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AMD XC3S250E-4TQG144C
- Part No.:
- XC3S250E-4TQG144C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 144-LQFP
- Datasheet:
-
XC3S250E-4TQG144C.pdf
- Description:
- IC FPGA 108 I/O 144TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,425
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Product details
Overview
XC3S250E-4TQG144C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250,000 system gates, 576 Kbits of block RAM, and 141 user I/Os in a 144-pin TQFP package. It operates at -4 speed grade (1.13 ns CLB delay), supports 3.3V/2.5V/1.2V I/O standards, and targets low-cost embedded control and interface bridging applications.
For engineers reviewing the XC3S250E-4TQG144C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility, embedded RAM depth, CLB count, configuration mode support (Master Serial, Slave Parallel), and JTAG boundary-scan compliance.
Technical Context
The XC3S250E-4TQG144C implements a configurable logic fabric composed of 5,792 Configurable Logic Blocks (CLBs), each containing two 4-input LUTs and flip-flops. It integrates twelve 18-Kbit block RAMs (total 216 Kbits usable), four Digital Clock Managers (DCMs) for clock synthesis and phase alignment, and supports SelectIO™ technology with programmable drive strength and slew rate.
Configuration is performed via Master Serial (SPI PROM), Slave Parallel, or JTAG modes. The device uses internal 1.2V core voltage with dedicated on-chip voltage regulators and supports IEEE 1149.1 JTAG boundary-scan testing across all I/O banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 5,792 CLBs - provides gate-equivalent capacity for medium-complexity digital controllers and protocol translators. |
| Block RAM | 12 × 18 Kbits = 216 Kbits - enables FIFOs, dual-port buffers, and small lookup tables without external memory. |
| I/O Pins | 141 user I/Os - supports parallel bus interfaces, multi-channel sensor aggregation, and mixed-voltage peripheral connectivity. |
| Speed Grade | -4 (1.13 ns CLB propagation) - defines maximum operating frequency for synchronous logic paths in timing-critical control loops. |
| Configuration Mode | Master Serial, Slave Parallel, JTAG - allows flexible boot sources including SPI flash, host processor, or programming tools. |
| DCM Count | 4 Digital Clock Managers - delivers jitter-reduced clocks, frequency synthesis, and phase shifting for multi-clock domain designs. |
Pinout & Package
XC3S250E-4TQG144C is housed in a 144-pin Thin Quad Flat Pack (TQFP) with 0.5 mm pitch, 20 mm × 20 mm body size, and exposed thermal pad. Package meets JEDEC MS-026 standard and supports reflow soldering per IPC/JEDEC J-STD-020.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated pins per bank ensure stable return paths for I/O and core logic switching currents. |
| VCCO_0 | I/O bank supply | Supplies 3.3V/2.5V/1.8V to Bank 0 I/Os; voltage selected per bank to match connected peripherals. |
| VCCINT | Core logic supply | 1.2V regulated input powering CLBs, DCMs, and interconnect; requires low-noise decoupling. |
| TCK/TMS/TDI/TDO | JTAG interface | IEEE 1149.1-compliant test access port enabling boundary-scan verification and in-system programming. |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness or failure during startup. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated 18-bit multipliers | Four embedded 18×18 multipliers enable real-time arithmetic for motor control algorithms and FIR filtering. |
| SelectIO™ technology | Programmable drive strength (2–24 mA) and slew rate per pin allow noise-optimized signaling for mixed-signal PCB layouts. |
| Digital Clock Manager (DCM) | Each DCM provides 0–250 MHz output range, ±1% duty cycle correction, and 0–360° phase shift for precise timing alignment. |
| Embedded block RAM | Configurable as single-port, dual-port, or FIFO memory with byte-write enable - simplifies data buffering in protocol bridges. |
Applications
| Industrial PLC I/O Module | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Real-time scanning of 32 discrete inputs and driving 16 relay outputs in factory automation cabinets. IC Role / Device Role / Timing Role: FPGA acts as deterministic I/O concentrator with cycle-accurate timing control and isolation barrier management. Use Value: 141 I/Os and 4 DCMs enable synchronized sampling and output update within 100 µs scan cycles. | Use Scenario: Translating between UART-based ECU diagnostics and CAN FD physical layer in service tools. IC Role / Device Role / Timing Role: Protocol bridge implementing ISO 15765-2 framing and bit-timing adaptation for legacy tool compatibility. Use Value: Embedded RAM and multiplier blocks accelerate CAN message assembly and checksum calculation without host CPU load. |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregating analog sensor data from 8 ADC channels and applying real-time digital filtering before USB transmission. IC Role / Device Role / Timing Role: Data preprocessing engine performing decimation, FIR filtering, and packetization in hardware. Use Value: 216 Kbits block RAM stores filter coefficients and intermediate samples; DCMs synchronize ADC sampling clocks. | Use Scenario: Generating high-speed digital stimulus patterns (up to 100 MHz) for IC functional validation. IC Role / Device Role / Timing Role: Deterministic pattern sequencer with precise edge placement and variable-width pulse generation. Use Value: -4 speed grade ensures sub-2 ns timing resolution; CLB routing resources support deep state machines for complex test vectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4PQ208C | Higher density (500K gates), 208-pin PQFP, 182 I/Os, same -4 speed grade and DCM count. | Supports larger state machines and wider parallel buses; requires larger PCB footprint and higher power. | Choose when additional CLBs or I/Os are needed without changing architecture or toolchain. |
| LFE5U-25F-6BG256C | 25K LUTs (vs. 5.8K CLBs), 2.5V core, 196 I/Os, integrated SERDES, different toolchain (Lattice Diamond vs. Xilinx ISE). | Enables PCIe endpoint or Gigabit Ethernet PHY integration; lacks native DCMs but offers PLLs with lower jitter. | Choose for new designs requiring high-speed serial I/O or lower static power; not drop-in compatible. |
Compared with XC3S250E-4TQG144C, XC3S500E-4PQ208C scales logic and I/O while retaining identical configuration flow and timing model, whereas LFE5U-25F-6BG256C shifts to a modern low-power architecture with serial transceivers but requires full design migration.
Availability
XC3S250E-4TQG144C is available at Aetrix Electronics and suitable for industrial control systems, automotive diagnostic tools, and medical sensor interfaces requiring stable component supply over extended production lifecycles.
Supply support for XC3S250E-4TQG144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan family as part of its adaptive computing portfolio for cost-sensitive, high-volume embedded applications.
The Spartan-3E product line was designed specifically for non-volatile, low-power logic replacement in industrial I/O, communication bridges, and real-time control where ASIC development cost and lead time are prohibitive.
FAQ
What is the core voltage requirement for XC3S250E-4TQG144C?
The XC3S250E-4TQG144C requires a regulated 1.2V ±3% supply on the VCCINT pin to power its internal logic fabric and DCMs. This voltage must be well-decoupled with low-ESR ceramic capacitors placed near the pin to maintain signal integrity and prevent configuration failure during high-switching activity.
Does XC3S250E-4TQG144C support JTAG boundary-scan testing?
Yes, XC3S250E-4TQG144C fully complies with IEEE 1149.1 and provides dedicated TCK, TMS, TDI, and TDO pins for boundary-scan testing. This enables automated PCB verification, in-system programming, and fault diagnosis without requiring physical probe access to individual I/O signals.
Can XC3S250E-4TQG144C operate with mixed I/O voltage standards?
Yes, XC3S250E-4TQG144C supports mixed I/O voltages through independent VCCO supplies per bank. Bank 0 can be set to 3.3V while Bank 1 runs at 2.5V, enabling direct interfacing with legacy 3.3V peripherals and modern 2.5V FPGAs or microcontrollers on the same board.
How many Digital Clock Managers does XC3S250E-4TQG144C include?
XC3S250E-4TQG144C integrates four Digital Clock Managers (DCMs). Each DCM provides clock doubling, halving, phase shifting, and duty cycle correction - allowing precise synchronization of multiple clock domains such as ADC sampling, UART baud generation, and display refresh timing within a single XC3S250E-4TQG144C design.
What configuration methods are supported by XC3S250E-4TQG144C?
XC3S250E-4TQG144C supports three configuration modes: Master Serial (using external SPI PROM), Slave Parallel (driven by a microcontroller), and JTAG (for programming and debugging). All modes load the same bitstream format and retain configuration after power cycle when using non-volatile PROM storage.
XC3S250E-4TQG144C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 144-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 612
- Number of Logic Elements/Cells:
- 5508
- Total RAM Bits:
- 221184
- Number of I/O:
- 108
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 144-TQFP (20x20)
XC3S250E-4TQG144C FAQ
1.How can I place an order for XC3S250E-4TQG144C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S250E-4TQG144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S250E-4TQG144C reliable?
The price and inventory of XC3S250E-4TQG144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S250E-4TQG144C is usually 5 days.
3.What payment methods are accepted for XC3S250E-4TQG144C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S250E-4TQG144C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S250E-4TQG144C?
XC3S250E-4TQG144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S250E-4TQG144C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S250E-4TQG144C?
For technical support, including XC3S250E-4TQG144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S250E-4TQG144C requirements.
6.How does Aetrix verify that XC3S250E-4TQG144C is sourced from the original manufacturer or authorized distributors?
All XC3S250E-4TQG144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S250E-4TQG144C meets industry standards.
7.What is the process for return or replacement of XC3S250E-4TQG144C?
All XC3S250E-4TQG144C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S250E-4TQG144C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S250E-4TQG144C part is unused and in its original packaging.
Return procedure for XC3S250E-4TQG144C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC3S250E-4TQG144C Tags
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ICE40UL1K-CM36AI
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10M02DCV36C8G
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LCMXO2-256ZE-1SG32I
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