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AMD XC3S200A-5FTG256C
- Part No.:
- XC3S200A-5FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200A-5FTG256C.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,035
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Product details
Overview
XC3S200A-5FTG256C from AMD (formerly Xilinx) is a Spartan-3A FPGA with 200,000 system gates, 4,832 logic cells, and 216 I/O pins in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) package. It operates at 500 MHz system clock speed and supports LVCMOS25/LVCMOS33 I/O standards for industrial control and embedded vision interface applications.
For engineers reviewing the XC3S200A-5FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include logic cell count, I/O voltage compatibility, configuration mode support (Master Serial, Slave Serial, JTAG), and thermal performance in compact PCB layouts.
Technical Context
The XC3S200A-5FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (176 kbits), and digital clock managers (DCMs) supporting phase shifting and frequency synthesis. It uses 90 nm CMOS process technology and supports multi-voltage I/O banks (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V).
Configuration is performed via external SPI PROM or JTAG boundary-scan interface. The device includes dedicated carry logic for high-speed arithmetic and supports SelectIO™ technology for impedance-controlled signaling and SSTL/HSTL compatibility on selected pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,832 - determines maximum combinational/sequential logic capacity for custom digital functions |
| System Gates | 200,000 - indicates relative ASIC-equivalent gate count for architectural sizing |
| I/O Pins | 216 - usable user-defined bidirectional signal interfaces with bank-wise voltage assignment |
| Block RAM | 176 kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| DCM Units | 4 - enables clock multiplication, division, phase alignment, and jitter reduction in timing-critical paths |
| Max I/O Speed | 622 Mbps (LVDS) - supports high-speed serial links and video data capture interfaces |
| Supply Voltage (Core) | 1.2 V ±3% - requires tight-regulation DC-DC converter for stable operation and low power dissipation |
Pinout & Package
XC3S200A-5FTG256C is housed in a 256-pin Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch, 17 × 17 array, and 1.2 mm height. Thermal pad on underside improves heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Power Supply | 1.2 V supply for internal logic; must be filtered and decoupled per Xilinx UG380 guidelines |
| VCCAUX | Auxiliary Power Supply | 2.5 V supply for configuration circuitry, DCMs, and JTAG interface |
| VCCO_0–VCCO_5 | I/O Bank Power | Independent voltage rails per I/O bank (1.2–3.3 V); enables mixed-voltage interfacing |
| PROGRAM_B | Configuration Initiation | Active-low input that resets configuration logic and clears SRAM contents |
| DONE | Configuration Status | Open-drain output indicating successful bitstream loading and device readiness |
| TCK/TMS/TDI/TDO | JTAG Interface | IEEE 1149.1-compliant test and programming interface for boundary scan and in-system programming |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling (LVDS, RSDS) with programmable drive strength and slew rate |
| Digital Clock Manager (DCM) | Four fully independent DCMs provide jitter-free clock synthesis, phase shifting, and duty-cycle correction without external PLL components |
| Configurable Logic Blocks (CLBs) | Each CLB contains two slices with four LUTs and eight flip-flops, enabling efficient implementation of state machines and arithmetic pipelines |
| Embedded Block RAM | 44 × 4-kbit dual-port RAM blocks allow simultaneous read/write access for buffering and data coalescing in real-time processing |
| Multi-Standard Configuration | Supports Master Serial (SPI PROM), Slave Serial, Boundary Scan (JTAG), and Microprocessor (MPU) modes for flexible system integration and field updates |
Applications
| Industrial PLC I/O Module | Video Frame Grabber Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion with deterministic response in factory automation controllers. IC Role / Device Role / Timing Role: FPGA fabric implements custom logic for parallel-to-serial conversion, watchdog timers, and isolated bus arbitration. Use Value: 216 I/O pins enable direct connection to 32-channel digital input/output modules; DCMs synchronize sampling to 1 ms PLC scan cycles. | Use Scenario: Capturing uncompressed 720p60 video streams from CMOS image sensors over parallel LVCMOS33 buses. IC Role / Device Role / Timing Role: Configurable logic processes pixel clock domain crossing, line buffering, and frame header insertion before PCIe transfer. Use Value: 622 Mbps LVDS capability supports sensor sync signals; 176 kbits block RAM stores one full video line for de-skew correction. |
| Medical Imaging Control Board | Test Equipment Pattern Generator |
Use Scenario: Coordinating timing-critical sequences between ultrasound transducer arrays and ADC sampling clocks. IC Role / Device Role / Timing Role: FPGA generates precisely timed pulse sequences and manages time-of-flight calculations using on-chip DSP slices. Use Value: Four DCM units align 40 MHz transducer excitation, 80 MHz ADC sampling, and 100 MHz data packing clocks within ±50 ps skew. | Use Scenario: Generating high-fidelity digital stimulus patterns for IC functional testing at up to 100 MHz. IC Role / Device Role / Timing Role: Implements pattern memory, sequence controller, and output formatter with precise edge placement. Use Value: 4,832 logic cells support 16-bit wide × 4k-deep pattern memory; LVCMOS25 outputs drive 50 Ω loads with <1 ns rise/fall times. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400A-5FTG256C | Higher logic density (7,168 CLBs), same package and pinout; 1.2 V core, identical I/O structure | Supports larger state machines and wider datapaths; suitable when XC3S200A-5FTG256C resource utilization exceeds 85% | Select if design requires >4,832 logic cells but must retain identical PCB layout and thermal profile |
| XC6SLX16-2CSG324C | Spartan-6 generation; 14,579 logic cells, 324-pin CSBG324 package, 1.2 V core, enhanced DSP slices and PCIe hard IP | Enables higher throughput and integrated protocol acceleration; not pin-compatible; requires board redesign | Choose for new designs needing PCIe endpoint capability or >2× logic capacity, accepting layout change |
Compared with XC3S200A-5FTG256C, XC3S400A-5FTG256C offers drop-in logic scalability while maintaining thermal and footprint constraints, whereas XC6SLX16-2CSG324C delivers architectural upgrades-including hardened PCIe and improved power efficiency-at the cost of mechanical and routing rework.
Availability
XC3S200A-5FTG256C is available at Aetrix Electronics and suitable for industrial control systems, medical imaging subsystems, and automated test equipment requiring stable component supply across extended production lifecycles.
Supply support for XC3S200A-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio for data center, AI, and embedded markets.
The Spartan-3A family was designed by Xilinx (now AMD) for cost-sensitive, high-volume applications requiring reliable programmable logic with balanced performance, I/O flexibility, and low-power operation.
FAQ
What configuration modes does the XC3S200A-5FTG256C support?
The XC3S200A-5FTG256C supports Master Serial (via external SPI PROM), Slave Serial (host-controlled), JTAG boundary-scan, and Microprocessor (MPU) configuration modes. Each mode uses distinct pin assignments and initialization sequences defined in Xilinx UG380. XC3S200A-5FTG256C configuration is initiated by asserting PROGRAM_B, followed by loading the bitstream into on-chip SRAM.
Does the XC3S200A-5FTG256C include built-in analog functionality such as ADC or DAC?
No, the XC3S200A-5FTG256C is a digital-only FPGA with no integrated analog-to-digital or digital-to-analog converters. All analog signal acquisition or generation must be handled externally using discrete ADC/DAC ICs interfaced via its 216 I/O pins. XC3S200A-5FTG256C relies on external components for analog front-end functions.
What is the maximum operating junction temperature for the XC3S200A-5FTG256C?
The XC3S200A-5FTG256C has a maximum operating junction temperature of +85 °C, as specified in the Xilinx DS312 datasheet. This rating applies under continuous operation with proper PCB thermal vias and copper pour. XC3S200A-5FTG256C thermal performance must be validated using Xilinx XPE tool for actual power consumption and ambient conditions.
Can the XC3S200A-5FTG256C operate with a 3.3 V I/O supply while maintaining 1.2 V core voltage?
Yes, XC3S200A-5FTG256C supports mixed I/O voltage operation: VCCO banks can be independently set to 3.3 V (LVCMOS33), while VCCINT remains at 1.2 V. This allows direct interfacing with legacy 3.3 V peripherals without level shifters. XC3S200A-5FTG256C I/O banks are electrically isolated, enabling concurrent use of multiple voltage standards.
Is the XC3S200A-5FTG256C RoHS compliant and lead-free?
Yes, the XC3S200A-5FTG256C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU and JEDEC J-STD-609A Class 3 marking requirements. The FTBGA package uses matte tin finish on solder balls. XC3S200A-5FTG256C conforms to AMD's environmental compliance program and is suitable for green manufacturing processes.
XC3S200A-5FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3A
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 195
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200A-5FTG256C FAQ
1.How can I place an order for XC3S200A-5FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200A-5FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200A-5FTG256C reliable?
The price and inventory of XC3S200A-5FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200A-5FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S200A-5FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200A-5FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200A-5FTG256C?
XC3S200A-5FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200A-5FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200A-5FTG256C?
For technical support, including XC3S200A-5FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200A-5FTG256C requirements.
6.How does Aetrix verify that XC3S200A-5FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S200A-5FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200A-5FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S200A-5FTG256C?
All XC3S200A-5FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200A-5FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200A-5FTG256C part is unused and in its original packaging.
Return procedure for XC3S200A-5FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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