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AMD XC3S250E-4VQ100I

Part No.:
XC3S250E-4VQ100I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
100-TQFP
Datasheet:
AetrixXC3S250E-4VQ100I.pdf
Description:
IC FPGA 66 I/O 100VQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,671

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Product details

Overview

XC3S250E-4VQ100I from AMD (formerly Xilinx) is a Spartan-3E FPGA with 250K system gates, 472 logic cells, 128 KB of total block RAM, and operates at -4 speed grade in a 100-pin VQFP package. It supports LVCMOS25/LVCMOS33 I/O standards and targets low-cost embedded control and interface bridging applications.

For engineers reviewing the XC3S250E-4VQ100I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O voltage flexibility, embedded RAM capacity, and industrial temperature range support.

Technical Context

The XC3S250E-4VQ100I implements a configurable logic fabric based on 4-input LUTs and distributed RAM, with dedicated carry logic for arithmetic. It integrates twelve 18×18 multipliers and four Digital Clock Managers (DCMs) supporting frequency synthesis, phase shifting, and duty cycle correction.

Configuration is performed via Master Serial mode using external PROM or JTAG boundary-scan. The device supports SelectIO™ technology with programmable drive strength, slew rate, and input termination across all I/O banks.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells472 - defines maximum combinational/sequential logic capacity per design
System Gates250,000 - indicates relative ASIC-equivalent gate count for logic density estimation
Block RAM128 KB - supports FIFOs, buffers, or small lookup tables without external memory
DCMs4 - enables clock domain crossing, jitter reduction, and internal clock generation
I/O StandardsLVCMOS25/LVCMOS33 - allows direct interfacing with common microcontrollers and peripherals
Operating Temp-40°C to +100°C - qualified for industrial environment deployment
Speed Grade-4 - specifies worst-case propagation delay timing margin for timing closure

Pinout & Package

VQ100 (100-pin Very Thin Quad Flat Pack), 14 × 14 mm body, 0.5 mm pitch, thermally enhanced plastic package with exposed pad. Compatible with standard reflow profiles and IPC-compliant PCB layout.

Pin/TerminalCircuit RoleDesign Meaning
P5CONFIG_DONEOpen-drain status signal indicating successful configuration completion
R2PROGRAM_BActive-low input that initiates FPGA reconfiguration and clears configuration memory
T3CCLKConfiguration clock input used during Master Serial PROM loading
U1DONEOutput confirming configuration bitstream integrity and initialization readiness
V2INIT_BOpen-drain output reflecting internal initialization status during power-up

Key Features

FeatureDesign Value
Dedicated MultipliersTwelve 18×18-bit signed/unsigned multipliers enable real-time DSP functions without LUT resource overhead
SelectIO™ TechnologyPer-bank I/O voltage and standard selection supports mixed-voltage board designs and legacy interface compatibility
Digital Clock Manager (DCM)Four DCMs provide deterministic clock deskew, frequency synthesis, and jitter filtering for synchronous system timing
Embedded Block RAM128 KB distributed across 32 blocks allows dual-port memory access and true dual-clock operation per block
JTAG Boundary ScanIEEE 1149.1-compliant test access port enables in-system programming and board-level diagnostics

Applications

Industrial PLC I/O ModuleAutomotive Diagnostic Interface

Use Scenario: Real-time digital I/O conditioning and protocol translation between field sensors and controller bus.

IC Role / Device Role / Timing Role: Configurable logic fabric handles GPIO expansion, pulse-width modulation, and SPI-to-parallel bridging.

Use Value: Enables single-chip replacement of discrete glue logic and reduces BOM count in modular control hardware.

Use Scenario: Translating ISO 9141-2 and UDS protocols between vehicle ECUs and service tools.

IC Role / Device Role / Timing Role: FPGA implements bidirectional serial protocol state machines and timing-critical response windows.

Use Value: Supports multiple legacy and modern automotive diagnostic standards without firmware update dependency.

Medical Sensor HubTest Equipment Pattern Generator

Use Scenario: Aggregating and preprocessing analog/digital signals from ECG, SpO₂, and temperature sensors.

IC Role / Device Role / Timing Role: Performs oversampling, digital filtering, and data packetization prior to MCU transfer.

Use Value: Offloads time-sensitive signal processing from host processor and improves system responsiveness.

Use Scenario: Generating high-fidelity, synchronized stimulus waveforms for IC functional validation.

IC Role / Device Role / Timing Role: Implements precise timing engines and pattern sequencers with sub-cycle resolution.

Use Value: Delivers deterministic waveform timing and eliminates external pattern memory bottlenecks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC3S500E-4VQ100IHigher logic density (944 LCs), same package and speed gradeSupports larger state machines and more complex peripheral interfacesChoose when design requires >472 logic cells but must retain identical footprint and thermal profile
XC6SLX9-2TQG144CNext-generation Spartan-6 architecture, 9152 logic cells, TQFP-144 packageIncludes integrated PCIe endpoint, higher RAM, and improved DCM featuresConsider for new designs needing extended lifecycle, lower static power, or enhanced clocking capabilities

Compared with XC3S250E-4VQ100I, the XC3S500E-4VQ100I offers scalable logic capacity within identical mechanical and thermal constraints, while the XC6SLX9-2TQG144C provides architectural upgrades including hardened I/O features and longer-term supply assurance-both require PCB layout revision.

Availability

XC3S250E-4VQ100I is available at Aetrix Electronics and suitable for industrial control, automotive diagnostics, and medical sensor aggregation requiring stable component supply across extended production cycles.

Supply support for XC3S250E-4VQ100I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.

The Spartan-3E family was designed by Xilinx to deliver cost-optimized, high-performance programmable logic for high-volume industrial and consumer applications with constrained power and space budgets.

FAQ

What is the maximum operating frequency of the XC3S250E-4VQ100I?

The XC3S250E-4VQ100I has a -4 speed grade, meaning its worst-case internal clock frequency is 315 MHz for register-to-register paths under industrial temperature conditions. Actual achievable frequency depends on design routing, logic depth, and I/O timing constraints. The XC3S250E-4VQ100I datasheet specifies timing parameters for CLB, DCM, and I/O paths separately.

Does the XC3S250E-4VQ100I support JTAG programming?

Yes, the XC3S250E-4VQ100I fully supports IEEE 1149.1 JTAG boundary-scan for configuration, debugging, and in-system programming. Pins TCK, TMS, TDI, and TDO are assigned to dedicated JTAG pins, and the XC3S250E-4VQ100I can be programmed via JTAG without external PROM. This capability is documented in the Xilinx Spartan-3E Configuration User Guide.

What I/O standards are supported by the XC3S250E-4VQ100I?

The XC3S250E-4VQ100I supports LVCMOS25 and LVCMOS33 I/O standards across all banks, with programmable drive strength (2–24 mA), slew rate control, and input termination. It does not support differential standards like LVDS or RSDS. These I/O characteristics are confirmed in the XC3S250E-4VQ100I DC and Switching Characteristics datasheet table.

Is the XC3S250E-4VQ100I qualified for industrial temperature range?

Yes, the XC3S250E-4VQ100I is rated for operation from -40°C to +100°C ambient temperature and is marked with the 'I' suffix denoting industrial qualification. This rating applies to the full speed grade (-4) and package (VQ100), as specified in the Xilinx Spartan-3E Data Sheet DS312.

How much embedded RAM does the XC3S250E-4VQ100I provide?

The XC3S250E-4VQ100I contains 128 KB of total block RAM, organized as thirty-two 4-Kbit blocks. Each block supports synchronous read/write, dual-port access, and independent clock domains. This RAM capacity is fixed and cannot be increased via distributed RAM resources-the XC3S250E-4VQ100I datasheet confirms this allocation in the memory resources summary.

XC3S250E-4VQ100I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-3E
Package/Case:
100-TQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
612
Number of Logic Elements/Cells:
5508
Total RAM Bits:
221184
Number of I/O:
66
Number of Gates:
250000
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
100-VQFP (14x14)

XC3S250E-4VQ100I FAQ

1.How can I place an order for XC3S250E-4VQ100I through Aetrix?

Please submit a Request for Quotation (RFQ) for XC3S250E-4VQ100I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC3S250E-4VQ100I reliable?

The price and inventory of XC3S250E-4VQ100I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC3S250E-4VQ100I is usually 5 days.

3.What payment methods are accepted for XC3S250E-4VQ100I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC3S250E-4VQ100I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC3S250E-4VQ100I?

XC3S250E-4VQ100I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC3S250E-4VQ100I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC3S250E-4VQ100I?

For technical support, including XC3S250E-4VQ100I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC3S250E-4VQ100I requirements.

6.How does Aetrix verify that XC3S250E-4VQ100I is sourced from the original manufacturer or authorized distributors?

All XC3S250E-4VQ100I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC3S250E-4VQ100I meets industry standards.

7.What is the process for return or replacement of XC3S250E-4VQ100I?

All XC3S250E-4VQ100I units undergo pre-shipment inspection (PSI). If there is an issue with XC3S250E-4VQ100I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC3S250E-4VQ100I part is unused and in its original packaging.

Return procedure for XC3S250E-4VQ100I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC3S250E-4VQ100I Tags

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