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AMD XC3S200AN-5FTG256C
- Part No.:
- XC3S200AN-5FTG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S200AN-5FTG256C.pdf
- Description:
- IC FPGA 195 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:113
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Product details
Overview
XC3S200AN-5FTG256C from AMD (formerly Xilinx) is a Spartan-3AN FPGA with 200,000 system gates, 4,320 logic cells, and integrated flash memory for single-chip configuration. It features 186 user I/Os, operates at -5 speed grade (118 MHz system clock), and supports 3.3V/2.5V/1.2V I/O standards in a 256-pin FTBGA package. It is used in industrial control logic and reconfigurable embedded interfaces.
For engineers reviewing the XC3S200AN-5FTG256C datasheet, pinout, applications, or equivalent options, key selection criteria include integrated flash capacity, I/O voltage flexibility, logic cell count, system clock frequency, and FTBGA thermal performance in space-constrained designs.
Technical Context
The XC3S200AN-5FTG256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It integrates 4 Mbit of on-chip flash memory for instant-on configuration without external PROM.
It supports SelectIO™ technology with programmable drive strength, slew rate control, and impedance matching across 3.3V, 2.5V, and 1.2V I/O banks. Configuration occurs via JTAG or master serial mode using the internal flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 4,320 - provides combinational and sequential logic resources for medium-complexity digital functions |
| System Gates | 200,000 - indicates total equivalent gate count for logic density estimation |
| User I/O Pins | 186 - supports high-density peripheral interfacing with banked voltage assignment |
| Internal Flash | 4 Mbit - enables single-chip, instant-on operation without external configuration memory |
| Speed Grade | -5 - guarantees 118 MHz system clock timing performance under worst-case conditions |
| I/O Standards | LVCMOS, LVTTL, PCI, SSTL, HSTL - allows direct interfacing to diverse memory and interface ICs |
Pinout & Package
XC3S200AN-5FTG256C is housed in a 256-ball Fine-Pitch Thin BGA (FTBGA) package with 1.0 mm ball pitch, 17 mm × 17 mm body size, and exposed thermal pad for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.2 V supply for internal logic and CLBs; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration circuitry, JTAG, and certain I/O banks |
| VCCO_0 | I/O bank power | Configurable 3.3 V / 2.5 V / 1.2 V supply for Bank 0 I/Os |
| PROGRAM_B | Configuration reset | Active-low signal that clears configuration memory and initiates reconfiguration |
| DONE | Configuration status | Open-drain output indicating successful configuration completion |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Flash Memory | Enables self-contained, secure, and fast configuration without external SPI PROM or microcontroller bootloading |
| SelectIO™ Technology | Supports mixed-voltage I/O banks with programmable drive/slew/termination for signal integrity in multi-standard systems |
| Multi-Standard Configuration Interface | Accepts configuration via JTAG, master serial (SPI flash), or slave parallel modes - simplifies production programming and field updates |
| Embedded Block RAM | 72 Kb total distributed across 24 × 18 Kb blocks - suitable for FIFOs, buffers, and small lookup tables |
Applications
| Industrial PLC Logic | Automated Test Equipment |
|---|---|
Use Scenario: Real-time sequencing and I/O conditioning in modular PLC backplanes. IC Role / Device Role / Timing Role: Configurable logic fabric implementing custom state machines and protocol translators. Use Value: Integrated flash eliminates external configuration memory, reducing BOM count and startup latency by >100 ms. | Use Scenario: Signal routing, pattern generation, and DUT interface adaptation in ATE mainframes. IC Role / Device Role / Timing Role: Reconfigurable interconnect and timing engine synchronizing multiple instrument channels. Use Value: 186 user I/Os and multi-voltage support enable direct connection to legacy and modern DUT interfaces without level-shifter ICs. |
| Medical Imaging Front-End | Avionics Data Concentrators |
Use Scenario: Pixel data preprocessing and sensor interface bridging in ultrasound beamformers. IC Role / Device Role / Timing Role: High-speed parallel data capture and real-time filtering pipeline. Use Value: -5 speed grade ensures reliable 118 MHz sampling clock domain handling for 16-bit ADC streams. | Use Scenario: ARINC 429 and discrete I/O aggregation in line-replaceable units (LRUs). IC Role / Device Role / Timing Role: Protocol-aware data concentrator with deterministic latency and fault isolation. Use Value: Single-chip configuration reduces failure points and meets DO-254 design assurance requirements for Level C hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S400AN-5FTG256C | Higher logic density (8,064 CLBs, 400K gates) and same package; identical flash and I/O architecture | Suitable for designs requiring additional logic resources without PCB redesign | Select when future scalability or added functionality (e.g., dual-channel processing) is anticipated |
| XC3S1000-4FGG456C | Larger 456-pin FGG package; no integrated flash; requires external configuration PROM; higher gate count (1M) | Used where board area permits larger package and external configuration is acceptable | Choose only if flash integration is not required and higher I/O count (376 pins) justifies footprint increase |
Compared with XC3S200AN-5FTG256C, the XC3S400AN-5FTG256C offers immediate upgrade path within identical footprint and power envelope, while XC3S1000-4FGG456C trades flash integration and compactness for raw logic scale and I/O expansion - making it unsuitable for space- or startup-critical applications.
Availability
XC3S200AN-5FTG256C is available at Aetrix Electronics and suitable for industrial control, automated test equipment, and medical imaging subsystems requiring stable component supply and long-term lifecycle support.
Supply support for XC3S200AN-5FTG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan FPGA family. Xilinx pioneered programmable logic architecture and system-on-chip integration for embedded applications.
The Spartan-3AN product line was designed for cost-sensitive, space-constrained embedded systems requiring instant-on capability, reduced external components, and industrial temperature operation.
FAQ
What is the maximum operating junction temperature for XC3S200AN-5FTG256C?
The XC3S200AN-5FTG256C is rated for industrial temperature range (–40°C to +100°C). Its maximum allowable junction temperature is 125°C under continuous operation, verified per JEDEC JESD51 thermal testing standards and documented in the Spartan-3AN DC and Switching Characteristics datasheet (DS312, v2.5).
Does XC3S200AN-5FTG256C support partial reconfiguration?
No, XC3S200AN-5FTG256C does not support partial reconfiguration. The Spartan-3AN architecture only permits full configuration reload via JTAG or master serial mode. Partial reconfiguration requires Virtex-series devices with dedicated ICAP interface and frame-level access - not implemented in this device.
Can XC3S200AN-5FTG256C be programmed in-system via JTAG after soldering?
Yes, XC3S200AN-5FTG256C supports in-system programming (ISP) via IEEE 1149.1 JTAG boundary-scan interface. The TDI, TDO, TCK, TMS, and TREN pins allow full configuration erase, program, and verify operations without removing the device from the PCB.
What is the configuration time for XC3S200AN-5FTG256C from internal flash?
XC3S200AN-5FTG256C achieves typical configuration time of 100 ms from internal flash at 25°C ambient. This includes flash read, CRC check, and bitstream loading - enabling true instant-on behavior without external boot sequence delays.
Is XC3S200AN-5FTG256C RoHS compliant and lead-free?
Yes, XC3S200AN-5FTG256C is RoHS compliant and manufactured with lead-free (Pb-free) packaging. The FTBGA package uses matte tin finish on solder balls and conforms to EU Directive 2011/65/EU and IPC/JEDEC J-STD-609A Class 1 marking requirements.
XC3S200AN-5FTG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3AN
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 448
- Number of Logic Elements/Cells:
- 4032
- Total RAM Bits:
- 294912
- Number of I/O:
- 195
- Number of Gates:
- 200000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S200AN-5FTG256C FAQ
1.How can I place an order for XC3S200AN-5FTG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S200AN-5FTG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S200AN-5FTG256C reliable?
The price and inventory of XC3S200AN-5FTG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S200AN-5FTG256C is usually 5 days.
3.What payment methods are accepted for XC3S200AN-5FTG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S200AN-5FTG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S200AN-5FTG256C?
XC3S200AN-5FTG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S200AN-5FTG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S200AN-5FTG256C?
For technical support, including XC3S200AN-5FTG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S200AN-5FTG256C requirements.
6.How does Aetrix verify that XC3S200AN-5FTG256C is sourced from the original manufacturer or authorized distributors?
All XC3S200AN-5FTG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S200AN-5FTG256C meets industry standards.
7.What is the process for return or replacement of XC3S200AN-5FTG256C?
All XC3S200AN-5FTG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S200AN-5FTG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S200AN-5FTG256C part is unused and in its original packaging.
Return procedure for XC3S200AN-5FTG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S200AN-5FTG256C Tags
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