My Inquiry
My Account
AMD XC3S200A-4FT256C
- Part No.:
- XC3S200A-4FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200A-4FT256C.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,478
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S200A-4FT256C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 200,000 system gates, 4,032 logic cells, and 216 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.8 ns), supports SelectIO standards up to 333 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S200A-4FT256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V/2.5 V/3.3 V), distributed RAM capacity (72 Kb), and configuration via Master Serial mode using external PROM.
Technical Context
The XC3S200A-4FT256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated multipliers, and block RAMs. It uses SRAM-based configuration memory and requires external non-volatile storage for power-up initialization.
It supports JTAG boundary-scan testing per IEEE 1149.1 and includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty-cycle correction across two independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,032 - provides combinational and sequential logic resources for state machines and data path implementation |
| System Gates | 200,000 - indicates overall logic density suitable for mid-complexity digital control functions |
| I/O Pins | 216 - supports high-pin-count peripheral interfacing with bank-wise voltage isolation |
| Block RAM | 72 Kb - enables on-chip buffering, FIFOs, and small lookup tables without external memory |
| DCM Units | 4 - allows independent clock domain management including frequency synthesis and jitter reduction |
| Speed Grade | -4 - guarantees maximum clock-to-output delay of 4.8 ns for critical path timing closure |
Pinout & Package
XC3S200A-4FT256C is housed in a 256-ball Fine-Pitch BGA (FT256) package with 1.0 mm ball pitch, 17 × 17 array, and thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input for CLB and interconnect logic |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration circuitry and DCMs |
| A1 | VCCO_0 | 3.3 V I/O bank supply for Bank 0 (pins A1–D12) |
| T14 | PROGRAM_B | Active-low asynchronous configuration reset signal |
| R15 | DONE | Open-drain status output indicating successful configuration completion |
| M16 | TCK | JTAG test clock input per IEEE 1149.1 boundary-scan protocol |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports LVCMOS, LVTTL, PCI, HSTL, and SSTL I/O standards with programmable drive strength and slew rate |
| Digital Clock Manager (DCM) | Four independent DCMs provide zero-delay buffering, frequency synthesis (×2 to ×32), and ±150 ps phase shift resolution |
| Configuration Security | Bitstream encryption option prevents reverse engineering of programmed logic design |
| Embedded Multipliers | Four 18 × 18 signed multipliers enable efficient arithmetic-intensive tasks such as filtering and motor control |
Applications
| Industrial PLC I/O Module | Automotive Body Control Unit |
|---|---|
Use Scenario: Real-time digital signal conditioning and protocol translation between field sensors and CAN/LIN bus networks. IC Role / Device Role / Timing Role: FPGA acts as a reconfigurable logic bridge handling GPIO expansion, PWM generation, and SPI-to-parallel conversion. Use Value: Enables single-chip replacement of multiple ASICs while supporting field-upgradable functionality via reconfiguration. | Use Scenario: Centralized control of lighting, window lift, and door lock subsystems with fail-safe monitoring. IC Role / Device Role / Timing Role: XC3S200A-4FT256C implements safety-critical watchdog timers, CRC checkers, and dual-lockstep logic paths. Use Value: Meets ASIL-B functional safety requirements through deterministic timing and internal redundancy structures. |
| Medical Diagnostic Interface Board | Test & Measurement Equipment Front-End |
Use Scenario: High-speed acquisition and preprocessing of analog sensor data from ultrasound transducers. IC Role / Device Role / Timing Role: XC3S200A-4FT256C performs real-time FIR filtering, decimation, and parallel-to-serial conversion before ADC/DAC interfacing. Use Value: Reduces latency by executing signal processing in hardware rather than software, improving diagnostic response time. | Use Scenario: Synchronization and triggering of multi-channel oscilloscope inputs with sub-nanosecond jitter tolerance. IC Role / Device Role / Timing Role: FPGA manages precise timestamping, trigger arbitration, and sample buffering using internal DCMs and block RAM. Use Value: Achieves <100 ps channel-to-channel skew across 16 analog inputs without external timing ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC3S400A-4FT256C | Higher logic density (400K gates, 8,064 CLBs), same package and speed grade | Required for designs needing >4K logic cells or additional block RAM (144 Kb) | Select when future scalability or increased on-chip memory is needed without PCB redesign |
| Lattice LFXP2-8E-6FTN256C | Flash-based architecture, no external configuration PROM required; lower logic density (8K LUTs) | Suitable for instant-on, low-power applications where configuration time and security are critical | Prefer for battery-powered or safety-critical systems requiring single-chip boot reliability |
Compared with XC3S200A-4FT256C, the XC3S400A-4FT256C offers headroom for logic growth within identical footprint, while the LFXP2-8E-6FTN256C eliminates configuration dependency but trades off gate count and clock performance.
Availability
XC3S200A-4FT256C is available at Aetrix Electronics and suitable for industrial automation, automotive electronics, and medical device manufacturing requiring stable component supply and long-term production continuity.
Supply support for XC3S200A-4FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3A family was designed for cost-optimized, high-volume applications demanding reliable I/O flexibility, moderate logic capacity, and industrial temperature operation (0°C to 85°C).
FAQ
What is the operating temperature range for XC3S200A-4FT256C?
The XC3S200A-4FT256C is rated for commercial and industrial temperature ranges. The 'C' suffix denotes an industrial-grade version with guaranteed operation from 0°C to +85°C ambient, validated under JEDEC JESD22-A104 thermal cycling conditions.
Does XC3S200A-4FT256C support JTAG programming?
Yes, XC3S200A-4FT256C fully supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and testing. TCK, TMS, TDI, and TDO pins are assigned to dedicated balls (M16, N15, P15, R16) and require 2.5 V VCCAUX supply during JTAG operations.
How is XC3S200A-4FT256C configured after power-up?
XC3S200A-4FT256C uses Master Serial configuration mode by default. Upon power-up, it drives the DIN pin to read configuration bitstream from an external SPI PROM (e.g., XCF02S), completing configuration in approximately 12 ms at 25 MHz CCLK.
Can XC3S200A-4FT256C operate with mixed I/O voltages?
Yes, XC3S200A-4FT256C supports bank-wise I/O voltage separation: each of its eight I/O banks can be independently supplied with 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling direct interfacing with diverse peripherals without level shifters.
What clock management resources does XC3S200A-4FT256C include?
XC3S200A-4FT256C integrates four Digital Clock Managers (DCMs), each capable of frequency synthesis (×2 to ×32), phase shifting (±150 ps steps), and duty-cycle correction. These support synchronous design across multiple clock domains with jitter below 100 ps RMS.
XC3S200A-4FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 195
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200A-4FT256C FAQ
1.How can I place an order for XC3S200A-4FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200A-4FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200A-4FT256C reliable?
The price and inventory of XC3S200A-4FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200A-4FT256C is usually 5 days.
3.What payment methods are accepted for XC3S200A-4FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200A-4FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200A-4FT256C?
XC3S200A-4FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200A-4FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200A-4FT256C?
For technical support, including XC3S200A-4FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200A-4FT256C requirements.
6.How does Aetrix verify that XC3S200A-4FT256C is sourced from the original manufacturer or authorized distributors?
All XC3S200A-4FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200A-4FT256C meets industry standards.
7.What is the process for return or replacement of XC3S200A-4FT256C?
All XC3S200A-4FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200A-4FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200A-4FT256C part is unused and in its original packaging.
Return procedure for XC3S200A-4FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S200A-4FT256C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
