AMD XC3S250E-4FT256I

Overview

XC3S250E-4FT256I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250K system gates, 576 logic cells, and 216 Kbits of block RAM. It features 192 user I/Os, operates at -4 speed grade (t_PD = 4.6 ns), and supports 1.2 V core voltage with 3.3 V or 2.5 V I/O compatibility. It is used in industrial control logic and low-cost embedded interface bridging.

For engineers reviewing the XC3S250E-4FT256I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, speed grade timing closure, block RAM depth, and 1.2 V core power efficiency for cost-sensitive reconfigurable logic designs.

Technical Context

The XC3S250E-4FT256I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It supports SelectIO™ technology for single-ended and differential signaling including LVCMOS, LVTTL, PCI, and SSTL-2.

It includes Digital Clock Managers (DCMs) for clock synthesis, phase shifting, and duty cycle correction, with support for up to 240 MHz input clocks and jitter reduction. Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces.

Key Specifications

Pinout & Package

XC3S250E-4FT256I is housed in a 256-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm pitch, 17 mm × 17 mm body size, and thermal pad exposed on underside for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XC3S250E-4FT256I, the XC3S500E-4FT256I offers direct scalability within the same footprint, while the XC6SLX9-2TQG144C introduces architectural improvements but requires full schematic and layout revision.

Availability

XC3S250E-4FT256I is available at Aetrix Electronics and suitable for industrial automation, test instrumentation, and embedded video interface applications requiring stable component supply and long-term obsolescence management.

Supply support for XC3S250E-4FT256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, edge, and embedded markets.

The Spartan-3E family was designed for cost-sensitive, high-volume applications requiring reconfigurable logic with predictable timing and low-power operation - especially in industrial control and interface bridging.

FAQ

What is the maximum operating frequency supported by the XC3S250E-4FT256I?

The XC3S250E-4FT256I supports a maximum input clock frequency of 240 MHz when using its Digital Clock Manager (DCM). This applies to externally supplied clocks feeding the DCM; actual system clock frequencies depend on design placement, routing, and timing constraints. The -4 speed grade ensures critical path delays meet 4.6 ns propagation targets under specified voltage and temperature conditions. XC3S250E-4FT256I timing reports must be verified in Vivado or ISE tools for each specific implementation.

Does the XC3S250E-4FT256I support JTAG configuration?

Yes, the XC3S250E-4FT256I supports IEEE 1149.1-compliant JTAG boundary-scan for in-system programming and debugging. It uses TDI, TDO, TMS, and TCK pins for configuration bitstream loading and device interrogation. JTAG mode does not require external PROM and allows reprogramming without power cycling. XC3S250E-4FT256I JTAG functionality is fully supported in Xilinx iMPACT and Vivado Hardware Manager tools.

What I/O standards are supported by the XC3S250E-4FT256I?

The XC3S250E-4FT256I supports LVCMOS, LVTTL, PCI, and SSTL-2 I/O standards across its 192 user I/O pins. Each I/O bank has independent VCCO voltage (2.5 V or 3.3 V), enabling mixed-voltage operation. Differential standards like LVDS are not natively supported - external resistors or companion drivers are required. XC3S250E-4FT256I I/O characteristics are defined in DS312 and UG331 documentation.

Is the XC3S250E-4FT256I RoHS compliant?

Yes, the XC3S250E-4FT256I is RoHS compliant and lead-free, meeting EU Directive 2011/65/EU requirements. It uses matte tin finish on solder balls and halogen-free molding compound. The device carries the "Pb-Free" marking on its top-side laser etch and is listed in Xilinx's official compliance database. XC3S250E-4FT256I conforms to JEDEC J-STD-020 moisture sensitivity level 3 (MSL3).

Can the XC3S250E-4FT256I be used in automotive applications?

The XC3S250E-4FT256I is rated for industrial temperature range (–40°C to +100°C junction), making it suitable for under-hood or cabin-mounted automotive diagnostic and infotainment subsystems. However, it is not AEC-Q100 qualified and lacks automotive-specific reliability testing. XC3S250E-4FT256I is commonly deployed in non-safety-critical automotive tools and aftermarket devices where qualification is not mandated.