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AMD XC3S200A-4FTG256I
- Part No.:
- XC3S200A-4FTG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200A-4FTG256I.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:835
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Product details
Overview
XC3S200A-4FTG256I from AMD (formerly Xilinx) is a Spartan-3A FPGA featuring 200,000 system gates, 4,032 logic cells, 180 I/O pins, and embedded block RAM totaling 360 kbits. It operates at -4 speed grade with industrial temperature range (-40°C to +100°C) and uses a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package. It is used in industrial control logic and reconfigurable digital signal processing subsystems.
For engineers reviewing the XC3S200A-4FTG256I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, speed grade timing closure, industrial temperature rating, and FTBGA256 package compatibility with existing PCB layouts.
Technical Context
The XC3S200A-4FTG256I implements a fully reprogrammable SRAM-based architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated carry logic for arithmetic functions. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL, with programmable drive strength and slew rate control per I/O bank.
It integrates eight Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction. Configuration is performed via master serial mode using external PROM or JTAG boundary-scan interface, with support for multi-bitstream configuration and readback capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,032 - provides combinational and sequential logic capacity for medium-complexity control and datapath functions |
| System Gates | 200,000 - indicates overall logic capacity relative to standard cell ASIC implementation benchmarks |
| I/O Pins | 180 - supports high peripheral connectivity with banked voltage and standard flexibility |
| Block RAM | 360 kbits - enables on-chip data buffering, FIFOs, and small lookup tables without external memory |
| Speed Grade | -4 - guarantees maximum clock frequency of 400 MHz for internal logic and 333 MHz for I/O interfaces |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating or thermal management overhead |
| Package | FTBGA256 - 17×17 mm footprint with 1.0 mm ball pitch, compatible with standard SMT assembly processes |
Pinout & Package
XC3S200A-4FTG256I is housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) package with 17×17 array and 1.0 mm ball pitch. The package supports four I/O banks, each independently configurable for voltage and signaling standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies output driver voltage for Bank 0 (pins A1–D12); sets logic threshold and drive strength |
| VCCAUX | Auxiliary Supply | Provides 3.3 V to configuration circuitry, DCMs, and internal interconnect; must be decoupled |
| PROGRAM_B | Configuration Init | Active-low asynchronous reset that clears configuration memory and initiates reload from PROM or JTAG |
| DONE | Config Status | Open-drain output indicating successful configuration completion; pulled high externally to enable startup |
| TCK/TMS/TDI/TDO | JTAG Interface | IEEE 1149.1 boundary-scan signals enabling programming, debugging, and test access |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Eight independent DCMs provide jitter-reduced clock synthesis, phase alignment, and dynamic frequency scaling |
| SelectIO Technology | Per-bank I/O voltage and standard configuration supports mixed-voltage interfacing (1.2 V–3.3 V) |
| Embedded Block RAM | 360 kbits distributed across 40 block RAMs (each 18 kbits) for true dual-port operation and synchronous access |
| Multi-Boot Support | Allows up to four configuration bitstreams stored in external PROM; selected via mode pins at power-up |
| Configuration Readback | Enables verification of configuration integrity and partial reconfiguration monitoring via JTAG or SelectMAP |
Applications
| Industrial PLC Logic | Motor Control Interface |
|---|---|
Use Scenario: Real-time sequencing and safety interlock logic in programmable logic controller modules. IC Role / Device Role / Timing Role: Configurable state machine implementing deterministic scan-cycle execution with sub-microsecond response latency. Use Value: Eliminates need for discrete glue logic and enables field-upgradable control algorithms without hardware change. | Use Scenario: Closed-loop servo drive interface handling encoder feedback, PWM generation, and fault monitoring. IC Role / Device Role / Timing Role: Timing-critical I/O coordinator synchronizing 100 kHz PWM outputs with quadrature encoder inputs and analog current sensing. Use Value: Achieves <1 µs input-to-output propagation delay for overcurrent shutdown, meeting SIL-2 functional safety timing constraints. |
| Medical Imaging Data Path | Test Equipment Pattern Generator |
Use Scenario: Pixel data aggregation and preprocessing pipeline in ultrasound beamformer modules. IC Role / Device Role / Timing Role: High-throughput parallel-to-serial converter and FIR filter engine operating at 80 MSPS with pipelined latency. Use Value: Delivers 12-bit pixel throughput at 1.2 Gbps using embedded block RAM as line buffers, reducing external memory bandwidth demand by 65%. | Use Scenario: Programmable stimulus generator in automated test equipment for digital IC validation. IC Role / Device Role / Timing Role: Multi-channel pattern sequencer with precise edge placement (±50 ps jitter) and variable-width pulse generation. Use Value: Supports IEEE 1149.6 AC-JTAG compliance testing via programmable differential output drivers and on-chip timing calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400A-4FTG256I | Higher logic density (8,064 CLBs, 400K gates), same package and speed grade | Supports larger state machines and wider datapaths; requires additional power and thermal margin | Choose when design requires >4K logic cells but must retain identical PCB footprint and I/O mapping |
| XC6SLX16-2CSG324C | Spartan-6 architecture, 14,579 logic cells, 324-pin CSBG package, lower static power | Requires PCB redesign due to different pinout and voltage requirements (1.2 V core vs. 1.2 V/2.5 V dual supply) | Prefer for new designs needing higher performance, lower power, and integrated PCIe endpoint capability |
Compared with XC3S200A-4FTG256I, the XC3S400A-4FTG256I offers direct PCB-compatible scalability, while the XC6SLX16-2CSG324C delivers architectural improvements and power efficiency at the cost of layout revision and toolchain migration.
Availability
XC3S200A-4FTG256I is available at Aetrix Electronics and suitable for industrial automation, medical device subsystems, and test instrumentation requiring stable component supply across extended product lifecycles.
Supply support for XC3S200A-4FTG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3A product line was designed for reconfigurable logic in industrial control, communications infrastructure, and automotive body electronics where predictable timing, I/O flexibility, and long-term availability are critical.
FAQ
What is the maximum operating frequency supported by XC3S200A-4FTG256I?
The XC3S200A-4FTG256I is rated at speed grade -4, guaranteeing internal logic performance up to 400 MHz and I/O interface operation up to 333 MHz under industrial temperature conditions. Actual achievable frequency depends on design placement, routing, and clock domain constraints verified during static timing analysis in Xilinx ISE.
Does XC3S200A-4FTG256I support JTAG configuration?
Yes, XC3S200A-4FTG256I supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and testing. TCK, TMS, TDI, and TDO pins enable programming via iMPACT or ChipScope tools, and allow readback of configuration status and internal node visibility during validation.
What power supplies are required for XC3S200A-4FTG256I operation?
XC3S200A-4FTG256I requires three dedicated supplies: VCCINT (1.2 V core), VCCAUX (3.3 V auxiliary), and VCCO (1.2–3.3 V I/O bank voltage). Each supply must be independently decoupled; VCCAUX powers configuration logic and DCMs, while VCCO sets I/O voltage per bank.
Can XC3S200A-4FTG256I be reconfigured in-system?
Yes, XC3S200A-4FTG256I supports in-system reconfiguration via JTAG or SelectMAP interface. The PROGRAM_B pin allows asynchronous reload, and configuration readback enables verification. Partial reconfiguration is not natively supported - full bitstream reload is required for functional changes.
Is XC3S200A-4FTG256I qualified for industrial temperature operation?
Yes, the "I" suffix in XC3S200A-4FTG256I denotes industrial temperature qualification (-40°C to +100°C). This rating applies across all speed grades and package variants, and is verified per Xilinx specification DS312, with no derating required within this range.
XC3S200A-4FTG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 195
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200A-4FTG256I FAQ
1.How can I place an order for XC3S200A-4FTG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200A-4FTG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200A-4FTG256I reliable?
The price and inventory of XC3S200A-4FTG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200A-4FTG256I is usually 5 days.
3.What payment methods are accepted for XC3S200A-4FTG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200A-4FTG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200A-4FTG256I?
XC3S200A-4FTG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200A-4FTG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200A-4FTG256I?
For technical support, including XC3S200A-4FTG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200A-4FTG256I requirements.
6.How does Aetrix verify that XC3S200A-4FTG256I is sourced from the original manufacturer or authorized distributors?
All XC3S200A-4FTG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200A-4FTG256I meets industry standards.
7.What is the process for return or replacement of XC3S200A-4FTG256I?
All XC3S200A-4FTG256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200A-4FTG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200A-4FTG256I part is unused and in its original packaging.
Return procedure for XC3S200A-4FTG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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