AMD XC3S250E-4CPG132C

Overview

XC3S250E-4CPG132C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250K system gates, 576 logic cells, 128 KB of block RAM, and configured in a 132-pin CSBGA package with 108 user I/Os. It operates at -4 speed grade (4.9 ns CLB delay) and supports 3.3V/2.5V/1.2V I/O standards for embedded control and interface bridging in industrial PLCs.

For engineers reviewing the XC3S250E-4CPG132C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade timing closure, single-ended LVCMOS/LVTTL compatibility, and availability of dedicated DSP slices for low-latency arithmetic functions.

Technical Context

The XC3S250E-4CPG132C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and eight global clock networks. It integrates 24 multipliers (18×18-bit) and supports SelectIO™ technology for programmable I/O standards including LVCMOS, LVTTL, PCI, and SSTL.

This device uses 90 nm CMOS process technology, features JTAG boundary-scan support per IEEE 1149.1, and includes internal configuration logic compatible with serial PROMs (XCFxxP) or microprocessor-controlled parallel loading via Master SelectMAP mode.

Key Specifications

Pinout & Package

XC3S250E-4CPG132C is housed in a 132-pin Chip Scale Ball Grid Array (CSBGA) package with 10 × 10 mm body size, 0.5 mm pitch, and Pb-free RoHS-compliant construction. The package supports reflow soldering and provides thermal performance suitable for industrial ambient temperatures up to +85°C.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S250E-4CPG132C, XC3S500E-4CPG132C offers gate scalability within identical mechanical constraints, while XC6SLX9-2TQG144C delivers architectural improvements at the cost of board redesign and reduced I/O count.

Availability

XC3S250E-4CPG132C is available at Aetrix Electronics and suitable for industrial motion control, legacy interface bridging, and automated test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC3S250E-4CPG132C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs acquired through the Xilinx merger in 2022.

The Spartan-3E family was designed for cost-sensitive, high-volume embedded applications requiring reliable logic density, flexible I/O, and long-term industrial availability.

FAQ

What is the maximum operating frequency supported by XC3S250E-4CPG132C?

The XC3S250E-4CPG132C has a -4 speed grade specifying a 4.9 ns CLB propagation delay, enabling reliable synchronous operation up to 200 MHz for well-constrained critical paths. Actual achievable frequency depends on design topology, routing congestion, and I/O standard selection, but the device consistently meets timing closure targets for industrial control loops and protocol engines running below 200 MHz. XC3S250E-4CPG132C does not guarantee 200 MHz across all configurations.

Does XC3S250E-4CPG132C support JTAG boundary-scan testing?

Yes, XC3S250E-4CPG132C fully complies with IEEE 1149.1 JTAG boundary-scan standards. Pins TCK, TMS, TDI, and TDO are dedicated for test access, enabling in-circuit verification, interconnect testing, and configuration debugging without requiring external test fixtures. This capability is integral to production test flows and field diagnostics for systems using XC3S250E-4CPG132C.

Can XC3S250E-4CPG132C be configured using a serial PROM?

Yes, XC3S250E-4CPG132C supports Master Serial configuration mode using XCFxxP series PROMs. The FPGA initiates read operations automatically after power-up, eliminating need for external controllers. This method is widely used in cost-sensitive applications where XC3S250E-4CPG132C must boot independently from nonvolatile storage without host processor involvement.

What I/O voltage standards are supported by XC3S250E-4CPG132C?

XC3S250E-4CPG132C supports LVCMOS (1.2V, 1.5V, 1.8V, 2.5V, 3.3V), LVTTL, PCI, and SSTL18 I/O standards across its eight I/O banks. Each bank is independently powered, allowing mixed-voltage operation-for example, interfacing 3.3V sensors and 1.8V memory on the same XC3S250E-4CPG132C device-without level shifters.

Is XC3S250E-4CPG132C RoHS compliant?

Yes, XC3S250E-4CPG132C is manufactured in a Pb-free RoHS-compliant process and packaged in a lead-free CSBGA. The device meets EU Directive 2011/65/EU requirements and carries appropriate marking per JEDEC J-STD-609. This compliance applies to all production lots shipped under the XC3S250E-4CPG132C part number, ensuring suitability for environmentally regulated industrial and medical applications.