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AMD XC3S200AN-4FT256I
- Part No.:
- XC3S200AN-4FT256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200AN-4FT256I.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,864
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Product details
Overview
XC3S200AN-4FT256I from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 200,000 system gates, 4,032 logic cells, and embedded Flash memory enabling single-chip configuration. It features 173 user I/Os, operates at -4 speed grade (1.14 ns CLB delay), and supports industrial temperature range (-40°C to +100°C). Used in reconfigurable logic control for industrial automation interfaces.
For engineers reviewing the XC3S200AN-4FT256I datasheet, pinout, applications, or equivalent options, key selection criteria include embedded Flash retention, I/O voltage flexibility (3.3V/2.5V/1.8V), industrial temp rating, and JTAG configuration support.
Technical Context
The XC3S200AN-4FT256I integrates on-chip Flash for instant-on operation and eliminates external configuration PROMs. Its architecture includes SelectIO™ technology supporting multiple I/O standards including LVCMOS, LVTTL, and PCI.
It implements dedicated digital clock managers (DCMs) for clock synthesis, phase shifting, and frequency multiplication, with up to two DCMs per device. Configuration occurs via JTAG, Master Serial, or Slave Parallel modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,032 - provides combinational and sequential logic capacity for medium-complexity control and interface functions |
| System Gates | 200,000 - indicates total equivalent ASIC gate count for logic density estimation |
| User I/O Pins | 173 - supports high-pin-count peripheral interfacing with banked voltage assignment |
| Speed Grade | -4 - guarantees maximum 1.14 ns CLB propagation delay under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| Embedded Flash | Integrated 2 Mbit - enables single-chip, secure, non-volatile configuration storage |
Pinout & Package
XC3S200AN-4FT256I is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch and 17 mm × 17 mm body size. Pin assignments follow Xilinx Spartan-3AN family standard layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O Bank Power | Supplies output driver voltage for Bank 0; configurable per bank for mixed-voltage I/O |
| VCCAUX | Auxiliary Core Power | Provides 2.5 V to internal configuration and clock circuitry |
| GND | Ground Reference | Common return path for all power domains; requires dedicated ground balls per bank |
| TCK/TMS/TDI/TDO | JTAG Interface | Enables boundary-scan testing, programming, and debug access without external hardware |
| PROGRAM_B | Configuration Reset | Active-low signal that initiates FPGA reconfiguration and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| On-chip Flash memory | Eliminates external configuration PROM, reduces BOM count, and enables secure bitstream storage |
| SelectIO™ technology | Supports 19 I/O standards across banks, allowing direct interfacing with legacy and modern peripherals |
| Digital Clock Managers (DCMs) | Two integrated DCMs provide jitter reduction, duty-cycle correction, and frequency synthesis without external PLL ICs |
| MultiBoot capability | Allows up to four independent bitstreams stored in Flash for field-upgradable firmware and fail-safe recovery |
Applications
| Industrial PLC I/O Module | Motor Drive Control Logic |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol bridging in programmable logic controllers. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom state machines and serial interface engines (e.g., RS-485, CAN physical layer glue logic). Use Value: Embedded Flash enables deterministic boot time and eliminates configuration delays during cold start or power cycle. | Use Scenario: Closed-loop timing-critical control of three-phase inverters using encoder feedback and PWM generation. IC Role / Device Role / Timing Role: Timing engine generating synchronized, dead-time-adjusted PWM signals while monitoring fault inputs with sub-microsecond response. Use Value: Dual DCMs deliver precise, jitter-controlled clocks for PWM carrier and ADC sampling synchronization. |
| Medical Imaging Data Interface | Avionics Sensor Signal Conditioning |
Use Scenario: High-speed parallel data capture from CMOS image sensors and formatting into LVDS streams for FPGA-to-FPGA transfer. IC Role / Device Role / Timing Role: Synchronous data acquisition block with source-synchronous capture and elastic buffer management. Use Value: 173 user I/Os support wide parallel bus widths and multi-bank voltage assignment for mixed-signal sensor interface compatibility. | Use Scenario: ARINC 429 receiver/transmitter logic and discrete input debouncing in flight control subsystems. IC Role / Device Role / Timing Role: Protocol-specific logic implementing bit-level encoding/decoding, parity checking, and timing-critical pulse width validation. Use Value: Industrial temperature rating and Flash-based configuration ensure reliability in uncontrolled avionics bay thermal environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S250E-4FT256C | No embedded Flash; requires external SPI PROM; lower static power; commercial temp only (0°C to +85°C) | Suitable for cost-sensitive, non-security-critical consumer or lab prototypes | Choose when Flash integration is unnecessary and ambient temperature stays within commercial range |
| XC6SLX25-2FTG256I | Higher logic density (15,822 LUTs); Spartan-6 architecture; no on-chip Flash; supports DDR2 memory interface | Better suited for video processing pipelines or Ethernet MAC offload where bandwidth exceeds Spartan-3AN capability | Choose when migrating to newer architecture with higher performance and memory interface needs |
Compared with XC3S200AN-4FT256I, the XC3S250E-4FT256C lacks Flash and industrial temp rating but offers lower static power, while the XC6SLX25-2FTG256I delivers greater logic capacity and DDR2 support at the cost of increased complexity and external configuration dependency.
Availability
XC3S200AN-4FT256I is available at Aetrix Electronics and suitable for industrial automation, motor drive control, and medical imaging equipment requiring stable component supply and long-term lifecycle assurance.
Supply support for XC3S200AN-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-3AN family was designed by Xilinx specifically for cost-sensitive, high-volume industrial and automotive applications requiring instant-on, secure, single-chip configuration without external memory.
FAQ
What is the configuration method supported by XC3S200AN-4FT256I?
The XC3S200AN-4FT256I supports JTAG, Master Serial (via on-chip Flash), and Slave Parallel configuration modes. Its integrated Flash enables Master Serial mode without external PROM, delivering instant-on behavior after power-up. JTAG remains active for debugging and reprogramming regardless of configuration source.
Does XC3S200AN-4FT256I require external configuration memory?
No, XC3S200AN-4FT256I does not require external configuration memory due to its 2 Mbit on-chip Flash. This Flash stores the configuration bitstream permanently and powers up the device autonomously. External PROMs or Flash devices are optional only for MultiBoot or field update scenarios.
What I/O standards are supported by XC3S200AN-4FT256I?
XC3S200AN-4FT256I supports 19 I/O standards via SelectIO™ technology, including LVCMOS 3.3/2.5/1.8 V, LVTTL, PCI, and SSTL. Each of its eight I/O banks can be independently powered, enabling mixed-voltage operation across a single device for interfacing with diverse peripherals.
Is XC3S200AN-4FT256I qualified for industrial temperature operation?
Yes, XC3S200AN-4FT256I is rated for -40°C to +100°C operation and is fully qualified for industrial temperature environments. This rating applies to all logic, I/O, and configuration circuitry, with timing specifications guaranteed across the full range without derating.
How many Digital Clock Managers (DCMs) does XC3S200AN-4FT256I include?
XC3S200AN-4FT256I includes two Digital Clock Managers (DCMs). Each DCM provides clock doubling, frequency synthesis, phase shifting, duty-cycle correction, and jitter reduction. These are used to generate precise, low-jitter clocks for high-speed I/O and logic timing without external PLL components.
XC3S200AN-4FT256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 195
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200AN-4FT256I FAQ
1.How can I place an order for XC3S200AN-4FT256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200AN-4FT256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200AN-4FT256I reliable?
The price and inventory of XC3S200AN-4FT256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200AN-4FT256I is usually 5 days.
3.What payment methods are accepted for XC3S200AN-4FT256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200AN-4FT256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200AN-4FT256I?
XC3S200AN-4FT256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200AN-4FT256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200AN-4FT256I?
For technical support, including XC3S200AN-4FT256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200AN-4FT256I requirements.
6.How does Aetrix verify that XC3S200AN-4FT256I is sourced from the original manufacturer or authorized distributors?
All XC3S200AN-4FT256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200AN-4FT256I meets industry standards.
7.What is the process for return or replacement of XC3S200AN-4FT256I?
All XC3S200AN-4FT256I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200AN-4FT256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200AN-4FT256I part is unused and in its original packaging.
Return procedure for XC3S200AN-4FT256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S200AN-4FT256I Tags
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