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AMD XC3S200A-4FGG320I
- Part No.:
- XC3S200A-4FGG320I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 320-BGA
- Datasheet:
-
XC3S200A-4FGG320I.pdf
- Description:
- IC FPGA 248 I/O 320FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,939
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Product details
Overview
XC3S200A-4FGG320I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 200,000 system gates, 4,032 logic cells, and 216 I/O pins in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.8 ns) and supports 1.2 V core voltage with 3.3 V/2.5 V/1.8 V I/O compatibility, used in industrial control logic and reconfigurable digital signal processing.
For engineers reviewing the XC3S200A-4FGG320I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, speed grade timing, core voltage requirement, and FBGA thermal/mechanical constraints for PCB layout and thermal management.
Technical Context
The XC3S200A-4FGG320I implements a fully SRAM-based configurable logic architecture with distributed RAM, block RAM (576 Kbits), and dedicated multipliers (12 × 18-bit). It integrates Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction across up to 8 independent clock domains.
Configuration is performed via Master Serial (SPI), Slave Serial, or JTAG modes using external PROM or processor-controlled loading. The device supports IEEE 1149.1 boundary-scan testing and includes internal pull-up resistors on configuration pins and I/O banks with programmable drive strength and slew rate control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,032 - defines maximum combinational and sequential logic capacity per design |
| System Gates | 200,000 - industry-standard metric for relative logic density vs. ASIC equivalents |
| I/O Pins | 216 - supports high-pin-count interface bridging (e.g., parallel bus, video, memory) |
| Block RAM | 576 Kbits - enables on-chip FIFOs, buffers, and small lookup tables without external memory |
| DCM Units | 4 - provides jitter-tolerant clock synthesis and phase alignment for synchronous subsystems |
| Speed Grade | -4 (tPD = 4.8 ns) - guarantees worst-case propagation delay for critical path timing closure |
| Core Voltage | 1.2 V ± 3% - requires low-noise, tightly regulated power delivery network |
Pinout & Package
XC3S200A-4FGG320I uses a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 15 × 15 mm body size, and thermal pad for enhanced heat dissipation. Package conforms to JEDEC MO-230, RoHS-compliant, and rated for industrial temperature range (-40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for FPGA logic fabric; requires local decoupling and low-ESR capacitors |
| VCCO_0 | I/O bank power | Configurable 1.8/2.5/3.3 V supply for Bank 0 I/Os; sets voltage standard for connected peripherals |
| PROGRAM_B | Active-low configuration initiator | Pulling low forces reconfiguration from external PROM or host processor |
| DONE | Configuration status indicator | Open-drain output signals successful bitstream load; must be pulled up externally |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | Enables in-system programming, debug, and IEEE 1149.1 compliance testing |
Key Features
| Feature | Design Value |
|---|---|
| Multi-voltage I/O banks | Supports concurrent 1.8 V, 2.5 V, and 3.3 V interfaces on same device-enables direct connection to mixed-voltage peripherals without level shifters |
| Dedicated DCMs | Four independent Digital Clock Managers provide deterministic clock skew control and jitter reduction for timing-critical subsystems |
| Embedded block RAM | 576 Kbits of dual-port RAM blocks allow simultaneous read/write access for buffering and data coalescing in real-time pipelines |
| Configurable I/O standards | Supports LVCMOS, LVTTL, PCI, SSTL, and HSTL I/O standards-enables interoperability with legacy and high-speed memory interfaces |
| Internal pull-up resistors | Programmable per-pin pull-ups eliminate need for external resistors on configuration and unused I/O pins, reducing BOM count |
Applications
| Industrial Motion Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time servo loop coordination in CNC machines and robotic arms requiring deterministic latency and parallel I/O handling. IC Role / Device Role / Timing Role: FPGA fabric executes custom motion algorithms; DCMs synchronize encoder feedback, PWM outputs, and safety monitoring clocks. Use Value: 216 I/O pins enable direct connection to multiple axes, encoders, and fieldbus interfaces; -4 speed grade ensures sub-5 ns timing margin for 100 kHz control loops. | Use Scenario: Converting between parallel RGB/YUV video formats and serialized interfaces (e.g., LVDS, FPD-Link) in medical imaging displays. IC Role / Device Role / Timing Role: Configurable logic implements pixel clock domain crossing, color space conversion, and serialization logic; block RAM buffers frame data. Use Value: 576 Kbits embedded RAM eliminates external frame buffer ICs; multi-voltage I/O supports both 3.3 V video DACs and 1.8 V serializer inputs. |
| Programmable Logic Controller (PLC) | Test Equipment Signal Generation |
Use Scenario: Reconfigurable I/O expansion and ladder logic execution in modular PLC backplanes with hot-swap capability. IC Role / Device Role / Timing Role: Implements custom I/O mapping, protocol translation (Modbus RTU/ASCII), and watchdog timers; configured via JTAG or serial PROM. Use Value: 4,032 logic cells support complex state machines and interrupt-driven I/O handling; industrial temp rating ensures operation in cabinet environments up to 100°C. | Use Scenario: Generating precise, multi-channel digital stimulus waveforms (e.g., SPI, I2C, custom protocols) for semiconductor ATE and validation labs. IC Role / Device Role / Timing Role: FPGA fabric synthesizes synchronized waveform generators with nanosecond-level edge placement; DCMs lock to reference clocks for jitter < 100 ps. Use Value: -4 speed grade and 4 DCMs enable stable 100+ MHz waveform generation with deterministic phase alignment across 8+ channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O expansion applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400A-4FGG320I | Higher logic density (8,064 LCs, 400K gates), same package and speed grade | Supports larger state machines and deeper pipeline stages; requires more configuration memory and power | Select when design exceeds 4,032 LC utilization or requires additional block RAM (1,152 Kbits) |
| XC3S200A-4VQG100C | Same logic resources but 100-pin TQFP package (66 I/O), commercial temp range (0°C to +85°C) | Limited I/O count and no industrial temp rating; lower cost and simpler PCB routing | Select for cost-sensitive, low-I/O prototyping or non-industrial applications where thermal margin is sufficient |
Compared with XC3S200A-4FGG320I, the XC3S400A-4FGG320I offers scalable logic headroom without changing PCB layout, while the XC3S200A-4VQG100C trades I/O count and temperature range for simplified assembly and lower BOM cost-choice depends on gate utilization, interface count, and environmental requirements.
Availability
XC3S200A-4FGG320I is available at Aetrix Electronics and suitable for industrial motion control, video interface bridging, and programmable logic controller (PLC) applications requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for XC3S200A-4FGG320I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance, heterogeneous workloads.
The Spartan-3A family was designed for cost-sensitive, high-volume applications requiring reliable reconfigurable logic, moderate performance, and industrial-grade reliability-targeting industrial automation, video, and communications infrastructure.
FAQ
What is the operating temperature range for XC3S200A-4FGG320I?
The XC3S200A-4FGG320I is rated for industrial temperature operation from -40°C to +100°C. This specification applies to the junction temperature under specified voltage and loading conditions. Thermal design must ensure the die temperature remains within this range during continuous operation, especially when driving all 216 I/Os at maximum slew rate. The XC3S200A-4FGG320I datasheet defines derating curves for ambient temperature versus power dissipation.
Does XC3S200A-4FGG320I support JTAG configuration?
Yes, XC3S200A-4FGG320I supports IEEE 1149.1 JTAG configuration through dedicated TCK, TMS, TDI, and TDO pins. JTAG mode enables in-system programming, boundary-scan testing, and debug access without requiring external configuration PROM. The XC3S200A-4FGG320I also supports Master Serial and Slave Serial modes, but JTAG is the only method that allows partial reconfiguration and real-time visibility into internal logic states.
What I/O standards are supported by XC3S200A-4FGG320I?
XC3S200A-4FGG320I supports LVCMOS, LVTTL, PCI, SSTL2, SSTL3, and HSTL I/O standards across its 10 configurable I/O banks. Each bank operates at a single VCCO voltage (1.8 V, 2.5 V, or 3.3 V), and standards are selected per-pin in the configuration bitstream. The XC3S200A-4FGG320I does not support differential standards like LVDS or RSDS natively without external termination or IBUFDS primitives.
How much block RAM is available in XC3S200A-4FGG320I?
The XC3S200A-4FGG320I contains 576 Kbits of total block RAM, organized as eighteen 32 × 1024-bit blocks. Each block can be configured as single-port or true dual-port RAM, shift register, or ROM. This resource is physically separate from distributed RAM and is used for larger data buffers, FIFOs, or lookup tables. The XC3S200A-4FGG320I does not include dedicated cache or processor-accessible memory controllers.
Is XC3S200A-4FGG320I pin-compatible with other Spartan-3A devices in the same package?
XC3S200A-4FGG320I shares the same 320-pin FBGA footprint with XC3S400A-4FGG320I and XC3S1000A-4FGG320I, enabling PCB reuse across density variants. Power and configuration pins are identical; however, some I/O pins may be uncommitted or reserved in lower-density parts. The XC3S200A-4FGG320I pinout is fixed and documented in Xilinx DS312 (v2.5), and full functional compatibility requires matching speed grade and I/O bank assignments.
XC3S200A-4FGG320I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 320-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 248
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 320-FBGA (19x19)
XC3S200A-4FGG320I FAQ
1.How can I place an order for XC3S200A-4FGG320I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200A-4FGG320I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200A-4FGG320I reliable?
The price and inventory of XC3S200A-4FGG320I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200A-4FGG320I is usually 5 days.
3.What payment methods are accepted for XC3S200A-4FGG320I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200A-4FGG320I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200A-4FGG320I?
XC3S200A-4FGG320I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200A-4FGG320I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200A-4FGG320I?
For technical support, including XC3S200A-4FGG320I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200A-4FGG320I requirements.
6.How does Aetrix verify that XC3S200A-4FGG320I is sourced from the original manufacturer or authorized distributors?
All XC3S200A-4FGG320I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200A-4FGG320I meets industry standards.
7.What is the process for return or replacement of XC3S200A-4FGG320I?
All XC3S200A-4FGG320I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200A-4FGG320I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200A-4FGG320I part is unused and in its original packaging.
Return procedure for XC3S200A-4FGG320I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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