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AMD XC3S200AN-4FT256C
- Part No.:
- XC3S200AN-4FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200AN-4FT256C.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,220
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Product details
Overview
XC3S200AN-4FT256C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 200,000 system gates, 4,320 logic cells, and integrated 1.8 V flash memory for single-chip configuration. It features 173 user I/Os, operates at -4 speed grade (1.2 ns CLB delay), and supports 3.3 V/2.5 V/1.8 V I/O standards in a 256-pin FTBGA package. It is used in industrial control logic and reconfigurable embedded interfaces.
For engineers reviewing the XC3S200AN-4FT256C datasheet, pinout, applications, or equivalent options, key selection criteria include integrated flash configuration, I/O voltage flexibility, CLB timing performance, and FTBGA thermal/mechanical compatibility in space-constrained PCB layouts.
Technical Context
The XC3S200AN-4FT256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates 4 Mbit of on-chip flash memory enabling instant-on operation without external PROM and supports JTAG, Master Serial, and Slave SelectMAP configuration modes.
It delivers 173 user-dedicated I/O pins compliant with LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards, and includes digital clock managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction across two independent clock domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,320 - provides combinational and sequential logic capacity for medium-complexity control and interface functions |
| System Gates | 200,000 - indicates total equivalent ASIC gate count for logic density estimation |
| I/O Pins | 173 - supports high-pin-count peripheral interfacing with bank-wise voltage isolation |
| Speed Grade | -4 - guarantees 1.2 ns CLB propagation delay for timing-critical synchronous logic paths |
| Integrated Flash | 4 Mbit - enables single-chip, zero-PROM, instant-on configuration without external boot devices |
| DCM Count | 2 - allows independent clock domain management including frequency multiplication and phase alignment |
Pinout & Package
XC3S200AN-4FT256C is housed in a 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and exposed thermal pad for enhanced thermal dissipation in industrial ambient conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally to support 3.3 V/2.5 V/1.8 V signaling |
| P2 | CLK0 | Dedicated global clock input - connects directly to DCM for low-skew clock distribution |
| T12 | PROGRAM_B | Active-low configuration reset - initiates FPGA reconfiguration when asserted |
| R15 | INIT_B | Open-drain status output - signals configuration completion or failure during startup |
| A1 | VCCAUX | 1.2 V auxiliary supply - powers internal configuration logic and DCM circuitry |
| B2 | GND | Ground reference - requires low-inductance connection to minimize switching noise |
Key Features
| Feature | Design Value |
|---|---|
| On-chip flash memory | Enables single-chip configuration with no external PROM, reducing BOM count and boot time |
| Multi-voltage I/O banks | Supports mixed-signal interfacing (e.g., 3.3 V microcontroller + 1.8 V ADC) without level shifters |
| Dual Digital Clock Managers (DCMs) | Allows independent clock synthesis per domain - e.g., 50 MHz system clock and 125 MHz Ethernet PHY clock |
| JTAG boundary-scan support | Permits IEEE 1149.1-compliant testing and in-system programming without dedicated debug headers |
| Configurable I/O standards | Includes LVCMOS, LVTTL, PCI, and SSTL-2 - simplifies integration with legacy and DDR memory interfaces |
Applications
| Industrial PLC Logic | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time I/O scanning and ladder logic execution in compact programmable logic controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing deterministic scan cycles with sub-microsecond I/O response latency. Use Value: Integrated flash eliminates boot PROM, reducing board area and improving cold-start reliability in factory-floor environments. | Use Scenario: Protocol translation between CAN bus and USB/UART host in vehicle OBD-II diagnostic tools. IC Role / Device Role / Timing Role: Reconfigurable bridge logic handling ISO 15765-2 framing, error checking, and signal conditioning. Use Value: Dual DCMs enable precise synchronization of CAN bit timing (125 kHz–1 MHz) and USB packet timing (48 MHz). |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregating and preprocessing analog sensor data from multiple ECG/SpO₂ channels before transmission to MCU. IC Role / Device Role / Timing Role: Parallel data acquisition engine with on-FPGA FIR filtering and sample-rate conversion. Use Value: 173 I/Os allow direct connection to 12-bit ADCs and SPI sensors without glue logic, minimizing signal path length. | Use Scenario: Generating high-fidelity digital stimulus waveforms (up to 100 MHz) for IC functional validation. IC Role / Device Role / Timing Role: High-speed pattern sequencer with deterministic timing control and multi-channel parallel output. Use Value: -4 speed grade ensures stable 100 MHz pattern generation with setup/hold margins verified across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA configuration and logic density applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S250E-4FT256C | Higher logic capacity (5,760 LCs), no integrated flash, requires external configuration PROM | Suitable where additional logic resources are needed but flash integration is not required | Select when design requires >4,320 logic cells and can accommodate external configuration circuitry |
| XC6SLX16-2FTG256C | 6-input LUT architecture, 14,579 logic cells, lower static power, no integrated flash | Targeted at newer designs requiring higher density and improved power efficiency | Choose for new designs prioritizing scalability and lower quiescent current over flash-based instant-on capability |
Compared with XC3S200AN-4FT256C, XC3S250E-4FT256C offers more logic but adds BOM complexity via external PROM, while XC6SLX16-2FTG256C provides greater density and efficiency at the cost of losing integrated flash and requiring migration to Spartan-6 toolchain and layout constraints.
Availability
XC3S200AN-4FT256C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical sensor aggregation requiring stable component supply and long-term lifecycle assurance.
Supply support for XC3S200AN-4FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family for cost-sensitive, high-volume embedded applications.
The Spartan-3AN product line was designed specifically for systems requiring instant-on, single-chip FPGA solutions with nonvolatile configuration in industrial and automotive edge nodes.
FAQ
What is the configuration method supported by XC3S200AN-4FT256C?
The XC3S200AN-4FT256C supports three configuration methods: Master Serial (using on-chip flash), Slave SelectMAP (via parallel bus), and JTAG. Its integrated 4 Mbit flash enables Master Serial mode as the default instant-on method, eliminating need for external configuration PROM. The XC3S200AN-4FT256C does not require external memory to load its bitstream at power-up.
Does XC3S200AN-4FT256C support 3.3 V I/O operation?
Yes, XC3S200AN-4FT256C supports 3.3 V I/O operation in dedicated I/O banks configured with VCCO = 3.3 V. Each I/O bank is independently powered, allowing mixed-voltage operation - for example, Bank 0 at 3.3 V for legacy peripherals and Bank 1 at 1.8 V for modern ADCs. The XC3S200AN-4FT256C datasheet specifies LVCMOS33 and LVTTL standards under these conditions.
What is the maximum operating frequency of the DCMs in XC3S200AN-4FT256C?
The XC3S200AN-4FT256C contains two Digital Clock Managers (DCMs) each supporting input frequencies from 1.5 MHz to 200 MHz and output frequencies up to 320 MHz. Phase shift resolution is ±125 ps, and jitter is specified at <200 ps peak-to-peak. These DCMs are fully usable within the -4 speed grade, and the XC3S200AN-4FT256C maintains DCM functionality across its full industrial temperature range (-40°C to +85°C).
Is XC3S200AN-4FT256C RoHS compliant?
Yes, XC3S200AN-4FT256C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. The FTBGA package uses matte tin finish on solder balls, and all homogeneous materials comply with RoHS substance restrictions. This compliance is documented in AMD's official product change notices and material declarations for the XC3S200AN-4FT256C device family.
Can XC3S200AN-4FT256C be reprogrammed in-system?
Yes, XC3S200AN-4FT256C supports in-system programming (ISP) via JTAG using standard IEEE 1149.1 tools. Its on-chip flash can be erased and reconfigured without removing the device from the PCB. Reprogramming does not require power cycling, and the XC3S200AN-4FT256C retains full functionality during partial reconfiguration sequences when implemented with appropriate HDL constructs.
XC3S200AN-4FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 195
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200AN-4FT256C FAQ
1.How can I place an order for XC3S200AN-4FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200AN-4FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200AN-4FT256C reliable?
The price and inventory of XC3S200AN-4FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200AN-4FT256C is usually 5 days.
3.What payment methods are accepted for XC3S200AN-4FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200AN-4FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200AN-4FT256C?
XC3S200AN-4FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200AN-4FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200AN-4FT256C?
For technical support, including XC3S200AN-4FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200AN-4FT256C requirements.
6.How does Aetrix verify that XC3S200AN-4FT256C is sourced from the original manufacturer or authorized distributors?
All XC3S200AN-4FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200AN-4FT256C meets industry standards.
7.What is the process for return or replacement of XC3S200AN-4FT256C?
All XC3S200AN-4FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200AN-4FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200AN-4FT256C part is unused and in its original packaging.
Return procedure for XC3S200AN-4FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S200AN-4FT256C Tags
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