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AMD XC3S200A-4FGG320C
- Part No.:
- XC3S200A-4FGG320C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S200A-4FGG320C.pdf
- Description:
- IC FPGA 248 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,096
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Product details
Overview
XC3S200A-4FGG320C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 200,000 system gates, 4,032 logic cells, 180 I/O pins, and configured in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade and supports 1.2 V core voltage for low-power embedded control and interface bridging applications.
For engineers reviewing the XC3S200A-4FGG320C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic cell density, core voltage tolerance, JTAG configuration support, and industrial temperature range compliance.
Technical Context
The XC3S200A-4FGG320C implements a fully SRAM-based configurable logic architecture with distributed RAM, block RAM (18 Kbits), and dedicated digital clock managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction. It integrates SelectIO technology for LVCMOS, LVTTL, PCI, and SSTL I/O standards.
Configuration is performed via JTAG boundary-scan or master serial mode using external PROM. The device supports partial reconfiguration and includes internal pull-up resistors, slew-rate control, and programmable drive strength per I/O bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,032 - provides combinational and sequential logic capacity for medium-complexity control and protocol translation logic |
| System Gates | 200,000 - indicates overall logic density suitable for bridging and peripheral interface functions |
| I/O Pins | 180 - supports multi-bank voltage operation and mixed-signaling interfaces without level shifters |
| Block RAM | 18 Kbits - enables local data buffering, FIFOs, or small lookup tables within fabric |
| Core Voltage | 1.2 V ±3% - defines power supply regulation requirement and impacts dynamic power consumption |
| Speed Grade | -4 - specifies maximum operating frequency for timing-critical paths (e.g., 333 MHz DCM output) |
| Operating Temp | 0°C to +85°C - qualifies for commercial/industrial ambient environments, not extended or automotive |
Pinout & Package
XC3S200A-4FGG320C is housed in a 320-ball fine-pitch BGA (FGG) package with 1.0 mm ball pitch, 19 mm × 19 mm body size, and standard JEDEC MO-251AC footprint. Thermal pad is not present; package is lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be decoupled locally with 100 nF + 10 µF capacitors near each power ball group |
| VCCO_0–VCCO_5 | I/O bank power | Each bank independently configurable for 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V signaling |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables in-system programming, debugging, and IEEE 1149.1-compliant test access |
| CCLK | Configuration clock input | Drives internal configuration logic during master serial PROM loading |
| PROGRAM_B | Active-low configuration reset | Pulling low initiates full reconfiguration; requires external pull-up resistor |
| DONE | Configuration status indicator | Open-drain output asserted high when configuration completes successfully |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Two integrated DCMs provide jitter-reduced clock synthesis, phase alignment, and frequency multiplication/division without external PLL ICs |
| SelectIO Technology | Per-bank I/O standard support enables direct interfacing to diverse peripherals (e.g., ADCs, microcontrollers, memory) without external level translators |
| Configurable I/O Drive Strength | Programmable 2 mA to 24 mA per pin reduces signal integrity issues and EMI in noise-sensitive systems |
| Internal Pull-Up Resistors | Configurable on all user I/Os eliminates need for external biasing components on bus lines or control signals |
| Partial Reconfiguration Support | Allows runtime logic updates in designated regions while maintaining system operation-critical for adaptive communication protocols |
Applications
| Industrial PLC I/O Module | Medical Sensor Interface Hub |
|---|---|
Use Scenario: Real-time acquisition and preprocessing of analog sensor data from multiple transducers in compact diagnostic equipment. IC Role / Device Role / Timing Role: FPGA acts as a programmable sensor aggregator and digital filter engine, synchronizing ADC sampling clocks and applying FIR filtering before sending results to host MCU. Use Value: Reduces BOM count by replacing discrete logic and timing ICs; enables field-upgradable signal processing algorithms. | Use Scenario: Bridging legacy RS-485 fieldbus devices to modern USB or Ethernet controllers in portable patient monitors. IC Role / Device Role / Timing Role: Protocol translator and physical layer adapter handling UART-to-SPI conversion, CRC generation, and timing-critical bus arbitration. Use Value: Eliminates need for dual-processor architectures; supports deterministic latency under 2 µs for critical alarm response. |
| Automated Test Equipment (ATE) Fixture Controller | Avionics Data Acquisition Node |
Use Scenario: Controlling stimulus generation and response capture across 32-channel DUT interfaces with precise timing alignment. IC Role / Device Role / Timing Role: Timing-critical sequencer managing parallel test vectors, sample clocks, and pass/fail flag aggregation. Use Value: Achieves sub-10 ns inter-channel skew using internal DCM phase alignment-enabling high-fidelity parametric testing. | Use Scenario: Collecting and formatting ARINC 429 and discrete I/O signals for transmission over MIL-STD-1553B bus in UAV flight control units. IC Role / Device Role / Timing Role: Deterministic data formatter and bus controller with built-in Manchester encoding/decoding and parity validation. Use Value: Meets DO-254 Level A design assurance requirements through traceable RTL and verified timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S250E-4FGG320C | Higher logic density (5,760 LCs), same package and pinout, but uses newer 90 nm process and enhanced DCM features | Better suited for designs requiring additional state machines or wider datapaths without PCB change | Preferred when future scalability or lower static power is required; shares identical footprint and I/O assignment |
| XC6SLX25-2FTG256C | Based on Spartan-6 architecture with 23,040 logic cells, DDR2 controller, and improved DSP slices-but different pinout and larger 256-ball FTBGA package | Supports higher-speed memory interfaces and more complex embedded processing tasks | Recommended for new designs needing greater performance headroom; requires PCB redesign and toolchain migration |
Compared with XC3S200A-4FGG320C, the XC3S250E-4FGG320C offers higher density in identical packaging for seamless upgrade, while the XC6SLX25-2FTG256C delivers architectural improvements at the cost of layout and software requalification.
Availability
XC3S200A-4FGG320C is available at Aetrix Electronics and suitable for industrial automation, medical instrumentation, and avionics subsystems requiring stable component supply across long production lifecycles.
Supply support for XC3S200A-4FGG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now oversees the Spartan FPGA product family. Xilinx originally developed these devices for cost-sensitive, high-volume embedded applications requiring flexibility without ASIC-level NRE.
The Spartan-3A family-including XC3S200A-4FGG320C-was engineered for non-volatile configuration support, low static power, and rapid time-to-market in industrial control, test equipment, and communications infrastructure.
FAQ
What is the configuration method supported by XC3S200A-4FGG320C?
XC3S200A-4FGG320C supports JTAG boundary-scan configuration and master serial mode using external SPI PROM. It does not support slave parallel or BPI modes. Configuration bitstream is loaded into on-chip SRAM, requiring persistent external storage for power-on initialization. The XC3S200A-4FGG320C must be reconfigured after each power cycle unless paired with a dedicated configuration PROM.
Does XC3S200A-4FGG320C include embedded block RAM?
Yes, XC3S200A-4FGG320C contains 18 Kbits of total block RAM distributed across 16 blocks of 1,024 × 18-bit dual-port RAM. Each block supports synchronous read/write, byte-write enable, and programmable write depth. This RAM is used for FIFOs, data buffers, or small lookup tables and is accessible directly from fabric logic without external memory interface overhead.
What I/O standards are supported by XC3S200A-4FGG320C?
XC3S200A-4FGG320C supports LVCMOS, LVTTL, PCI, SSTL18, SSTL2, HSTL, and differential standards including LVDS and RSDS per I/O bank. Voltage levels are set per bank via VCCO pins, allowing mixed-voltage operation. Termination resistors are not integrated; external termination is required for differential and high-speed single-ended standards.
Is XC3S200A-4FGG320C qualified for automotive applications?
No, XC3S200A-4FGG320C is rated for 0°C to +85°C operation and carries no AEC-Q100 qualification. It is intended for commercial and industrial environments only. For automotive use, AMD/Xilinx recommends the Spartan-3AN family with embedded flash or Spartan-6Q devices with extended temperature and qualification support-not the XC3S200A-4FGG320C.
Can XC3S200A-4FGG320C perform partial reconfiguration?
Yes, XC3S200A-4FGG320C supports partial reconfiguration through its JTAG port and dedicated ICAP (Internal Configuration Access Port) interface. This allows dynamic replacement of logic modules while other portions remain operational. Implementation requires Xilinx ISE 12.4 or later, specific floorplanning, and bitstream partitioning-verified in documented reference designs for protocol adaptation and real-time signal processing.
XC3S200A-4FGG320C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 248
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S200A-4FGG320C FAQ
1.How can I place an order for XC3S200A-4FGG320C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200A-4FGG320C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200A-4FGG320C reliable?
The price and inventory of XC3S200A-4FGG320C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200A-4FGG320C is usually 5 days.
3.What payment methods are accepted for XC3S200A-4FGG320C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200A-4FGG320C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200A-4FGG320C?
XC3S200A-4FGG320C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200A-4FGG320C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200A-4FGG320C?
For technical support, including XC3S200A-4FGG320C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200A-4FGG320C requirements.
6.How does Aetrix verify that XC3S200A-4FGG320C is sourced from the original manufacturer or authorized distributors?
All XC3S200A-4FGG320C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200A-4FGG320C meets industry standards.
7.What is the process for return or replacement of XC3S200A-4FGG320C?
All XC3S200A-4FGG320C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200A-4FGG320C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200A-4FGG320C part is unused and in its original packaging.
Return procedure for XC3S200A-4FGG320C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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