My Inquiry
My Account
AMD XC3S200-5VQG100C
- Part No.:
- XC3S200-5VQG100C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S200-5VQG100C.pdf
- Description:
- IC FPGA 63 I/O 100VQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,244
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S200-5VQG100C from AMD (formerly Xilinx) is a Spartan-3 FPGA with 200,000 system gates, 4,320 logic cells, 173 I/O pins, and configured in a 100-pin VQFP package with 3.3V I/O and 1.2V core voltage. It targets cost-sensitive embedded control and interface bridging applications requiring reconfigurable logic.
For engineers reviewing the XC3S200-5VQG100C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, VQFP packaging compatibility, configuration mode support (Master Serial, Slave Parallel), and JTAG boundary-scan capability.
Technical Context
The XC3S200-5VQG100C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (176 Kbits), and dedicated multipliers. It supports SelectIO standards including LVTTL, LVCMOS, PCI, and SSTL-2.
Configuration is performed via external PROM, JTAG, or microprocessor interface; internal startup sequence includes CCLK generation, mode pin sampling, and bitstream CRC verification. The device operates at -40°C to +85°C and meets industrial temperature grade requirements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,320 - defines maximum combinational/sequential logic capacity for custom state machines or protocol engines |
| System Gates | 200,000 - industry-standard metric estimating equivalent NAND gate count for logic synthesis estimation |
| I/O Pins | 173 - supports high-pin-count peripheral interfacing with banked voltage and slew-rate control |
| Block RAM | 176 Kbits - enables on-chip FIFOs, buffers, or small lookup tables without external memory |
| Core Voltage | 1.2V ±3% - requires precision low-dropout regulator and tight power supply tolerance |
| I/O Voltage | 3.3V - compatible with legacy TTL and PCI signaling without level translation |
| Package | VQFP-100 - 0.5 mm pitch, quad flat pack with exposed pad; suitable for standard PCB assembly |
Pinout & Package
VQFP-100 (Very Thin Quad Flat Package) with 0.5 mm lead pitch, 14 × 14 mm body size, and thermally enhanced exposed pad for improved heat dissipation in sustained logic operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated pins per bank ensure low-impedance return paths for signal integrity |
| VCCO_0 | I/O bank power | Supplies 3.3V to Bank 0 I/Os; must be decoupled locally to suppress switching noise |
| VCCINT | Core power | Delivers regulated 1.2V to CLBs and interconnect; sensitive to ripple and dropout |
| TCK/TMS/TDI/TDO | JTAG interface | Enables IEEE 1149.1 boundary-scan testing and in-system programming |
| PROGRAM_B | Configuration reset | Active-low asynchronous input that clears configuration memory and initiates reload |
| DONE | Configuration status | Open-drain output indicating successful bitstream loading and initialization completion |
Key Features
| Feature | Design Value |
|---|---|
| Multi-voltage I/O banks | Four independent I/O banks support mixed-voltage interfaces (e.g., 3.3V CPU + 2.5V memory) |
| Dedicated digital clock managers (DCMs) | Two DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication |
| Embedded block RAM | 176 Kbits distributed across eight 18-Kbit blocks enable dual-port memory access for video buffering |
| SelectIO technology | Supports 19 I/O standards including LVCMOS33, LVTTL, and PCI; eliminates external level shifters |
| Configurable logic resources | Each CLB contains two 4-input LUTs and flip-flops, enabling efficient implementation of arithmetic and control logic |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Replacing ASIC-based discrete logic in programmable logic controller backplanes to support field-upgradable I/O mapping. IC Role / Device Role / Timing Role: Configurable glue logic and protocol translator between fieldbus (e.g., Profibus DP) and microcontroller host interface. Use Value: Enables firmware-defined I/O pin assignment and real-time signal conditioning without hardware redesign. | Use Scenario: Bridging ISA or PCI bus peripherals to modern ARM-based controllers in test equipment upgrades. IC Role / Device Role / Timing Role: Synchronizing asynchronous bus cycles and translating address/data strobes between mismatched timing domains. Use Value: Eliminates need for multiple fixed-function PALs/GALs while maintaining cycle-accurate timing compliance. |
| Video Signal Formatter | Motor Control Encoder Interface |
Use Scenario: Converting parallel CCD sensor output to serialized LVDS stream in machine vision cameras. IC Role / Device Role / Timing Role: Pixel clock domain crossing, line buffering, and serialization using embedded block RAM and I/O registers. Use Value: Achieves sub-pixel timing alignment and reduces external FIFO count by 2× versus discrete solutions. | Use Scenario: Interfacing quadrature encoder signals from servo motors to motion controller MCUs in CNC systems. IC Role / Device Role / Timing Role: High-speed edge detection, index pulse filtering, and 4× interpolation logic running at 50 MHz. Use Value: Supports 200 kcounts/sec encoder resolution with deterministic 25 ns response latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S250E-4VQG100C | Higher logic density (5,760 CLBs), same VQFP-100 package, enhanced DCM features, and lower static power | Better suited for designs requiring additional state machines or larger on-chip memory buffers | Select when future scalability or reduced power under idle conditions is required |
| XC3S400-5PQG208C | Larger PQFP-208 package, 8,064 CLBs, 352 I/Os, and higher block RAM (352 Kbits) | Supports more complex interface aggregation (e.g., dual Ethernet + USB + SPI) but requires PCB redesign | Choose only if I/O count or logic capacity exceeds XC3S200-5VQG100C limits |
Compared with XC3S200-5VQG100C, the XC3S250E-4VQG100C offers incremental logic headroom within identical footprint and pinout, while the XC3S400-5PQG208C delivers substantial resource growth at the cost of board layout change and higher BOM cost.
Availability
XC3S200-5VQG100C is available at Aetrix Electronics and suitable for industrial automation, legacy system upgrades, and embedded interface bridging requiring stable component supply over extended production lifecycles.
Supply support for XC3S200-5VQG100C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and automotive markets.
The Spartan-3 family, including XC3S200-5VQG100C, was designed for cost-optimized reconfigurable logic in industrial control, communications infrastructure, and consumer electronics where predictable timing and low-power operation are critical.
FAQ
What is the operating temperature range for XC3S200-5VQG100C?
The XC3S200-5VQG100C is rated for industrial temperature operation from -40°C to +85°C. This range is validated per Xilinx DS099 specification and applies to all VQFP-packaged Spartan-3 devices with 'C' speed grade. Thermal derating is not required within this ambient envelope when mounted on standard FR-4 PCBs with adequate copper pour.
Does XC3S200-5VQG100C support JTAG boundary-scan testing?
Yes, XC3S200-5VQG100C fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. The device implements mandatory instruction register, bypass, and sample/preload capabilities, enabling board-level interconnect testing and in-system programming without requiring external configuration PROM.
What configuration modes are supported by XC3S200-5VQG100C?
XC3S200-5VQG100C supports Master Serial (via external PROM), Slave Parallel (host CPU-driven), and JTAG modes. Configuration begins after PROGRAM_B deassertion and completes when DONE pin goes high. Startup time is typically 100 ms with default settings and depends on bitstream size and clock source stability.
Can XC3S200-5VQG100C operate with 2.5V I/O voltage?
No, XC3S200-5VQG100C I/O banks are specified only for 3.3V operation (LVTTL/LVCMOS33). Its VCCO pins do not support 2.5V; attempting 2.5V I/O may cause unreliable signaling or damage. For mixed-voltage systems, use separate I/O banks powered at 3.3V or select a newer Spartan-6 device with wider I/O voltage range.
Is XC3S200-5VQG100C still in active production?
XC3S200-5VQG100C is no longer in active production by AMD/Xilinx but remains available through authorized distributors and Aetrix Electronics' extended lifecycle program. Obsolescence status is tracked under PCN #XIL-2021-012; last-time-buy windows and cross-reference paths to Spartan-6 or Artix-7 alternatives are managed per customer BOM requirements.
XC3S200-5VQG100C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 480
- Number of Logic Elements/Cells:
- 4320
- Total RAM Bits:
- 221184
- Number of I/O:
- 63
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S200-5VQG100C FAQ
1.How can I place an order for XC3S200-5VQG100C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200-5VQG100C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200-5VQG100C reliable?
The price and inventory of XC3S200-5VQG100C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200-5VQG100C is usually 5 days.
3.What payment methods are accepted for XC3S200-5VQG100C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200-5VQG100C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200-5VQG100C?
XC3S200-5VQG100C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200-5VQG100C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200-5VQG100C?
For technical support, including XC3S200-5VQG100C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200-5VQG100C requirements.
6.How does Aetrix verify that XC3S200-5VQG100C is sourced from the original manufacturer or authorized distributors?
All XC3S200-5VQG100C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200-5VQG100C meets industry standards.
7.What is the process for return or replacement of XC3S200-5VQG100C?
All XC3S200-5VQG100C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200-5VQG100C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200-5VQG100C part is unused and in its original packaging.
Return procedure for XC3S200-5VQG100C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S200-5VQG100C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
