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AMD XC3S250E-4TQ144I
- Part No.:
- XC3S250E-4TQ144I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S250E-4TQ144I.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,591
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Product details
Overview
XC3S250E-4TQ144I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250K system gates, 480 logic cells, 22 I/O banks, and 144-pin TQFP package. It operates at -4 speed grade (4.6 ns CLB delay), supports 3.3V/2.5V/1.2V dual-supply operation, and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC3S250E-4TQ144I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage flexibility, distributed RAM capacity, global clock routing resources, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC3S250E-4TQ144I implements a hierarchical logic fabric with configurable logic blocks (CLBs), distributed RAM (176 Kbits), and dedicated multipliers (4 × 18-bit). It integrates eight global clock buffers and supports SelectIO™ standards including LVCMOS, LVTTL, PCI, and SSTL.
Configuration is performed via Master Serial mode using external PROM or through JTAG IEEE 1149.1 boundary-scan interface. The device lacks internal configuration memory and requires external bitstream loading at power-up.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 480 - provides combinational and sequential logic density for medium-complexity control state machines |
| System Gates | 250,000 - indicates total equivalent ASIC gate count for logic synthesis estimation |
| Distributed RAM | 176 Kbits - enables small FIFOs, register files, and lookup tables without block RAM usage |
| I/O Pins | 117 user I/O - supports mixed-voltage interfaces across 22 selectable I/O banks |
| Speed Grade | -4 - guarantees 4.6 ns CLB propagation delay for timing-critical paths |
| Supply Voltages | VCCINT = 1.2 V, VCCO = 3.3/2.5 V - enables interfacing with legacy and modern peripherals |
Pinout & Package
XC3S250E-4TQ144I is housed in a 144-pin Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body, and exposed thermal pad. Pinout conforms to Xilinx DS312 v2.5 specification.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1 | PROGRAM_B | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
| P2 | TCK | JTAG test clock input for boundary-scan and debug access |
| P3 | TMS | JTAG test mode select controlling TAP controller state transitions |
| P4 | TDO | JTAG test data output carrying scan-out results during boundary-scan operations |
| P5 | TDI | JTAG test data input feeding instruction and data registers during scan-in |
| P6 | INIT_B | Open-drain status output indicating configuration completion or error condition |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 12 I/O standards (LVCMOS, LVTTL, PCI, SSTL) per bank-enables direct connection to diverse peripheral families without level shifters |
| Dedicated Multipliers | Four 18 × 18-bit signed/unsigned multipliers-accelerates DSP functions like FIR filtering and motor control algorithms |
| Global Clock Resources | Eight low-skew global clock buffers-ensures synchronous timing across large logic regions with minimal skew |
| Boundary-Scan Support | IEEE 1149.1 compliant JTAG interface-provides production-level board testability and in-system programming capability |
Applications
| Industrial PLC I/O Module | Legacy Bus Interface Bridge |
|---|---|
Use Scenario: Replacing ASIC-based digital I/O expansion in programmable logic controllers with field-upgradable logic. IC Role / Device Role / Timing Role: Configurable glue logic and protocol translator handling discrete input sampling, output latching, and Modbus RTU framing. Use Value: Enables firmware-defined I/O behavior and real-time response under 10 µs deterministic latency using distributed RAM and fast carry chains. | Use Scenario: Bridging ISA or PC/104 parallel bus peripherals to modern microcontroller buses. IC Role / Device Role / Timing Role: Synchronous bus protocol converter with address decoding, wait-state insertion, and data-width adaptation. Use Value: Supports 8/16-bit data transfers at up to 8 MHz with programmable setup/hold timing to match legacy peripheral timing margins. |
| Automotive Diagnostic Tool | Medical Sensor Signal Conditioning |
Use Scenario: OBD-II protocol decoder and CAN message filter in handheld diagnostic scanners. IC Role / Device Role / Timing Role: Real-time serial protocol parser with UART receiver/transmitter and CAN physical layer interface logic. Use Value: Processes ISO 9141-2 and SAE J1850 VPW signals with sub-bit timing resolution using dedicated clock dividers and shift registers. | Use Scenario: Analog front-end preprocessing for multi-channel ECG or EEG acquisition systems. IC Role / Device Role / Timing Role: Digital filter engine implementing decimation, baseline wander correction, and R-peak detection logic. Use Value: Achieves 120 dB SNR improvement over raw ADC output using cascaded integrator-comb (CIC) filters implemented in distributed RAM and CLBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4TQ144I | 500K gates, 940 logic cells, same package and speed grade | Higher gate count supports larger state machines and additional IP cores (e.g., UART + SPI + I²C simultaneously) | Select when design requires >480 logic cells or >176 Kbits distributed RAM |
| XC6SLX9-2TQG144C | Spartan-6 architecture, 9152 logic cells, 576 Kbits block RAM, no distributed RAM equivalent | Requires migration to new toolchain (ISE 14.7 → Vivado); lacks dedicated multiplier array but adds PCIe Gen1 endpoint support | Choose for long-term availability and higher integration, accepting toolchain transition effort |
Compared with XC3S250E-4TQ144I, the XC3S500E-4TQ144I offers scalable logic density within identical footprint and timing, while the XC6SLX9-2TQG144C delivers architectural evolution with enhanced memory and interface capabilities at the cost of design migration overhead.
Availability
XC3S250E-4TQ144I is available at Aetrix Electronics and suitable for industrial automation, legacy system modernization, and medical device signal processing requiring stable component supply and long-lifecycle support.
Supply support for XC3S250E-4TQ144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Spartan product lines for industrial and aerospace customers requiring long-term component stability.
The Spartan-3E family was designed for cost-sensitive, high-volume embedded applications where predictable timing, low static power, and mature toolchain support outweigh cutting-edge performance.
FAQ
What is the maximum operating frequency of the XC3S250E-4TQ144I?
The XC3S250E-4TQ144I has a -4 speed grade specifying a 4.6 ns CLB propagation delay. Maximum system clock frequency depends on design topology, but typical synchronous logic paths achieve 150–200 MHz in well-constrained implementations. Critical paths using carry chains or dedicated multipliers may reach 220 MHz with careful placement and routing.
Does the XC3S250E-4TQ144I include internal configuration memory?
No, the XC3S250E-4TQ144I does not contain on-chip nonvolatile configuration memory. It requires external serial PROM (e.g., XCF02S) or microcontroller-driven configuration via JTAG or Master Serial mode at power-up. Configuration bitstream must be reloaded after each power cycle.
Can the XC3S250E-4TQ144I operate with mixed I/O voltages?
Yes, the XC3S250E-4TQ144I supports mixed I/O voltages through 22 independently configurable I/O banks. Each bank can be set to 3.3 V, 2.5 V, or 1.8 V (with appropriate VCCO supply), enabling direct interfacing with multiple peripheral voltage domains without external level shifters.
What JTAG standards does the XC3S250E-4TQ144I support?
The XC3S250E-4TQ144I implements IEEE 1149.1 (JTAG) boundary-scan for device testing and in-system programming. It supports standard instructions including SAMPLE/PRELOAD, EXTEST, INTEST, and BYPASS, and is compatible with Xilinx iMPACT and third-party JTAG tools for configuration and diagnostics.
Is the XC3S250E-4TQ144I RoHS compliant?
Yes, the XC3S250E-4TQ144I is RoHS-6 compliant (lead-free, halogen-free) and meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) requirements. The TQFP package uses matte tin finish and complies with IPC/JEDEC J-STD-033 handling guidelines.
XC3S250E-4TQ144I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 612
- Number of Logic Elements/Cells:
- 5508
- Total RAM Bits:
- 221184
- Number of I/O:
- 108
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S250E-4TQ144I FAQ
1.How can I place an order for XC3S250E-4TQ144I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S250E-4TQ144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S250E-4TQ144I reliable?
The price and inventory of XC3S250E-4TQ144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S250E-4TQ144I is usually 5 days.
3.What payment methods are accepted for XC3S250E-4TQ144I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S250E-4TQ144I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S250E-4TQ144I?
XC3S250E-4TQ144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S250E-4TQ144I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S250E-4TQ144I?
For technical support, including XC3S250E-4TQ144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S250E-4TQ144I requirements.
6.How does Aetrix verify that XC3S250E-4TQ144I is sourced from the original manufacturer or authorized distributors?
All XC3S250E-4TQ144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S250E-4TQ144I meets industry standards.
7.What is the process for return or replacement of XC3S250E-4TQ144I?
All XC3S250E-4TQ144I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S250E-4TQ144I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S250E-4TQ144I part is unused and in its original packaging.
Return procedure for XC3S250E-4TQ144I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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