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AMD XC3S250E-4VQ100C
- Part No.:
- XC3S250E-4VQ100C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 100-TQFP
- Datasheet:
-
XC3S250E-4VQ100C.pdf
- Description:
- IC FPGA 66 I/O 100VQFP
- Quantity:
- Payment:
- Shipping:
Inventory:1,768
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Product details
Overview
XC3S250E-4VQ100C from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250K system gates, 480 logic cells, 128 KB of block RAM, and operates at -4 speed grade in a 100-pin VQFP package. It supports 3.3V I/O, LVCMOS/LVTTL interfaces, and is used in industrial control logic and low-cost embedded interface bridging.
For engineers reviewing the XC3S250E-4VQ100C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O voltage compatibility, block RAM capacity, and VQFP thermal performance for cost-sensitive reconfigurable logic designs.
Technical Context
The XC3S250E-4VQ100C implements a fully SRAM-based configurable logic architecture with dedicated carry chains, distributed RAM, and four global clock networks. It integrates 24 multipliers (18×18), eight digital clock managers (DCMs), and supports SelectIO standards including LVCMOS, LVTTL, PCI, and SSTL-2.
Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device requires external configuration memory and supports in-system programming through JTAG or slave serial interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 480 - provides basic combinational and sequential logic resources for small-to-medium state machines and glue logic. |
| System Gates | 250,000 - indicates total equivalent gate count for logic synthesis estimation and design scaling. |
| Block RAM | 128 KB - enables on-chip data buffering, FIFOs, and small lookup tables without external memory. |
| I/O Pins | 66 user I/O - supports parallel bus interfacing, sensor aggregation, and multi-peripheral control in compact layouts. |
| Speed Grade | -4 - guarantees timing closure up to 333 MHz for internal logic and 100 MHz for I/O in worst-case conditions. |
| Supply Voltage | 1.2 V core / 3.3 V I/O - mandates separate power domains and decoupling for stable operation and signal integrity. |
Pinout & Package
VQFP (Very Thin Quad Flat Package), 100-pin, 0.5 mm pitch, body size 14 × 14 mm, exposed pad not present. RoHS-compliant, lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P1 | PROGRAM_B | Active-low asynchronous reset input that initiates configuration reload from external PROM or JTAG. |
| P2 | TCK | JTAG test clock input for boundary-scan and in-system programming. |
| P3 | TMS | JTAG test mode select controlling TAP controller state transitions. |
| P4 | TDI | JTAG test data input feeding instruction and data registers during programming/debug. |
| P5 | TDO | JTAG test data output providing readback and verification path. |
| P6–P67 | User I/O | Configurable bidirectional pins supporting LVCMOS/LVTTL with programmable slew rate and drive strength. |
| P68–P71 | VCCO_0 | 3.3 V I/O supply for Bank 0, requiring local decoupling near package corner. |
| P72–P75 | GND | Ground reference for Bank 0 I/O and core logic return paths. |
| P76–P83 | VCCINT | 1.2 V core supply distributed across multiple pins to minimize IR drop and noise coupling. |
| P84–P100 | CONFIG_IO | Dedicated configuration pins for Master Serial mode including INIT_B, DONE, CCLK, and D0–D7. |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Managers (DCMs) | Eight DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication/division for synchronous system timing. |
| SelectIO Technology | Supports mixed-voltage I/O banks enabling direct interfacing with 3.3 V, 2.5 V, and 1.8 V peripherals without level shifters. |
| Embedded Multipliers | 24 × 18-bit multipliers enable real-time arithmetic for motor control loops and simple DSP functions. |
| Configuration Security | Bitstream encryption option prevents unauthorized cloning or reverse engineering of implemented logic design. |
Applications
| Industrial PLC I/O Expansion | Automotive Diagnostic Interface |
|---|---|
Use Scenario: Adding isolated digital input/output channels to legacy PLC backplanes using field-wireable terminals. IC Role / Device Role / Timing Role: Configurable logic unit implementing debounce, edge detection, and protocol translation between Modbus RTU and local sensor buses. Use Value: Reduces BOM count by replacing discrete logic ICs and eliminates need for external level-shifting components due to flexible I/O voltage support. | Use Scenario: Translating proprietary OEM diagnostic protocols to standardized UDS over CAN physical layer in service tools. IC Role / Device Role / Timing Role: Protocol bridge FPGA handling UART-to-CAN message framing, checksum generation, and timing-critical response windows. Use Value: Enables deterministic sub-100 µs latency for diagnostic command execution using dedicated DCM-controlled timing paths. |
| Medical Sensor Hub | Test Equipment Pattern Generator |
Use Scenario: Aggregating analog front-end outputs from ECG, SpO₂, and temperature sensors into a unified digital stream for microcontroller ingestion. IC Role / Device Role / Timing Role: Synchronized data multiplexer with sample alignment and timestamp tagging using internal block RAM buffers. Use Value: Achieves precise 125 µs inter-channel sampling skew control via dedicated carry-chain routing and DCM-synchronized clocks. | Use Scenario: Generating high-fidelity digital stimulus waveforms for IC functional validation in ATE systems. IC Role / Device Role / Timing Role: High-speed pattern sequencer driving parallel 32-bit vectors at 100 MHz with deterministic setup/hold margins. Use Value: Delivers <1 ns jitter on output edges using DCM-based clock deskewing and dedicated I/O delay calibration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC3S500E-4VQ100C | 500K gates, 960 logic cells, 256 KB block RAM - higher density and memory but same package and speed grade. | Supports larger state machines and deeper FIFOs; suitable when design scales beyond XC3S250E capacity. | Select if future-proofing for logic growth is required without PCB redesign. |
| LFE5U-25F-6BG256C | 25K LUTs, 1.2 V core, 1.8/3.3 V I/O, flash-based nonvolatile configuration - eliminates external PROM dependency. | Reduces bill-of-materials and boot time; preferred where single-chip reliability and instant-on behavior are critical. | Choose for applications needing zero-configuration startup and lower system-level power during standby. |
Compared with XC3S250E-4VQ100C, the XC3S500E-4VQ100C offers scalable logic headroom in identical packaging, while the LFE5U-25F-6BG256C trades SRAM volatility for flash integration and lower static power-making it preferable for unattended or safety-monitored deployments.
Availability
XC3S250E-4VQ100C is available at Aetrix Electronics and suitable for industrial control, medical sensor aggregation, and automotive diagnostic interface applications requiring stable component supply and long-term manufacturability.
Supply support for XC3S250E-4VQ100C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for heterogeneous compute acceleration.
The Spartan-3E family was originally designed by Xilinx for cost-optimized, high-volume embedded logic replacement-targeting industrial automation, consumer electronics, and communications infrastructure where gate count and I/O flexibility outweigh advanced features like hard IP or high-speed transceivers.
FAQ
What is the maximum operating frequency of the XC3S250E-4VQ100C?
The XC3S250E-4VQ100C has a -4 speed grade, guaranteeing internal logic timing closure up to 333 MHz and I/O timing up to 100 MHz under worst-case voltage and temperature conditions. Actual achievable frequency depends on design placement, routing, and clock domain constraints-not just datasheet limits.
Does the XC3S250E-4VQ100C require an external configuration PROM?
Yes, the XC3S250E-4VQ100C is SRAM-based and requires external nonvolatile memory (e.g., XCF02S or compatible SPI PROM) for automatic configuration at power-up. It supports Master Serial, Slave Serial, and JTAG modes-but no on-chip flash or OTP storage.
Can the XC3S250E-4VQ100C operate with 2.5 V I/O voltage?
No-the XC3S250E-4VQ100C supports only 3.3 V and 1.8 V I/O standards per bank. It does not support 2.5 V signaling. Using 2.5 V signals risks violating VIH/VIL thresholds and may cause unreliable operation or damage if driven above absolute maximum ratings.
How many Digital Clock Managers (DCMs) does the XC3S250E-4VQ100C include?
The XC3S250E-4VQ100C includes eight Digital Clock Managers (DCMs). Each DCM provides independent clock synthesis, phase shifting, duty cycle correction, and frequency multiplication/division-enabling precise timing control across multiple clock domains within the same design.
Is the XC3S250E-4VQ100C RoHS compliant?
Yes, the XC3S250E-4VQ100C is RoHS compliant and manufactured with lead-free finish. Its VQFP package meets EU Directive 2011/65/EU requirements, and material declarations are available in AMD's official product change notifications and compliance documentation.
XC3S250E-4VQ100C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-3E
- Package/Case:
- 100-TQFP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 612
- Number of Logic Elements/Cells:
- 5508
- Total RAM Bits:
- 221184
- Number of I/O:
- 66
- Number of Gates:
- 250000
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 100-VQFP (14x14)
XC3S250E-4VQ100C FAQ
1.How can I place an order for XC3S250E-4VQ100C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC3S250E-4VQ100C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC3S250E-4VQ100C reliable?
The price and inventory of XC3S250E-4VQ100C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S250E-4VQ100C is usually 5 days.
3.What payment methods are accepted for XC3S250E-4VQ100C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S250E-4VQ100C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC3S250E-4VQ100C?
XC3S250E-4VQ100C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC3S250E-4VQ100C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC3S250E-4VQ100C?
For technical support, including XC3S250E-4VQ100C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S250E-4VQ100C requirements.
6.How does Aetrix verify that XC3S250E-4VQ100C is sourced from the original manufacturer or authorized distributors?
All XC3S250E-4VQ100C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S250E-4VQ100C meets industry standards.
7.What is the process for return or replacement of XC3S250E-4VQ100C?
All XC3S250E-4VQ100C units undergo pre-shipment inspection (PSI). If there is an issue with XC3S250E-4VQ100C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC3S250E-4VQ100C part is unused and in its original packaging.
Return procedure for XC3S250E-4VQ100C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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