My Inquiry
My Account
AMD XC3S250E-4CPG132I
- Part No.:
- XC3S250E-4CPG132I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 132-TFBGA, CSPBGA
- Datasheet:
-
XC3S250E-4CPG132I.pdf
- Description:
- IC FPGA 92 I/O 132CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,287
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S250E-4CPG132I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250K system gates, 484 logic cells, 22 I/O banks, and 132-pin CP (Chip Scale Package) with 108 user I/Os. It operates at -4 speed grade (4.9 ns CLB delay), supports 3.3V/2.5V/1.2V dual-supply operation, and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC3S250E-4CPG132I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count, speed grade compatibility, package thermal profile, and configuration mode support (Master Serial, Slave Serial, Boundary Scan).
Technical Context
The XC3S250E-4CPG132I implements a configurable logic block (CLB) architecture with four 3-input LUTs and eight flip-flops per CLB, distributed RAM up to 36 Kbits, and eighteen 18×18 multipliers. It supports SelectIO™ standards including LVCMOS, LVTTL, PCI, HSTL, and SSTL.
Configuration is performed via JTAG boundary scan or serial PROM, with internal startup sequence controlling power-on reset, configuration clock generation, and DONE pin assertion. The device includes Digital Clock Managers (DCMs) for phase-matched clock synthesis and jitter reduction across multiple output frequencies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 484 - total configurable logic resources for combinational and sequential logic implementation |
| System Gates | 250,000 - gate-equivalent capacity for estimating design complexity and resource utilization |
| User I/O Pins | 108 - bidirectional signal pins supporting multiple I/O standards and voltage levels |
| Speed Grade | -4 - guarantees 4.9 ns CLB propagation delay, defining maximum operating frequency for critical paths |
| Package | CPG132 - 132-ball fine-pitch chip-scale package (0.5 mm pitch), 8×8 mm body, 0.65 mm height |
| DCM Units | 4 - digital clock managers enabling input clock multiplication, division, phase shifting, and duty cycle correction |
| Block RAM | 36 Kbits - distributed memory blocks usable as FIFOs, lookup tables, or register files |
Pinout & Package
XC3S250E-4CPG132I uses a 132-ball CSP (CPG132) package with 108 user-configurable I/Os, 6 dedicated configuration pins (PROGRAM_B, INIT_B, DONE, TCK, TMS, TDI), 4 DCM clock inputs, and 8 power/ground pairs. Thermal pad on underside requires solder connection for thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asynchronous reset of configuration logic; pulls device into configuration mode when asserted |
| INIT_B | Active-Low Configuration Status | Open-drain output indicating configuration memory erasure or CRC error during startup |
| DONE | Configuration Completion Indicator | Drives high after successful configuration and release of internal global reset |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Supports IEEE 1149.1 test access, in-system programming, and debug visibility |
| CLK0–CLK3 | DCM Input Clocks | Dedicated global clock inputs routed directly to DCM units for low-skew timing |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 12 I/O standards (LVCMOS, LVTTL, PCI, HSTL, SSTL) with programmable drive strength and slew rate |
| Digital Clock Manager (DCM) | Four independent DCMs provide jitter-free clock synthesis, phase alignment, and frequency translation without external PLLs |
| Multi-Voltage I/O Banks | 22 I/O banks allow mixed-voltage operation: 3.3V, 2.5V, 1.8V, and 1.2V interfaces simultaneously on same device |
| Embedded Multipliers | Eighteen 18×18 signed/unsigned multipliers enable efficient arithmetic pipelines for DSP and control algorithms |
| Configurable Logic Blocks | Each CLB contains four 3-input LUTs and eight registers, enabling high-density logic mapping with predictable timing |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time digital I/O expansion and protocol translation between legacy fieldbus and CAN-based controllers. IC Role / Device Role / Timing Role: FPGA acts as reconfigurable bridge logic handling parallel-to-serial conversion, bit-level timing control, and watchdog supervision. Use Value: XC3S250E-4CPG132I provides 108 user I/Os and -4 speed grade to meet <1 µs response latency for safety-critical I/O scanning. | Use Scenario: ISO 15765-4 (CAN-TP) protocol adaptation layer between OBD-II connector and microcontroller UART. IC Role / Device Role / Timing Role: XC3S250E-4CPG132I implements hardware-accelerated frame assembly/disassembly and CRC calculation offloading CPU. Use Value: Embedded 18×18 multipliers and DCMs enable deterministic 500 kbps CAN message processing with sub-cycle timing accuracy. |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregation and preprocessing of analog sensor data from multiple ADC channels before transmission to host MCU. IC Role / Device Role / Timing Role: XC3S250E-4CPG132I serves as synchronized data concentrator with precise sample alignment across 16-channel parallel ADC interface. Use Value: 22 I/O banks and multi-voltage support allow direct interfacing to 1.8V ADCs and 3.3V USB PHY without level shifters. | Use Scenario: High-speed digital stimulus generation for IC functional testing at 100 MHz pattern rates. IC Role / Device Role / Timing Role: XC3S250E-4CPG132I implements state-machine-driven vector sequencer with glitch-free clock domain crossing. Use Value: -4 speed grade and 4 DCM units ensure stable 100 MHz output clocks with <100 ps jitter for reliable test coverage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4CPG132I | 500K system gates, 948 logic cells, identical CPG132 package and pinout | Higher gate count enables larger state machines and more complex protocol stacks | Choose when design exceeds XC3S250E-4CPG132I resource utilization by >20% |
| XC6SLX9-2CSG225I | Spartan-6 family, 9152 logic cells, 225-ball CSO package, no pin compatibility | Includes integrated PCIe endpoint, DDR2/3 controller, and enhanced DSP slices | Prefer for new designs requiring higher bandwidth or memory interface integration |
Compared with XC3S500E-4CPG132I and XC6SLX9-2CSG225I, the XC3S250E-4CPG132I offers optimal cost-performance balance for fixed-function bridging where gate count stays below 300K and no advanced peripherals are required.
Availability
XC3S250E-4CPG132I is available at Aetrix Electronics and suitable for industrial PLC modules, automotive diagnostic tools, and medical sensor hubs requiring stable component supply across extended product lifecycles.
Supply support for XC3S250E-4CPG132I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan FPGA portfolio for cost-sensitive, high-volume embedded applications.
The Spartan-3E family was designed for low-power, low-pin-count programmable logic in industrial control, communications infrastructure, and consumer electronics.
FAQ
What configuration modes does the XC3S250E-4CPG132I support?
The XC3S250E-4CPG132I supports Master Serial (via on-board PROM), Slave Serial (driven by external controller), and JTAG Boundary Scan configuration modes. It does not support Master SelectMAP or Slave Parallel modes. Configuration is initiated by PROGRAM_B and validated by DONE pin assertion after CRC check completion. The XC3S250E-4CPG132I requires external 2.5V or 3.3V supply for configuration voltage.
Does the XC3S250E-4CPG132I include on-chip memory?
Yes, the XC3S250E-4CPG132I includes 36 Kbits of distributed block RAM implemented within CLBs, usable as synchronous RAM, ROM, or shift registers. It has no dedicated large-block RAM; all memory is distributed and tied to logic resources. This memory is sufficient for small FIFOs or lookup tables but not for video frame buffers. The XC3S250E-4CPG132I relies on external memory for larger storage needs.
What is the thermal performance of the CPG132 package for XC3S250E-4CPG132I?
The XC3S250E-4CPG132I in CPG132 package has a θJA of 32.5°C/W under JEDEC standard 2S2P board conditions. Maximum junction temperature is 100°C. Thermal pad soldering to PCB ground plane is mandatory for reliable operation above 150 mW dynamic power. The XC3S250E-4CPG132I datasheet specifies minimum solder mask opening and stencil thickness for thermal pad attachment.
Can the XC3S250E-4CPG132I operate with mixed I/O voltages?
Yes, the XC3S250E-4CPG132I supports mixed I/O voltages across its 22 I/O banks: each bank can be independently set to 3.3V, 2.5V, 1.8V, or 1.2V. VCCO must match the selected I/O standard voltage, while VCCAUX remains fixed at 2.5V. This allows direct interfacing to multiple voltage-domain peripherals without external level shifters. The XC3S250E-4CPG132I requires separate power supplies per bank voltage level.
Is the XC3S250E-4CPG132I RoHS compliant and lead-free?
Yes, the XC3S250E-4CPG132I is RoHS compliant and lead-free per EU Directive 2011/65/EU. The CPG132 package uses matte tin finish on solder balls, with no lead content exceeding 0.1% by weight. It meets IPC/JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and requires bake conditioning if exposed to ambient for >168 hours before reflow. The XC3S250E-4CPG132I is qualified for industrial temperature range (-40°C to +100°C).
XC3S250E-4CPG132I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 132-TFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 612
- Number of Logic Elements/Cells:
- 5508
- Total RAM Bits:
- 221184
- Number of I/O:
- 92
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 132-CSPBGA (8x8)
XC3S250E-4CPG132I FAQ
1.How can I place an order for XC3S250E-4CPG132I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S250E-4CPG132I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S250E-4CPG132I reliable?
The price and inventory of XC3S250E-4CPG132I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S250E-4CPG132I is usually 5 days.
3.What payment methods are accepted for XC3S250E-4CPG132I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S250E-4CPG132I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S250E-4CPG132I?
XC3S250E-4CPG132I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S250E-4CPG132I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S250E-4CPG132I?
For technical support, including XC3S250E-4CPG132I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S250E-4CPG132I requirements.
6.How does Aetrix verify that XC3S250E-4CPG132I is sourced from the original manufacturer or authorized distributors?
All XC3S250E-4CPG132I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S250E-4CPG132I meets industry standards.
7.What is the process for return or replacement of XC3S250E-4CPG132I?
All XC3S250E-4CPG132I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S250E-4CPG132I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S250E-4CPG132I part is unused and in its original packaging.
Return procedure for XC3S250E-4CPG132I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S250E-4CPG132I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
