My Inquiry
My Account
AMD XC3S200A-4FG320I
- Part No.:
- XC3S200A-4FG320I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S200A-4FG320I.pdf
- Description:
- IC FPGA 248 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,869
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S200A-4FG320I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 200,000 system gates, 4,032 logic cells, and 216 I/O pins in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns) and supports 1.2 V core voltage with 3.3 V or 2.5 V I/O standards, used in industrial control logic and reconfigurable digital signal processing.
For engineers reviewing the XC3S200A-4FG320I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade, core voltage compatibility, and FBGA thermal/mechanical constraints for PCB layout and thermal management.
Technical Context
The XC3S200A-4FG320I implements a fully SRAM-based configurable logic architecture with distributed RAM, block RAM (18 Kbits), and dedicated multipliers (18×18). It integrates Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction across up to eight independent clock domains.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, with support for SelectMAP and Slave Parallel modes. The device includes internal pull-up resistors on configuration pins and supports IEEE 1149.1 JTAG boundary-scan testing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,032 - defines maximum combinational/sequential logic capacity for custom state machines or datapaths |
| System Gates | 200,000 - industry-standard metric for relative logic density versus ASIC equivalents |
| I/O Pins | 216 - supports high-pin-count interfaces such as parallel buses, video data paths, or multi-channel ADC/DAC control |
| Block RAM | 18 Kbits - enables on-chip buffering for FIFOs, lookup tables, or small frame stores without external memory |
| DCM Units | 4 - provides independent clock domain management including jitter reduction and phase alignment |
| Speed Grade | -4 (tPD = 4.5 ns) - guarantees maximum propagation delay for critical path timing closure at 200 MHz operation |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply with low-noise layout to prevent configuration corruption |
Pinout & Package
XC3S200A-4FG320I is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 216 user I/Os, 8 configuration pins (e.g., INIT_B, PROGRAM_B, DONE), 4 DCM clock inputs, and dedicated power/ground balls arranged in a 23×23 array with 0.8 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asserting low resets configuration logic and clears SRAM contents; must be pulled high during normal operation |
| INIT_B | Active-Low Configuration Status | Open-drain output indicating configuration memory initialization status; low during erase/reload |
| DONE | Configuration Completion Indicator | Open-drain output that goes high when configuration bitstream loading and startup sequence complete |
| CCLK | Configuration Clock Input | Drives internal shift register during Master Serial configuration; max 50 MHz, sourced externally or by DCM |
| IO_L0N_0 | User I/O Bank 0, Pin N | Configurable as input/output/bidirectional with programmable slew rate and drive strength (2–24 mA) |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 18×18 Multipliers | Enables hardware-accelerated arithmetic for FIR filters, correlators, or motor control algorithms without LUT resource consumption |
| Digital Clock Manager (DCM) | Provides deterministic clock deskew, frequency synthesis (×2 to ×32), and 0°–360° phase shift per DCM for precise timing alignment |
| SelectIO Technology | Supports LVCMOS, LVTTL, PCI, SSTL, and HSTL I/O standards with programmable termination and adjustable drive strength |
| Embedded Block RAM | 18 Kbits distributed across four 4,608-bit blocks-sufficient for dual-port buffer implementation or small instruction memory |
| JTAG Boundary-Scan | IEEE 1149.1-compliant test access port enables in-system programming and board-level interconnect verification |
Applications
| Industrial PLC Logic Controller | Video Interface Bridge |
|---|---|
Use Scenario: Replacing fixed-function ASICs in modular I/O modules requiring field-upgradable logic for analog/digital signal conditioning and protocol translation. IC Role / Device Role / Timing Role: Configurable logic fabric implementing real-time ladder logic execution, watchdog timers, and isolated serial interface bridging (RS-485/Modbus to SPI). Use Value: Enables firmware-defined I/O mapping and functional safety monitoring without hardware redesign or component replacement. | Use Scenario: Converting parallel RGB/YUV video streams from image sensors to MIPI D-PHY or LVDS serialized outputs in machine vision cameras. IC Role / Device Role / Timing Role: Pixel clock domain crossing, format conversion, and serialization control logic synchronized across multiple DCM-managed clocks. Use Value: Eliminates need for discrete glue logic and reduces PCB layer count by integrating timing-critical video pipeline functions. |
| Medical Ultrasound Beamformer | Test Equipment Pattern Generator |
Use Scenario: Implementing time-aligned delay lines and dynamic apodization weighting for phased-array transducer control in portable ultrasound systems. IC Role / Device Role / Timing Role: High-speed parallel processing engine synchronizing >64 channel sample delays with sub-nanosecond skew tolerance using DCM-derived clocks. Use Value: Achieves real-time beam steering with deterministic latency and eliminates external delay ICs and associated routing complexity. | Use Scenario: Generating high-fidelity digital stimulus patterns (up to 200 MHz) for ATE validation of microcontrollers and mixed-signal SoCs. IC Role / Device Role / Timing Role: Programmable pattern sequencer with synchronous I/O toggling, variable-width strobes, and error injection capability via LUT-based logic. Use Value: Reduces test development time by enabling in-field pattern updates and protocol-specific waveform generation without hardware changes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400A-4FG320I | Higher logic density (6,048 CLBs), same package and speed grade; larger bitstream size increases configuration time | Preferred for designs requiring additional embedded memory or complex state machines beyond XC3S200A capacity | Select when future scalability or integration of soft-core processors (e.g., MicroBlaze) is required |
| XC6SLX25-2CSG324C | Spartan-6 family; 24,050 logic cells, 1.2 V core, but uses 324-pin CSBGA package with different ball map and thermal profile | Better DSP slice density and integrated PCIe endpoint support; not pin-compatible with XC3S200A-4FG320I | Choose for new designs needing higher performance, lower static power, or native interface IP cores |
Compared with XC3S200A-4FG320I, XC3S400A-4FG320I offers headroom within identical footprint and timing, while XC6SLX25-2CSG324C delivers architectural upgrades at the cost of PCB redesign and toolchain migration.
Availability
XC3S200A-4FG320I is available at Aetrix Electronics and suitable for industrial automation, medical imaging, and test equipment applications requiring stable component supply and long-term obsolescence mitigation.
Supply support for XC3S200A-4FG320I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-3A product lines for industrial and aerospace customers requiring long-lifecycle support.
The Spartan-3A family was designed for cost-sensitive, high-volume applications demanding reconfigurable logic with predictable timing, low static power, and robust configuration security.
FAQ
What is the configuration method supported by XC3S200A-4FG320I?
The XC3S200A-4FG320I supports Master Serial, Slave Serial, Slave Parallel, and SelectMAP configuration modes. Master Serial is most common, using an external PROM and CCLK generated internally or externally. JTAG is used for programming and boundary-scan testing. All modes require proper initialization sequencing of PROGRAM_B, INIT_B, and DONE signals to ensure reliable bitstream loading into the SRAM fabric of the XC3S200A-4FG320I.
Does XC3S200A-4FG320I support differential I/O standards like LVDS?
No, the XC3S200A-4FG320I does not support true LVDS signaling. It supports LVCMOS, LVTTL, PCI, SSTL, and HSTL standards with programmable drive strength and slew rate, but lacks dedicated differential termination or internal differential receiver circuitry. For LVDS interfaces, external differential line receivers or newer FPGA families such as Spartan-6 or Artix-7 must be used instead of the XC3S200A-4FG320I.
What is the maximum operating junction temperature for XC3S200A-4FG320I?
The XC3S200A-4FG320I has a maximum junction temperature rating of +100°C under continuous operation, as specified in the Xilinx DS312 v1.5 datasheet. This limit assumes proper PCB thermal design with adequate copper pour, thermal vias under the FBGA, and airflow. Exceeding this temperature risks configuration loss, timing violation, or permanent damage to the XC3S200A-4FG320I device.
Can XC3S200A-4FG320I be reprogrammed in-system?
Yes, the XC3S200A-4FG320I supports in-system programming (ISP) via JTAG boundary-scan using standard IEEE 1149.1 tools. The device's SRAM-based configuration allows full reprogramming without removal from the PCB. ISP requires correct JTAG chain setup, valid bitstream, and adherence to the configuration state machine timing-critical for field updates and prototyping iterations involving the XC3S200A-4FG320I.
Is there built-in configuration memory in XC3S200A-4FG320I?
No, the XC3S200A-4FG320I does not contain non-volatile configuration memory. It relies entirely on external storage (e.g., XCFxx PROM, SPI flash, or microcontroller) to reload its configuration bitstream on power-up. The SRAM-based architecture means the XC3S200A-4FG320I loses its configuration when powered down, requiring a reliable external configuration source and proper power-on reset sequencing to ensure functional startup.
XC3S200A-4FG320I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 248
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S200A-4FG320I FAQ
1.How can I place an order for XC3S200A-4FG320I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200A-4FG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200A-4FG320I reliable?
The price and inventory of XC3S200A-4FG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200A-4FG320I is usually 5 days.
3.What payment methods are accepted for XC3S200A-4FG320I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200A-4FG320I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200A-4FG320I?
XC3S200A-4FG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200A-4FG320I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200A-4FG320I?
For technical support, including XC3S200A-4FG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200A-4FG320I requirements.
6.How does Aetrix verify that XC3S200A-4FG320I is sourced from the original manufacturer or authorized distributors?
All XC3S200A-4FG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200A-4FG320I meets industry standards.
7.What is the process for return or replacement of XC3S200A-4FG320I?
All XC3S200A-4FG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200A-4FG320I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200A-4FG320I part is unused and in its original packaging.
Return procedure for XC3S200A-4FG320I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S200A-4FG320I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
