AMD XC3S200AN-5FT256C

Overview

XC3S200AN-5FT256C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 200,000 system gates, 4,320 logic cells, and integrated 4-Mbit Flash memory for single-chip configuration. It operates at 500 MHz system clock speed and supports 256-pin FTBGA packaging, used in industrial control logic and reconfigurable I/O interface design.

For engineers reviewing the XC3S200AN-5FT256C datasheet, pinout, applications, or equivalent options, key selection factors include embedded Flash retention, I/O voltage flexibility (1.2 V to 3.3 V), and JTAG boundary-scan compliance for production testability.

Technical Context

The XC3S200AN-5FT256C integrates non-volatile Flash configuration memory with SRAM-based FPGA fabric, eliminating external boot PROMs. Its architecture includes 18 × 18 multipliers, up to 232 user I/Os, and SelectIO™ technology supporting LVCMOS, LVTTL, PCI, and SSTL standards.

It features full IEEE 1149.1 JTAG boundary-scan support, internal oscillator for configuration clocking, and programmable slew-rate and drive-strength control per I/O bank. Configuration occurs automatically on power-up without external controller intervention.

Key Specifications

Pinout & Package

XC3S200AN-5FT256C uses a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 17 × 17 array, 1.0 mm ball pitch, and exposed thermal pad. Pin functions are organized into eight I/O banks, each independently configurable for voltage standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA configuration and logic implementation applications.

Compared with XC3S200AN-5FT256C, the XC3S250AN-5FT256C offers 25% more logic cells for incremental feature expansion, while the XC3S400AN-5FT256C adds dedicated DSP slices-both retain identical Flash configuration, JTAG interface, and thermal characteristics for drop-in evaluation.

Availability

XC3S200AN-5FT256C is available at Aetrix Electronics and suitable for industrial automation, automotive diagnostics, and medical device manufacturing requiring stable component supply and long-term obsolescence management.

Supply support for XC3S200AN-5FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, embedded, and edge applications.

The Spartan-3AN family was originally designed by Xilinx for cost-sensitive, high-volume applications needing instant-on capability, embedded configuration storage, and robust industrial temperature operation.

FAQ

What is the operating temperature range for XC3S200AN-5FT256C?

The XC3S200AN-5FT256C is rated for commercial temperature operation (0 °C to +85 °C ambient). It does not support extended or industrial temperature grades. This range is validated for use in enclosed control panels and non-extreme environmental deployments where airflow and thermal management meet Xilinx specification guidelines for the FTBGA package.

Does XC3S200AN-5FT256C require an external configuration PROM?

No, XC3S200AN-5FT256C does not require an external configuration PROM. Its integrated 4-Mbit Flash memory stores the bitstream and enables automatic configuration on power-up. The device supports JTAG, Master Serial, and Slave SelectMAP modes, but internal Flash eliminates need for external memory in most standalone applications.

Can XC3S200AN-5FT256C be reprogrammed in-system?

Yes, XC3S200AN-5FT256C supports in-system programming via JTAG or Slave SelectMAP interface. The embedded Flash can be erased and reprogrammed multiple times-Xilinx specifies minimum 20,000 program/erase cycles. Reprogramming does not require removal from the PCB or special voltage conditions beyond standard VCCINT and VCCAUX rails.

What I/O standards are supported by XC3S200AN-5FT256C?

XC3S200AN-5FT256C supports LVCMOS, LVTTL, PCI, SSTL18, SSTL2, HSTL, and GTL through its SelectIO™ technology. Each of the eight I/O banks can be independently configured for voltage levels from 1.2 V to 3.3 V, enabling mixed-standard interfaces without external level shifters.

Is XC3S200AN-5FT256C compatible with Xilinx ISE Design Suite?

Yes, XC3S200AN-5FT256C is fully supported by Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, bitstream generation, and JTAG programming. It is not supported in Vivado, as the Spartan-3AN family predates Vivado's architecture scope and toolchain requirements.