My Inquiry
My Account
AMD XC3S250E-4PQ208I
- Part No.:
- XC3S250E-4PQ208I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 208-BFQFP
- Datasheet:
-
XC3S250E-4PQ208I.pdf
- Description:
- IC FPGA 158 I/O 208QFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,092
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC3S250E-4PQ208I from AMD (formerly Xilinx) is a Spartan-3E family FPGA with 250,000 system gates, 576 Kbits of block RAM, 24 I/O banks, and operation rated for -4 speed grade and industrial temperature range (-40°C to +100°C). It serves as a reconfigurable logic fabric in embedded control, digital signal preprocessing, and interface bridging applications.
For engineers reviewing the XC3S250E-4PQ208I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2V/2.5V/3.3V), distributed RAM capacity (17,920 bits), global clock networks (8), and configuration via Master Serial mode using external PROM.
Technical Context
The XC3S250E-4PQ208I implements a hierarchical architecture with configurable logic blocks (CLBs), dedicated multipliers (12 × 18-bit), and digital clock managers (DCMs) supporting phase shifting and frequency synthesis. It supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed through JTAG, Master Serial, or Slave Parallel modes, with bitstream security enabled via readback protection. The device uses internal voltage regulation (VCCINT = 1.2V) and supports dual-supply I/O operation with independent VCCO per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 5,712 - provides gate-equivalent capacity for medium-complexity control and datapath logic |
| Block RAM | 576 Kbits - supports on-chip buffering for FIFOs, coefficient storage, or frame buffers |
| I/O Pins | 141 user I/O - enables direct connection to multiple parallel buses or high-pin-count peripherals |
| Speed Grade | -4 - guarantees timing closure up to 333 MHz for critical paths under industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded deployments |
| VCCINT | 1.2V ±3% - requires tight-regulation power supply; not compatible with 1.8V core rails |
| Config Mode | Master Serial - boots autonomously from external SPI PROM without host processor intervention |
Pinout & Package
PQ208 is a 208-pin Plastic Quad Flat Pack (PQFP) with 0.5 mm pitch, 28 × 28 mm body size, and exposed thermal pad. It supports lead-free (RoHS-compliant) assembly and standard reflow profiles.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCINT | 1.2V core supply input; must be decoupled locally with 100nF + 10µF ceramics |
| P2 | VCCO_0 | I/O bank 0 output voltage reference; sets logic levels for pins A1–D12 |
| T14 | PROGRAM_B | Active-low asynchronous reset; initiates configuration reload when pulsed low |
| R15 | DONE | Open-drain status output; goes high after successful configuration and initialization |
| M16 | CCLK | Configuration clock input; driven by PROM or external source during Master Serial boot |
| U17 | INIT_B | Open-drain initialization status; pulled low during configuration, released on success |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 18×18 Multipliers | 12 units enable real-time FIR filtering or motor control loop computation without CLB resource overhead |
| Digital Clock Managers (DCMs) | 4 DCMs provide jitter-reduced clock synthesis, phase alignment, and frequency multiplication/division |
| SelectIO Technology | Supports mixed-voltage I/O banks (1.2V/1.5V/1.8V/2.5V/3.3V) enabling direct interfacing to legacy and modern peripherals |
| Embedded Block RAM | 20-block allocation (each 18Kb) allows dual-port memory access with independent clocks for ping-pong buffering |
| Configuration Security | Readback disable prevents bitstream extraction; essential for IP-protected firmware deployment |
Applications
| Industrial Motion Control | Automotive Camera Interface |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives. IC Role / Device Role / Timing Role: Reconfigurable logic fabric executing closed-loop control algorithms with deterministic latency. Use Value: 141 I/O pins allow simultaneous connection to PWM outputs, quadrature inputs, and CAN/UART debug interfaces. | Use Scenario: Bridging MIPI CSI-2 camera sensors to parallel-input image processors in ADAS vision modules. IC Role / Device Role / Timing Role: Protocol translator and clock domain crossing engine between high-speed serial sensor interface and synchronous parallel bus. Use Value: Four DCMs enable precise skew adjustment between pixel clock and system clock domains. |
| Medical Imaging Front-End | Test & Measurement Equipment |
Use Scenario: Digitizing and preprocessing analog sensor data from ultrasound transducer arrays. IC Role / Device Role / Timing Role: High-speed ADC interface controller with real-time FIR filtering using embedded multipliers. Use Value: 576 Kbits of block RAM stores filter coefficients and short-duration waveform buffers without external memory. | Use Scenario: Flexible pattern generation and response capture in automated test systems for PCB validation. IC Role / Device Role / Timing Role: Programmable logic sequencer synchronizing stimulus signals and sampling windows with sub-ns precision. Use Value: -4 speed grade ensures reliable timing at 333 MHz for high-resolution digital vector generation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4PQ208I | Higher logic capacity (11,248 CLBs), same package and speed grade | Supports larger state machines and wider datapaths; requires identical PCB layout | Choose when design scales beyond 5,712 CLBs but retains same I/O count and thermal envelope |
| XC6SLX16-2CSG324C | Spartan-6 family; 14,579 logic cells, 16-bit DDR2 interface, lower static power | Requires board redesign due to 324-pin CSBG324 package and different configuration voltage (2.5V) | Prefer for new designs needing higher performance, DDR memory support, or improved power efficiency |
Compared with XC3S500E-4PQ208I and XC6SLX16-2CSG324C, the XC3S250E-4PQ208I offers optimal balance of I/O density, deterministic timing, and industrial temperature support in a mature, cost-optimized PQFP package-ideal for volume production where footprint and qualification stability are prioritized over raw scalability.
Availability
XC3S250E-4PQ208I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging front-end, and test & measurement equipment requiring stable component supply across long-lifecycle programs.
Supply support for XC3S250E-4PQ208I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-3E family-including XC3S250E-4PQ208I-was designed for cost-sensitive, high-volume embedded applications requiring reconfigurable logic with industrial-grade reliability and low-power operation.
FAQ
What is the maximum operating frequency of the XC3S250E-4PQ208I?
The XC3S250E-4PQ208I is rated for a -4 speed grade, guaranteeing timing closure up to 333 MHz for critical paths under industrial temperature conditions. Actual achievable frequency depends on design complexity, routing, and clock domain constraints. The device includes four Digital Clock Managers (DCMs) that support frequency synthesis and phase alignment to meet precise timing requirements in the XC3S250E-4PQ208I implementation.
Does the XC3S250E-4PQ208I support JTAG programming?
Yes, the XC3S250E-4PQ208I supports IEEE 1149.1 JTAG boundary-scan for programming, debugging, and verification. JTAG mode enables in-system configuration and partial reconfiguration without requiring external PROM. This capability is fully documented in the official XC3S250E-4PQ208I configuration user guide and is electrically supported by dedicated TCK, TMS, TDI, and TDO pins.
What I/O standards are supported by the XC3S250E-4PQ208I?
The XC3S250E-4PQ208I supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL across its 24 I/O banks. Each bank operates independently with selectable VCCO (1.2V to 3.3V), enabling mixed-voltage interfacing. This flexibility allows the XC3S250E-4PQ208I to connect directly to diverse peripherals such as microcontrollers, ADCs, and memory devices without level-shifting circuitry.
Is the XC3S250E-4PQ208I RoHS compliant?
Yes, the XC3S250E-4PQ208I PQ208 package is RoHS compliant and lead-free. It meets EU Directive 2011/65/EU requirements and is qualified for standard Pb-free reflow soldering profiles. The RoHS compliance status is verified and published in AMD's official product change notifications and material declarations for the XC3S250E-4PQ208I.
How is configuration memory loaded into the XC3S250E-4PQ208I?
The XC3S250E-4PQ208I supports Master Serial configuration mode, where it automatically loads its bitstream from an external SPI PROM upon power-up. The CCLK, DIN, and DONE pins coordinate this autonomous boot process. Alternatively, configuration can be initiated via JTAG or Slave Parallel mode using a host processor. All methods are natively supported in the XC3S250E-4PQ208I hardware architecture.
XC3S250E-4PQ208I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 208-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 612
- Number of Logic Elements/Cells:
- 5508
- Total RAM Bits:
- 221184
- Number of I/O:
- 158
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 208-PQFP (28x28)
XC3S250E-4PQ208I FAQ
1.How can I place an order for XC3S250E-4PQ208I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S250E-4PQ208I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S250E-4PQ208I reliable?
The price and inventory of XC3S250E-4PQ208I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S250E-4PQ208I is usually 5 days.
3.What payment methods are accepted for XC3S250E-4PQ208I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S250E-4PQ208I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S250E-4PQ208I?
XC3S250E-4PQ208I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S250E-4PQ208I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S250E-4PQ208I?
For technical support, including XC3S250E-4PQ208I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S250E-4PQ208I requirements.
6.How does Aetrix verify that XC3S250E-4PQ208I is sourced from the original manufacturer or authorized distributors?
All XC3S250E-4PQ208I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S250E-4PQ208I meets industry standards.
7.What is the process for return or replacement of XC3S250E-4PQ208I?
All XC3S250E-4PQ208I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S250E-4PQ208I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S250E-4PQ208I part is unused and in its original packaging.
Return procedure for XC3S250E-4PQ208I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S250E-4PQ208I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
