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AMD XC3S200-5VQ100C

Part No.:
XC3S200-5VQ100C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
100-TQFP
Datasheet:
AetrixXC3S200-5VQ100C.pdf
Description:
IC FPGA 63 I/O 100VQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,500

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Product details

Overview

XC3S200-5VQ100C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,992 logic cells, 176 I/O pins, and configured in a 100-pin VQFP package. It operates at 500 MHz internal clock speed and supports LVCMOS25/LVCMOS33 I/O standards for embedded control and interface bridging applications.

For engineers reviewing the XC3S200-5VQ100C datasheet, pinout, applications, or equivalent options, key selection factors include logic cell count, I/O voltage compatibility, configuration mode support (Master Serial, Slave Parallel), and thermal performance in industrial temperature grade (0°C to 85°C).

Technical Context

The XC3S200-5VQ100C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (176 Kbits), and dedicated multipliers. It uses SRAM-based configuration with external PROM or processor loading via JTAG or SelectMAP interface.

This device supports Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction - enabling precise timing control across multiple synchronous domains without external PLLs.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells4,992 - determines maximum combinational/sequential logic capacity for custom digital functions
System Gates200,000 - industry-standard metric estimating equivalent ASIC gate count for logic density comparison
I/O Pins176 - supports high-pin-count peripheral interfacing with programmable drive strength and slew rate
Block RAM176 Kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory
DCM Units4 - provides clock multiplication, division, phase alignment, and jitter reduction for multi-clock systems
Operating Temp0°C to +85°C - qualified for commercial and industrial ambient environments without derating
Supply VoltageVCCINT = 1.2 V, VCCO = 2.5 V or 3.3 V - separates core and I/O power domains for noise isolation

Pinout & Package

XC3S200-5VQ100C is housed in a 100-pin Very Thin Quad Flat Pack (VQFP) with 0.5 mm pitch, 14 mm × 14 mm body size, and exposed pad for thermal dissipation. Pin assignment follows Xilinx Spartan-3 family standard layout for VQ100 package.

Pin/TerminalCircuit RoleDesign Meaning
G1VCCINT1.2 V core supply input - must be filtered and decoupled near the pin
P1VCCO_02.5 V or 3.3 V I/O bank 0 supply - sets voltage level for associated I/O pins
T1PROGRAM_BActive-low configuration initiation signal - pulls low to reset and reload bitstream
R2DONEOpen-drain status output - goes high when configuration completes successfully
M3TCKJTAG test clock input - synchronizes boundary-scan and programming operations
L3TMSJTAG test mode select - controls state transitions of TAP controller

Key Features

FeatureDesign Value
Dedicated DCMsEnables jitter-tolerant clock management without external PLL components or layout complexity
SelectMAP InterfaceAllows fast parallel configuration by microcontroller or host processor, reducing boot time vs. serial modes
Multi-Voltage I/O BanksPermits mixed-voltage interfacing (e.g., 3.3 V MCU to 2.5 V sensor) within single device
Configurable I/O StandardsSupports LVCMOS, LVTTL, PCI, and SSTL-2 on selected banks - simplifies board-level signal integrity planning
Embedded Block RAMEliminates need for external SRAM in compact buffer or state-machine storage applications

Applications

Industrial PLC I/O ModuleMedical Imaging Data Preprocessor

Use Scenario: Real-time digital signal conditioning and protocol translation between fieldbus sensors and main controller.

IC Role / Device Role / Timing Role: FPGA acts as reconfigurable logic fabric handling SPI-to-parallel conversion, debounce, and watchdog timer generation.

Use Value: Reduces BOM count by integrating glue logic, timing control, and interface adaptation into one XC3S200-5VQ100C device.

Use Scenario: On-board preprocessing of CCD/CMOS sensor data before transmission to DSP subsystem.

IC Role / Device Role / Timing Role: XC3S200-5VQ100C performs pixel alignment, histogram equalization, and frame buffering using embedded block RAM.

Use Value: Enables deterministic latency and low-power local processing without offloading to host CPU or external memory.

Automotive Diagnostic InterfaceTest Equipment Pattern Generator

Use Scenario: CAN and LIN bus protocol bridging in vehicle diagnostic adapters supporting OBD-II standards.

IC Role / Device Role / Timing Role: XC3S200-5VQ100C implements dual-bus controllers with synchronized timestamping and error logging logic.

Use Value: Provides flexible, field-upgradable protocol stack implementation while meeting automotive temperature range requirements.

Use Scenario: Generating high-speed digital stimulus patterns for IC functional validation in ATE systems.

IC Role / Device Role / Timing Role: FPGA serves as pattern sequencer with precise edge placement controlled by DCM-generated clocks.

Use Value: Achieves sub-nanosecond timing resolution using internal DCMs, avoiding external clock synthesizers and skew compensation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic density and I/O count applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S250E-4VQ100CHigher logic capacity (5,728 CLBs), enhanced DCM features, and improved power efficiency due to 90 nm processBetter suited for designs requiring additional arithmetic logic or deeper FIFOsChoose when migrating legacy XC3S200-5VQ100C designs needing headroom or lower static power
XC6SLX16-2CSG225C65 nm process, 14,579 logic cells, integrated PCIe block, and lower dynamic power per MHzTargets higher-performance interfaces and more complex control algorithmsSelect for new designs where long-term availability, expanded peripherals, or reduced thermal load are priorities

Compared with XC3S200-5VQ100C, the XC3S250E-4VQ100C offers incremental logic growth and power savings within the same Spartan-3E family, while XC6SLX16-2CSG225C represents a generational shift toward higher integration and modern toolchain support - both require PCB layout changes and HDL re-synthesis.

Availability

XC3S200-5VQ100C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and test equipment applications requiring stable component supply and long-lifecycle support.

Supply support for XC3S200-5VQ100C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance and embedded applications.

The Spartan-3 family, including XC3S200-5VQ100C, was designed for cost-sensitive, high-volume applications requiring moderate logic density, flexible I/O, and reliable configuration in commercial and industrial environments.

FAQ

What is the configuration method supported by XC3S200-5VQ100C?

XC3S200-5VQ100C supports Master Serial (via PROM), Slave Parallel (SelectMAP), JTAG, and Boundary Scan configuration modes. The default mode is Master Serial using an external serial PROM. Configuration bitstream is loaded into on-chip SRAM each power-up, requiring nonvolatile storage external to the device.

Does XC3S200-5VQ100C include built-in analog functions such as ADC or DAC?

No, XC3S200-5VQ100C is a digital-only FPGA with no integrated analog-to-digital or digital-to-analog converters. All analog signal acquisition or generation must be handled by external components interfaced through its programmable I/O pins.

What is the maximum operating frequency of the DCMs in XC3S200-5VQ100C?

The Digital Clock Managers (DCMs) in XC3S200-5VQ100C support input frequencies from 1.5 MHz to 200 MHz and generate output frequencies up to 320 MHz. Phase shift resolution is ±125 ps, and jitter is specified at ±150 ps over full temperature and voltage range.

Is XC3S200-5VQ100C RoHS compliant?

Yes, XC3S200-5VQ100C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU. The VQFP package uses matte tin finish on leads and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).

Can XC3S200-5VQ100C be reprogrammed in-system?

Yes, XC3S200-5VQ100C supports in-system programming via JTAG or SelectMAP interface. Reprogramming does not require removal from the PCB, enabling field updates and design iteration without hardware modification.

XC3S200-5VQ100C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3
Package/Case:
100-TQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
480
Number of Logic Elements/Cells:
4320
Total RAM Bits:
221184
Number of I/O:
63
Number of Gates:
200000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
100-VQFP (14x14)

XC3S200-5VQ100C FAQ

1.How can I place an order for XC3S200-5VQ100C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S200-5VQ100C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S200-5VQ100C reliable?

The price and inventory of XC3S200-5VQ100C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200-5VQ100C is usually 5 days.

3.What payment methods are accepted for XC3S200-5VQ100C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200-5VQ100C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S200-5VQ100C?

XC3S200-5VQ100C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S200-5VQ100C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S200-5VQ100C?

For technical support, including XC3S200-5VQ100C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200-5VQ100C requirements.

6.How does Aetrix verify that XC3S200-5VQ100C is sourced from the original manufacturer or authorized distributors?

All XC3S200-5VQ100C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200-5VQ100C meets industry standards.

7.What is the process for return or replacement of XC3S200-5VQ100C?

All XC3S200-5VQ100C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200-5VQ100C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S200-5VQ100C part is unused and in its original packaging.

Return procedure for XC3S200-5VQ100C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S200-5VQ100C Tags

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  • XC3S200-5VQ100C PDF
  • XC3S200-5VQ100C Datasheet
  • XC3S200-5VQ100C Specifications
  • XC3S200-5VQ100C Images
  • AMD
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  • Buy XC3S200-5VQ100C
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