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AMD XC3S250E-4FT256C
- Part No.:
- XC3S250E-4FT256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-LBGA
- Datasheet:
-
XC3S250E-4FT256C.pdf
- Description:
- IC FPGA 172 I/O 256FTBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,372
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Product details
Overview
XC3S250E-4FT256C from AMD (formerly Xilinx) is a Spartan-3E family FPGA with 250,000 system gates, 5,928 logic cells, and 216 I/O pins in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -4 speed grade (tPD = 4.5 ns), supports SelectIO™ standards up to 333 Mbps, and targets cost-sensitive embedded control and interface bridging applications.
For engineers reviewing the XC3S250E-4FT256C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, logic cell density, supported voltage standards (LVCMOS, LVTTL, PCI), internal RAM capacity, and configuration mode compatibility (Master Serial, Slave Parallel).
Technical Context
The XC3S250E-4FT256C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, block RAM (288 Kbits), and dedicated digital clock managers (DCMs) for phase-matched clock synthesis. It supports multi-voltage I/O banks (1.2 V, 1.8 V, 2.5 V, 3.3 V) and includes 24 multipliers for arithmetic-intensive tasks.
Configuration is performed via external PROM or processor-controlled slave parallel mode. The device uses JTAG boundary-scan for testing and supports partial reconfiguration in selected designs, though full reconfiguration requires external configuration memory reload.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 5,928 - provides combinational and sequential logic capacity for medium-complexity control and datapath functions |
| System Gates | 250,000 - indicates relative logic density benchmarked against ASIC gate count equivalents |
| I/O Pins | 216 - supports high-pin-count peripheral interfacing with bank-wise voltage isolation |
| Block RAM | 288 Kbits - enables on-chip FIFOs, buffers, and small lookup tables without external memory |
| DCMs | 2 - delivers jitter-reduced clock synthesis, frequency multiplication/division, and phase shifting |
| Speed Grade | -4 - guarantees maximum propagation delay of 4.5 ns for critical CLB paths under worst-case conditions |
| Config Voltage | 1.2 V core / 3.3 V I/O - defines mandatory supply rail separation and decoupling requirements |
Pinout & Package
XC3S250E-4FT256C is housed in a 256-ball Fine-Pitch BGA (FT256) package with 1.0 mm ball pitch, 17 × 17 array, and thermal pad. Package dimensions are 17 mm × 17 mm × 1.55 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives serial configuration data into FPGA; must be driven externally during Master Serial mode |
| DIN | Configuration Data In | Serial input for bitstream loading in Master Serial or JTAG modes |
| PROGRAM_B | Initiate Configuration | Active-low asynchronous reset that clears configuration memory and restarts load sequence |
| INIT_B | Configuration Status | Open-drain output indicating configuration completion or error condition |
| DONE | Configuration Done | Open-drain output confirming successful bitstream load and device readiness |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports LVCMOS, LVTTL, PCI, HSTL, SSTL I/O standards across independent banks - enables mixed-voltage system interfacing |
| Digital Clock Manager (DCM) | Two fully integrated DCMs provide deterministic clock deskew, frequency synthesis, and duty-cycle correction without external PLL components |
| Embedded Multipliers | 24 dedicated 18 × 18-bit two's complement multipliers - accelerate DSP filtering and arithmetic pipelines |
| Block RAM | 288 Kbits distributed across 32 × 9 Kbit blocks - allows dual-port access for simultaneous read/write in memory-intensive logic |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port - enables board-level interconnect verification and in-system programming |
Applications
| Industrial PLC I/O Expansion | Video Interface Bridge |
|---|---|
Use Scenario: Adding isolated digital I/O and analog signal conditioning to legacy PLC backplanes using field-upgradeable logic. IC Role / Device Role / Timing Role: FPGA acts as protocol translator and real-time I/O controller, managing timing-critical sampling and bus arbitration. Use Value: 216 I/O pins and multi-voltage support allow direct connection to diverse sensor/actuator interfaces without level-shifter ICs. | Use Scenario: Converting between parallel RGB video and serialized LVDS or FPD-Link signals in medical imaging displays. IC Role / Device Role / Timing Role: FPGA performs pixel clock domain crossing, color space conversion, and serialization/deserialization. Use Value: Embedded multipliers and block RAM enable real-time gamma correction and frame buffering within a single chip. |
| Automotive Diagnostic Gateway | Test Equipment Pattern Generator |
Use Scenario: Aggregating CAN, LIN, and UART diagnostic messages from ECUs and forwarding them over USB or Ethernet. IC Role / Device Role / Timing Role: FPGA serves as protocol multiplexer and message scheduler, handling time-triggered communication windows. Use Value: SelectIO™ support for 3.3 V LVTTL and 5 V-tolerant inputs accommodates legacy automotive microcontroller interfaces. | Use Scenario: Generating high-speed digital stimulus waveforms for ATE systems validating ASIC and SoC functionality. IC Role / Device Role / Timing Role: FPGA implements programmable pattern sequencer with precise cycle-accurate timing control. Use Value: -4 speed grade ensures sub-5 ns path timing margin for 200+ MHz test clock domains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4FT256C | Higher logic density (11,128 CLBs), same package and I/O count - requires identical PCB layout but greater power and thermal budget | Supports larger state machines and more complex protocol stacks; not suitable for gate-count-constrained designs | Select when additional logic resources are needed without changing board footprint |
| LFE5U-25F-6BG256C | ECP5 family, 25K LUTs, 1.2 V core, 256-ball CABGA - different architecture, toolchain, and configuration method (SPI flash native) | Better suited for low-power, high-throughput SerDes applications; lacks native DCMs but offers embedded SERDES | Choose for new designs prioritizing power efficiency and serial connectivity over legacy toolchain compatibility |
Compared with XC3S250E-4FT256C, the XC3S500E-4FT256C offers scalable logic headroom within identical mechanical constraints, while the LFE5U-25F-6BG256C shifts design focus toward modern low-power serial interfaces and eliminates external configuration PROM dependency.
Availability
XC3S250E-4FT256C is available at Aetrix Electronics and suitable for industrial automation, test equipment, and automotive diagnostics requiring stable component supply across extended production lifecycles.
Supply support for XC3S250E-4FT256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools.
The Spartan-3E family was designed for cost-optimized, high-volume embedded applications requiring flexible logic, moderate I/O, and predictable timing - especially where legacy toolchain support and long-term availability are critical.
FAQ
What is the configuration method supported by XC3S250E-4FT256C?
XC3S250E-4FT256C supports Master Serial (via external PROM), Slave Parallel (processor-controlled), and JTAG modes. Configuration bitstream is loaded through dedicated pins (CCLK, DIN, PROGRAM_B), with INIT_B and DONE signaling status. The device does not support internal flash-based configuration.
Does XC3S250E-4FT256C include on-chip memory resources?
Yes, XC3S250E-4FT256C integrates 288 Kbits of block RAM organized as thirty-two 9 Kbit blocks, plus distributed RAM within CLBs. This enables implementation of FIFOs, dual-port buffers, and small lookup tables without external memory chips.
What I/O standards are supported by XC3S250E-4FT256C?
XC3S250E-4FT256C supports LVCMOS (1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V), LVTTL, PCI, HSTL Class I/II, and SSTL2 Class I/II across independently biased I/O banks - enabling mixed-voltage board designs.
Can XC3S250E-4FT256C operate with multiple supply voltages?
Yes, XC3S250E-4FT256C requires separate 1.2 V core (VCCINT), 2.5 V or 3.3 V auxiliary (VCCAUX), and bank-specific I/O (VCCO) supplies. Each I/O bank can be set to different VCCO voltages, allowing concurrent use of multiple interface standards.
Is XC3S250E-4FT256C compatible with Xilinx ISE Design Suite?
Yes, XC3S250E-4FT256C is fully supported by Xilinx ISE 14.7 - the final and only officially supported toolchain. It is not compatible with Vivado, which targets 7-series and newer architectures.
XC3S250E-4FT256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 612
- Number of Logic Elements/Cells:
- 5508
- Total RAM Bits:
- 221184
- Number of I/O:
- 172
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FTBGA (17x17)
XC3S250E-4FT256C FAQ
1.How can I place an order for XC3S250E-4FT256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S250E-4FT256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S250E-4FT256C reliable?
The price and inventory of XC3S250E-4FT256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S250E-4FT256C is usually 5 days.
3.What payment methods are accepted for XC3S250E-4FT256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S250E-4FT256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S250E-4FT256C?
XC3S250E-4FT256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S250E-4FT256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S250E-4FT256C?
For technical support, including XC3S250E-4FT256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S250E-4FT256C requirements.
6.How does Aetrix verify that XC3S250E-4FT256C is sourced from the original manufacturer or authorized distributors?
All XC3S250E-4FT256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S250E-4FT256C meets industry standards.
7.What is the process for return or replacement of XC3S250E-4FT256C?
All XC3S250E-4FT256C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S250E-4FT256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S250E-4FT256C part is unused and in its original packaging.
Return procedure for XC3S250E-4FT256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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