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AMD XC3S200A-4FT256I
- Part No.:
- XC3S200A-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200A-4FT256I.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,635
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Product details
Overview
XC3S200A-4FT256I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 200,000 system gates, 4,032 logic cells, and 216 Kbits of block RAM, configured in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package for embedded control and interface bridging in industrial I/O modules.
For engineers reviewing the XC3S200A-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include speed grade (-4), temperature range (-40°C to +100°C), I/O count (195 user I/Os), and support for LVCMOS25/LVCMOS33 standards.
Technical Context
The XC3S200A-4FT256I implements a configurable logic fabric based on 4-input LUTs and flip-flops, with dedicated carry logic and distributed RAM. It integrates twelve 18×18 multipliers and supports SelectIO™ technology for programmable I/O standards including SSTL, HSTL, and LVDS.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device includes Digital Clock Managers (DCMs) providing clock synthesis, phase shifting, and duty-cycle correction across up to eight independent clock outputs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,032 - provides combinational and sequential logic capacity for medium-complexity control state machines and protocol engines. |
| System Gates | 200,000 - indicates overall logic density suitable for bridging between legacy parallel buses and modern serial interfaces. |
| Block RAM | 216 Kbits - enables local data buffering, FIFO implementation, and small lookup table storage without external memory. |
| User I/O Pins | 195 - supports high-pin-count peripheral interfacing with voltage-selectable I/O banks (1.2V–3.3V). |
| DCM Units | 2 - delivers jitter-tolerant clock management for synchronous subsystems requiring multiple phase-aligned clocks. |
| Speed Grade | -4 - guarantees timing closure at maximum operating frequencies up to 572 MHz for internal logic paths. |
| Operating Temp | -40°C to +100°C - qualified for extended-temperature industrial environments without derating. |
Pinout & Package
XC3S200A-4FT256I is housed in a 256-ball Fine-Pitch BGA (FT256) package with 1.0 mm ball pitch, 17 × 17 array, and thermal pad exposed on underside for enhanced heat dissipation in compact industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply input - must be filtered locally with low-ESR ceramic capacitors near the ball. |
| P2 | VCCAUX | 2.5 V auxiliary supply for configuration logic and DCM - requires separate regulation and decoupling. |
| T14 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration when pulled low; pulled high during normal operation. |
| R15 | DONE | Open-drain status output - goes high after successful configuration and release of internal global reset. |
| M16 | TCK | JTAG test clock input - used for boundary-scan testing and in-system programming via IEEE 1149.1 interface. |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVCMOS25/33, LVTTL, SSTL2, and HSTL - enables direct interfacing with FPGAs, microcontrollers, and memory without level shifters. |
| Digital Clock Manager (DCM) | Two fully independent DCMs provide frequency synthesis, phase alignment, and duty-cycle correction - eliminates need for external clock ICs in multi-clock domain designs. |
| Embedded Multipliers | Twelve 18 × 18 signed/unsigned multipliers - accelerates arithmetic-intensive tasks like motor control PWM generation and sensor data filtering. |
| Configuration Security | Bitstream encryption option via external PROM - prevents reverse engineering of FPGA configuration in deployed systems. |
Applications
| Industrial PLC I/O Module | Legacy Bus-to-USB Bridge |
|---|---|
Use Scenario: Modular I/O expansion unit in programmable logic controllers handling discrete inputs/outputs and analog signal conditioning. IC Role / Device Role / Timing Role: FPGA acts as real-time I/O controller and protocol translator between field-side sensors/actuators and backplane communication bus. Use Value: Enables flexible, reconfigurable I/O mapping and deterministic response under 100 µs latency using on-chip DCM-synchronized logic. | Use Scenario: Adapter converting parallel printer port (IEEE 1284) or ISA-bus peripherals to USB 2.0 host interface. IC Role / Device Role / Timing Role: FPGA implements parallel-to-serial conversion, handshaking logic, and USB endpoint descriptor management. Use Value: Achieves full-speed USB 12 Mbps throughput while maintaining precise timing control over legacy strobe and acknowledge signals. |
| Motor Drive Control Logic | Video Signal Formatter |
Use Scenario: Closed-loop servo drive with encoder feedback, current sensing, and PWM output generation for 3-phase inverters. IC Role / Device Role / Timing Role: FPGA executes position loop, current loop, and space-vector PWM modulation with sub-microsecond jitter tolerance. Use Value: Delivers 16-bit resolution PWM timing accuracy using internal DCM outputs synchronized to encoder index pulses. | Use Scenario: SDI-to-HDMI converter in broadcast equipment requiring pixel-level timing alignment and color-space translation. IC Role / Device Role / Timing Role: FPGA performs video clock domain crossing, line buffering, and chroma subsampling using block RAM and DSP slices. Use Value: Maintains frame-synchronous output with <1-line delay using 216 Kbits of on-chip RAM for dual-port video buffer implementation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400A-4FT256I | Higher logic density (6,048 LCs, 360 Kbits BRAM), same package and speed grade. | Better suited for designs requiring additional protocol stacks or larger FIFO buffers. | Select when future scalability or added peripheral integration is required without PCB redesign. |
| XC6SLX16-2CSG324C | Based on Spartan-6 architecture; higher performance per LC, lower static power, but different pinout and configuration scheme. | Requires board redesign and toolchain migration; preferred for new designs targeting longer lifecycle and lower power. | Choose for new projects where long-term availability and reduced thermal footprint outweigh legacy compatibility needs. |
Compared with XC3S200A-4FT256I, the XC3S400A-4FT256I offers headroom within identical mechanical and thermal constraints, while the XC6SLX16-2CSG324C introduces architectural improvements at the cost of design revalidation - making the former ideal for incremental upgrades and the latter for green-field deployments.
Availability
XC3S200A-4FT256I is available at Aetrix Electronics and suitable for industrial automation, motor control, and legacy interface bridging requiring stable component supply across extended product lifecycles.
Supply support for XC3S200A-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support the Spartan family as part of its adaptive computing portfolio for cost-sensitive, high-volume industrial applications.
The Spartan-3A product line was designed specifically for embedded control, interface bridging, and digital logic replacement in space- and power-constrained systems where ASIC development cost is prohibitive.
FAQ
What is the maximum operating frequency supported by XC3S200A-4FT256I?
The XC3S200A-4FT256I speed grade -4 guarantees internal logic performance up to 572 MHz for register-to-register paths. Actual system-level clock rates depend on design placement, routing, and I/O standard selection - for example, LVDS I/O can sustain 622 Mbps data rates, while LVCMOS33 supports up to 220 MHz single-ended operation. The XC3S200A-4FT256I DCMs further enable derived clocks with precise phase alignment.
Does XC3S200A-4FT256I support JTAG boundary-scan testing?
Yes, XC3S200A-4FT256I fully complies with IEEE 1149.1 (JTAG) standards. Its TCK, TMS, TDI, and TDO pins enable in-circuit testing, configuration verification, and debug access during manufacturing and field service. The XC3S200A-4FT256I also supports boundary-scan for interconnect testing of surrounding components when integrated into a larger PCB assembly.
What configuration modes are supported by XC3S200A-4FT256I?
XC3S200A-4FT256I supports Master Serial, Slave Serial, Slave Parallel, and JTAG configuration modes. Master Serial is most common, using an external SPI PROM (e.g., XCF02S) to load bitstream at power-up. The XC3S200A-4FT256I PROGRAM_B and INIT_B pins control configuration initiation and status reporting, enabling robust recovery sequences in industrial environments.
Is XC3S200A-4FT256I RoHS compliant?
Yes, XC3S200A-4FT256I is RoHS compliant and lead-free, meeting Directive 2011/65/EU requirements. The FT256 package uses matte tin finish on solder balls and halogen-free molding compound. This compliance is documented in AMD's official product change notices and material declarations for the Spartan-3A family, including the XC3S200A-4FT256I.
Can XC3S200A-4FT256I operate in industrial temperature ranges?
Yes, the 'I' suffix in XC3S200A-4FT256I denotes industrial temperature grade (-40°C to +100°C). This rating applies to the full functional specification - all timing parameters, I/O drive strength, and configuration reliability are guaranteed across this range without derating. The XC3S200A-4FT256I thermal pad and FBGA construction support reliable operation in enclosed, convection-cooled industrial enclosures.
XC3S200A-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 195
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200A-4FT256I FAQ
1.How can I place an order for XC3S200A-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200A-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200A-4FT256I reliable?
The price and inventory of XC3S200A-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200A-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S200A-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200A-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200A-4FT256I?
XC3S200A-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200A-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200A-4FT256I?
For technical support, including XC3S200A-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200A-4FT256I requirements.
6.How does Aetrix verify that XC3S200A-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S200A-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200A-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S200A-4FT256I?
All XC3S200A-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200A-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200A-4FT256I part is unused and in its original packaging.
Return procedure for XC3S200A-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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