC3S200-5VQ100C RoHS compliant?
Yes, XC3S200-5VQ100C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU. The VQFP package uses matte tin finish on leads and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).
Can XC3S200-5VQ100C be reprogrammed in-system?
Yes, XC3S200-5VQ100C supports in-system programming via JTAG or SelectMAP interface. Reprogramming does not require removal from the PCB, enabling field updates and design iteration without hardware modification.
XC3S200-5VQ100C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 480
- Number of Logic Elements/Cells:
- 4320
- Total RAM Bits:
- 221184
- Number of I/O:
- 63
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S200-5VQ100C FAQ
1.How can I place an order for XC3S200-5VQ100C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200-5VQ100C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200-5VQ100C reliable?
The price and inventory of XC3S200-5VQ100C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200-5VQ100C is usually 5 days.
3.What payment methods are accepted for XC3S200-5VQ100C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200-5VQ100C transactions.
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4.How is shipping managed for XC3S200-5VQ100C?
XC3S200-5VQ100C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200-5VQ100C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200-5VQ100C?
For technical support, including XC3S200-5VQ100C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200-5VQ100C requirements.
6.How does Aetrix verify that XC3S200-5VQ100C is sourced from the original manufacturer or authorized distributors?
All XC3S200-5VQ100C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200-5VQ100C meets industry standards.
7.What is the process for return or replacement of XC3S200-5VQ100C?
All XC3S200-5VQ100C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200-5VQ100C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200-5VQ100C part is unused and in its original packaging.
Return procedure for XC3S200-5VQ100C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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