AMD XC3S200A-4VQG100I
- Part No.:
- XC3S200A-4VQG100I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S200A-4VQG100I.pdf
- Description:
- IC FPGA 68 I/O 100VQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC3S200A-4VQG100I from AMD (formerly Xilinx) is a Spartan-3A FPGA with 200,000 system gates, 4,032 logic cells, and 100-pin VQFP package. It operates at -4 speed grade (5 ns CLB delay), supports 3.3 V/2.5 V I/O, and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC3S200A-4VQG100I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage support, speed grade timing closure, and QFP thermal performance in space-constrained industrial controllers.
Technical Context
The XC3S200A-4VQG100I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates up to 24 18×18-bit multipliers and 320 kbits of block RAM, supporting synchronous design flows with IEEE 1149.1 JTAG boundary-scan test access.
It features SelectIO technology enabling single-ended standards (LVTTL, LVCMOS) and differential standards (LVDS, RSDS) across its 63 user I/O pins. Configuration is performed via master serial mode using external PROM or active serial configuration controller.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,032 - determines maximum combinational/sequential logic capacity for state machines or protocol engines |
| System Gates | 200,000 - indicates relative logic density versus ASIC equivalents for cost-sensitive integration |
| I/O Pins | 63 user I/O - supports parallel bus interfacing or multi-channel sensor aggregation in compact layouts |
| Speed Grade | -4 (5 ns CLB TPD) - defines worst-case propagation delay through a CLB for timing-critical paths |
| Block RAM | 320 kbits - enables on-chip FIFOs, lookup tables, or small frame buffers without external memory |
| Multipliers | 24 × 18×18-bit - accelerates digital filtering, motor control math, or PWM modulation logic |
Pinout & Package
XC3S200A-4VQG100I uses a 100-pin Very Thin Quad Flat Pack (VQFP) with 0.5 mm pitch, 14×14 mm body, and exposed pad for thermal dissipation. Package conforms to JEDEC MO-220VGGD.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2 V core supply - must be filtered locally to meet FPGA internal rail noise spec |
| P2 | VCCAUX | 2.5 V auxiliary supply - powers JTAG, clock management, and configuration circuitry |
| A1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration when pulsed low |
| B2 | DONE | Open-drain status output - goes high when configuration completes successfully |
| E3 | TCK | JTAG test clock - synchronizes boundary-scan operations during debug or production test |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated Digital Clock Managers (DCMs) | Four DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication for synchronous subsystems |
| SelectIO Technology | Supports mixed-voltage I/O banks (3.3 V/2.5 V) with programmable drive strength and slew rate control per pin |
| Embedded Multipliers | 24 hard 18×18-bit signed multipliers enable real-time arithmetic without LUT resource overhead |
| IEEE 1149.1 Boundary Scan | Enables PCB-level interconnect testing and in-system programming without physical probe access |
Applications
| Industrial PLC I/O Module | Automotive Body Control Unit |
|---|---|
Use Scenario: Real-time scanning of 32 discrete inputs and driving 16 relay outputs in DIN-rail mounted controllers. IC Role / Device Role / Timing Role: FPGA acts as deterministic I/O concentrator and logic sequencer with sub-microsecond response latency. Use Value: Replaces multiple CPLDs and glue logic; reduces BOM count while maintaining deterministic scan cycle timing. | Use Scenario: Centralized door/window lock actuation, mirror position memory, and interior lighting dimming control. IC Role / Device Role / Timing Role: Configurable logic handles asynchronous switch debouncing, PWM dimming generation, and CAN message preprocessing. Use Value: Enables field-upgradable functionality via reconfiguration bitstream without hardware change. |
| Medical Patient Monitor Interface | Test Equipment Signal Generator |
Use Scenario: Aggregating analog front-end ADC streams, SPI sensor data, and display interface signals into unified data path. IC Role / Device Role / Timing Role: FPGA serves as protocol bridge between legacy 8-bit microcontroller and modern high-speed display controller. Use Value: Eliminates need for external level shifters and timing adapters; simplifies PCB routing with pin-flexible I/O banks. | Use Scenario: Generating precise arbitrary waveforms (sine, square, ramp) with variable amplitude, offset, and frequency sweep. IC Role / Device Role / Timing Role: FPGA implements DDS core with phase accumulator, sine lookup table, and DAC interface logic. Use Value: Achieves <1 ppm frequency resolution using on-chip block RAM and DCM-based clock scaling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S250E-4VQG100C | Higher logic density (5,760 LCs), enhanced DCM features, and extended temperature range (0–85°C vs. –40–100°C) | Targeted at commercial-grade systems requiring higher gate count but lacking industrial temp qualification | Choose if additional logic resources are needed and extended temperature operation is not required |
| XC6SLX16-2CSG225I | Based on Spartan-6 architecture; offers lower static power, improved DSP slices, and integrated PCIe endpoint block | Suitable for new designs needing PCI Express connectivity or longer product lifecycle support | Prefer for greenfield projects where migration to newer architecture provides long-term roadmap stability |
Compared with XC3S200A-4VQG100I, XC3S250E-4VQG100C delivers more logic capacity at same package but lacks industrial temperature rating, while XC6SLX16-2CSG225I introduces architectural upgrades including PCIe and lower power-making it appropriate for next-generation designs rather than drop-in replacement.
Availability
XC3S200A-4VQG100I is available at Aetrix Electronics and suitable for industrial automation, automotive electronics, and medical device manufacturing requiring stable component supply over extended production lifecycles.
Supply support for XC3S200A-4VQG100I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan-3A product lines for industrial and aerospace customers requiring long-term availability and proven reliability.
The Spartan-3A family was designed for cost-sensitive, high-volume embedded applications demanding predictable timing, low-power operation, and mature toolchain support with ISE Design Suite.
FAQ
What is the operating temperature range for XC3S200A-4VQG100I?
The XC3S200A-4VQG100I is rated for industrial temperature operation from –40°C to +100°C. This range ensures reliable functionality in harsh environments such as factory-floor controllers or under-hood automotive modules. The 'I' suffix in the part number explicitly denotes this industrial temperature grade, validated per Xilinx specification DS312.
Does XC3S200A-4VQG100I support JTAG boundary-scan testing?
Yes, XC3S200A-4VQG100I fully supports IEEE 1149.1 JTAG boundary-scan for PCB interconnect testing and in-system programming. Pins TCK, TMS, TDI, and TDO are dedicated to this function and operate independently of user I/O configuration, enabling production test and debug without requiring functional firmware load.
Can XC3S200A-4VQG100I be configured via SPI flash memory?
No, XC3S200A-4VQG100I does not support native SPI flash configuration. It requires master serial mode using XCFxx Platform Flash PROMs with dedicated configuration interface pins. Alternative methods include JTAG or microprocessor-initiated slave serial mode, but SPI is not electrically or logically supported per DS312 Section 5.
What is the maximum I/O voltage tolerance for XC3S200A-4VQG100I?
XC3S200A-4VQG100I supports 3.3 V and 2.5 V I/O standards per bank, with absolute maximum input voltage of VCCO + 0.5 V. Inputs are not 5 V tolerant; applying 5 V signals risks permanent damage unless external level-shifting circuitry is used, as confirmed in DS312 Table 13.
Is XC3S200A-4VQG100I pin-compatible with other Spartan-3A devices in VQG100 package?
XC3S200A-4VQG100I shares the same 100-pin VQFP footprint and pinout with other Spartan-3A devices in the VQG100 package, including XC3S400A and XC3S1000A. However, I/O bank voltage assignments and configuration pin behavior may differ-designers must verify bank-specific constraints before substitution.
XC3S200A-4VQG100I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 100-TQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 68
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S200A-4VQG100I FAQ
1.How can I place an order for XC3S200A-4VQG100I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200A-4VQG100I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200A-4VQG100I reliable?
The price and inventory of XC3S200A-4VQG100I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200A-4VQG100I is usually 5 days.
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Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200A-4VQG100I?
For technical support, including XC3S200A-4VQG100I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200A-4VQG100I requirements.
6.How does Aetrix verify that XC3S200A-4VQG100I is sourced from the original manufacturer or authorized distributors?
All XC3S200A-4VQG100I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200A-4VQG100I meets industry standards.
7.What is the process for return or replacement of XC3S200A-4VQG100I?
All XC3S200A-4VQG100I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200A-4VQG100I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200A-4VQG100I part is unused and in its original packaging.
Return procedure for XC3S200A-4VQG100I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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