AMD XC3S200AN-4FTG256C

Overview

XC3S200AN-4FTG256C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 200,000 system gates, 4,320 logic cells, 216 Kbits of embedded block RAM, and integrated configuration flash memory. It operates at -4 speed grade (1.11 ns CLB delay), uses 1.2 V core voltage, and is packaged in a 256-pin Fine-Pitch Thin Quad Flatpack (FTBGA) with 172 user I/Os. It is used in industrial control logic and reconfigurable digital signal processing subsystems.

For engineers reviewing the XC3S200AN-4FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include embedded flash configuration, I/O count, logic cell density, speed grade timing compliance, and industrial temperature range support.

Technical Context

The XC3S200AN-4FTG256C integrates non-volatile flash memory for single-chip configuration, eliminating external PROMs. Its architecture includes configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic for arithmetic functions.

It supports SelectIO standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL across its 172 user I/O pins. Configuration occurs via JTAG or master serial mode using on-chip flash, enabling instant-on operation after power-up.

Key Specifications

Pinout & Package

Package: 256-pin Fine-Pitch Thin Ball Grid Array (FTBGA), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S200AN-4FTG256C, the XC3S400AN-4FTG256C offers scalable logic capacity within identical mechanical and thermal constraints, while the XC6SLX16-2CSG324C delivers architectural improvements at the cost of layout compatibility.

Availability

XC3S200AN-4FTG256C is available at Aetrix Electronics and suitable for industrial PLCs, motor control drives, communications bridges, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC3S200AN-4FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.

The Spartan-3AN product line was designed for cost-sensitive, high-volume industrial and automotive applications requiring instant-on configuration, integrated non-volatile memory, and robust I/O flexibility.

FAQ

What is the configuration method supported by the XC3S200AN-4FTG256C?

The XC3S200AN-4FTG256C supports multiple configuration methods: master serial mode using its internal flash memory, JTAG boundary-scan programming, and slave selectMAP mode. Its integrated flash enables standalone operation without external configuration PROMs, making it ideal for applications requiring instant-on functionality after power-up. The XC3S200AN-4FTG256C does not require an external boot device for basic operation.

Does the XC3S200AN-4FTG256C support hot-swap I/O capability?

The XC3S200AN-4FTG256C supports hot-swap compliant I/O banks when configured with appropriate external circuitry, including bus-hold resistors and power sequencing controls. Its I/O pins tolerate 3.3 V inputs while powered at 1.2 V core, and VCCAUX must be stable before VCCINT during power-up. This behavior is documented in Xilinx UG332 for Spartan-3AN devices, and applies directly to the XC3S200AN-4FTG256C.

What is the maximum operating frequency of the XC3S200AN-4FTG256C?

The XC3S200AN-4FTG256C has a -4 speed grade specifying a 1.11 ns CLB propagation delay under worst-case industrial conditions. While maximum system clock frequency depends on design topology, synthesis tools report typical achievable frequencies up to 250 MHz for well-constrained register-to-register paths. This timing performance is guaranteed for the XC3S200AN-4FTG256C across its full operating temperature range.

Is the XC3S200AN-4FTG256C RoHS compliant?

Yes, the XC3S200AN-4FTG256C is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. Its FTBGA package uses matte tin finish on solder balls and complies with JEDEC J-STD-020 moisture sensitivity level 3 (MSL3). This compliance is verified and documented in the official Xilinx packaging specification for the XC3S200AN-4FTG256C.

Can the XC3S200AN-4FTG256C be reprogrammed in-system?

Yes, the XC3S200AN-4FTG256C supports in-system programming (ISP) via JTAG or master serial mode. Its on-chip flash memory can be erased and reprogrammed multiple times - rated for at least 20,000 write/erase cycles - enabling field firmware updates without removing the device. This capability is intrinsic to the XC3S200AN-4FTG256C and does not require external hardware beyond standard JTAG cabling or serial configuration interface.