AMD XC3S250E-4TQ144C

Overview

XC3S250E-4TQ144C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250K system gates, 576 logic cells, and embedded block RAM totaling 216 Kbits. It operates at -4 speed grade (t_PD = 4.5 ns), uses 1.2 V core voltage, and is packaged in a 144-pin TQFP with 108 user I/Os. It targets cost-sensitive industrial control and communication interface bridging.

For engineers reviewing the XC3S250E-4TQ144C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count, block RAM depth, global clock routing capability, and support for LVCMOS25/LVCMOS33 I/O standards in this TQFP package.

Technical Context

The XC3S250E-4TQ144C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, and dedicated multipliers. It includes four global clock buffers and supports SelectIO™ technology for programmable I/O standards including LVCMOS, LVTTL, and PCI.

This device integrates eight 18×18-bit binary multipliers and 216 Kbits of total block RAM organized as 24 × 9 Kb blocks. Configuration is performed via master serial mode using external PROM or JTAG boundary-scan.

Key Specifications

Pinout & Package

XC3S250E-4TQ144C is housed in a 144-pin Thin Quad Flat Package (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad not present. Pin functions are defined per Xilinx DS312 (v1.5) and include dedicated configuration pins (INIT_B, PROGRAM_B, DONE), four global clock inputs (GCLK0–GCLK3), and dual-purpose I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.

Compared with XC3S250E-4TQ144C, the XC3S500E-4TQ144C offers drop-in scalability within identical footprint and timing model, while the LFE5U-25F-6BG256C delivers modern low-power architecture and SERDES but demands layout revision and toolchain migration.

Availability

XC3S250E-4TQ144C is available at Aetrix Electronics and suitable for industrial control systems, communication protocol bridges, and embedded video processing requiring stable component supply and long-term obsolescence management.

Supply support for XC3S250E-4TQ144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Spartan-3E product family for legacy industrial and aerospace applications.

The Spartan-3E family was designed for cost-optimized, non-volatile-configurable logic in space-constrained embedded systems requiring predictable timing and mature toolchain support.

FAQ

What configuration methods does the XC3S250E-4TQ144C support?

The XC3S250E-4TQ144C supports master serial (via external PROM), slave serial (from microcontroller), JTAG boundary-scan, and slave selectMAP modes. Master serial is most common for standalone operation; JTAG is used for debugging and programming during development. All methods load the same bitstream format, and configuration occurs automatically after power-up when PROGRAM_B is asserted.

Does the XC3S250E-4TQ144C include built-in configuration memory?

No, the XC3S250E-4TQ144C is SRAM-based and requires external non-volatile memory (e.g., XCF02S PROM) to store the configuration bitstream. Upon power-up, it loads the bitstream automatically via master serial mode unless configured otherwise. This architecture enables field reprogramming but mandates reliable power sequencing to avoid configuration failure.

Can the XC3S250E-4TQ144C operate with mixed I/O voltages on different banks?

Yes, the XC3S250E-4TQ144C supports independent VCCO per I/O bank, allowing simultaneous LVCMOS33 and LVCMOS25 signaling. Each bank's VCCO must match the selected I/O standard's voltage requirement, and bank-specific configuration bits define drive strength and slew rate. This capability simplifies interfacing with heterogeneous peripheral sets without level shifters.

What is the maximum operating frequency for global clock networks in the XC3S250E-4TQ144C?

The XC3S250E-4TQ144C supports global clock frequencies up to 500 MHz in simulation, but practical maximums depend on placement, routing, and logic depth. For designs meeting timing closure with -4 speed grade, sustained 200 MHz clock domains are achievable with proper constraints. The four dedicated GCLK pins feed low-skew networks that distribute clocks to all CLBs with minimal skew.

Is the XC3S250E-4TQ144C RoHS compliant and lead-free?

Yes, the XC3S250E-4TQ144C is RoHS compliant and manufactured with lead-free terminations per Xilinx specification DS312. The TQFP package uses matte tin plating, and the device meets JEDEC J-STD-020 moisture sensitivity level 3. Full compliance documentation, including substance declarations and test reports, is available through AMD's product change notifications.