AMD XC3S200A-5FGG320C

Overview

XC3S200A-5FGG320C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 200,000 system gates, 4,032 logic cells, and 216 I/O pins in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at 500 MHz maximum internal clock speed and supports SelectIO standards including LVCMOS, LVTTL, and SSTL, enabling use in industrial control logic and digital signal preprocessing.

For engineers reviewing the XC3S200A-5FGG320C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage flexibility, embedded block RAM capacity, and support for single-ended signaling interfaces in cost-sensitive embedded systems.

Technical Context

The XC3S200A-5FGG320C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and eighteen 18×18 multipliers. It includes four Digital Clock Managers (DCMs) for phase-matched clock synthesis and jitter reduction across multiple clock domains.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan, supporting IEEE 1149.1 compliance. The device uses 1.2 V core voltage and supports I/O banks operating at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V levels with programmable drive strength and slew rate control.

Key Specifications

Pinout & Package

XC3S200A-5FGG320C is housed in a 320-pin Fine-Pitch Ball Grid Array (FBGA) package with 21 mm × 21 mm body size and 0.8 mm ball pitch. The package supports reflow soldering per JEDEC J-STD-020 and provides thermal dissipation suitable for industrial ambient temperatures up to +85°C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S200A-5FGG320C, the XC3S400A-5FGG320C offers headroom for future feature expansion while maintaining identical footprint and thermal profile, whereas the XC3S1000-4FGG320C trades configurability and clock management capability for marginal cost reduction in static designs.

Availability

XC3S200A-5FGG320C is available at Aetrix Electronics and suitable for industrial motor control, digital video interface bridging, and automated test equipment requiring stable component supply and long-term production continuity.

Supply support for XC3S200A-5FGG320C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-optimized, high-volume embedded applications.

The Spartan-3A product line was designed specifically for high-performance, low-power logic implementation in industrial automation, communications infrastructure, and video processing systems where predictable timing and I/O flexibility are critical.

FAQ

What is the core voltage requirement for XC3S200A-5FGG320C?

The XC3S200A-5FGG320C requires a regulated 1.2 V ±3% core supply (VCCINT) delivered to dedicated power pins. This voltage powers the FPGA fabric and CLBs. Deviation beyond tolerance risks timing violations or configuration loss. Decoupling capacitors must be placed within 10 mm of each VCCINT pin per Xilinx UG331 guidelines. The XC3S200A-5FGG320C does not support adaptive voltage scaling.

Does XC3S200A-5FGG320C support JTAG configuration?

Yes, XC3S200A-5FGG320C supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. It uses TCK, TMS, TDI, and TDO pins for serial configuration bitstream loading and device identification. JTAG mode is enabled by pulling PROGRAM_B high and setting M0–M2 strap pins to 000. The XC3S200A-5FGG320C also supports concurrent JTAG and SelectMAP access for in-system reconfiguration.

How many Digital Clock Managers (DCMs) does XC3S200A-5FGG320C include?

The XC3S200A-5FGG320C integrates four fully independent Digital Clock Managers (DCMs). Each DCM provides input clock multiplication, division, phase shifting, and duty-cycle correction. They operate over 24–248 MHz input frequency range and support cascaded configurations. All four DCMs are accessible simultaneously in the XC3S200A-5FGG320C design, enabling multi-domain clocking without external PLLs.

What I/O standards are supported by XC3S200A-5FGG320C?

XC3S200A-5FGG320C supports LVCMOS, LVTTL, PCI, HSTL, SSTL, and differential standards including LVDS and RSDS across its 216 I/O pins. Each I/O bank is independently configurable for voltage (1.2–3.3 V), drive strength (2–24 mA), and slew rate. The XC3S200A-5FGG320C does not support DDR3 or MIPI D-PHY standards.

Is XC3S200A-5FGG320C RoHS compliant?

Yes, XC3S200A-5FGG320C is RoHS-6 compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FBGA package uses matte tin finish on solder balls and halogen-free molding compound. Full compliance documentation, including material declarations and test reports, is available under AMD's Product Change Notification (PCN) #XIL-2018-003 for this specific speed grade and package variant.